Role listed
Faraday Semi, A Tdk Company
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Fernando Chen Email & Phone Number
Vice President of Operations at Faraday Semi, a TDK Company
at
Faraday Semi, a TDK Company
1 work email found
@microchip.com
1 phone found area 208
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Faraday Semi, a TDK Company
Role
Vice President of Operations at Faraday Semi, a TDK Company
Location
Chandler, Arizona, United States
Who is Fernando Chen? Overview
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Quick answer
Fernando Chen is listed as Vice President of Operations at Faraday Semi, a TDK Company at Faraday Semi, a TDK Company, based in Chandler, Arizona, United States. AeroLeads shows a work email signal at microchip.com, phone signal with area code 208, and a matched LinkedIn profile for Fernando Chen.
Fernando Chen previously worked as Vice President Operations at Faraday Semi, A Tdk Company and Assembly & Packaging Engineering at Compound Photonics. Fernando Chen holds Bsme from The University Of Texas At Austin.
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Email format at Faraday Semi, a TDK Company
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{first}.{last}@microchip.com
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AeroLeads found 1 current-domain work email signal for Fernando Chen. Compare company email patterns before reaching out.
Profile bio
About Fernando Chen
Specialties: Business Unit Management, Product Management , IC Packaging Engineering, Assembly & Test Operations Management
Listed skills include Six Sigma, Semiconductors, Design Of Experiments, Product Engineering, and 35 others.
Current workplace
Fernando Chen's current company
Company context helps verify the profile and gives searchers a useful next step.
Faraday Semi, A Tdk Company
9 roles · 32 years
Fernando Chen work experience
A career timeline built from the work history available for this profile.
Vice President Operations
Current
Faraday Semi, A Tdk Company
Nov 2020 - Present
Assembly & Packaging Engineering
Module integration of LCoS micro-display and SiP package - Package design - Backend process and materials development * Fine pitch flip-chip pick & place attach * Precision LCoS die attach * Low temperature wirebond * Low stress wirebond encapsulation * ACF bonding * MuF SiP moldAssembly and substrate supplier developmentSiP package development
2018 - 2020
~2 yrs
Ic Packaging Engineering & Management
* Oversaw the centralized packaging engineering group that supported all business units. Managed a staff of 35 that included packaging engineering managers, assembly & packaging engineers, and assembly prototype lab.* Instituted package development discipline that comprehended die geometry optimization, chip-package interactions, signal/power integrity.
2013 - 2017
~4 yrs
Business Unit Management
* Promoted STATS ChipPAC's wirebond package technologies.* Created marketing collateral relating to Wirebond capabilities and applications.* Drove new package and material/process development to intercept emerging applications that included SMS-FBGA, Side-Solderable QFN, Multi-Row QFN, and Cu/Ag-Alloy Wire.
2010 - 2013
~3 yrs
Product Line Management
2007 - 2010
~3 yrs
Osats Marketing & Field Applications Engineering
* Established the Phoenix regional office and managed the team that included field applications engineering, sales, and customer service. Grew regional revenue to over $100 million within 4-year period.* Defined marketing and business strategies that supported corporate objectives in revenue, market share growth, profitability, and customer/product.
2003 - 2007
~4 yrs
Assembly Engineering
Legerity
* Established the packaging engineering group after AMD spin-off.* Led the packaging engineering team in new package development and subcontractor management.* Responsible for assembly RFQ and supplier sourcing.
1999 - 2002
~3 yrs
Semiconductor Assembly Process Engineering
Motorola - Semiconductor Products Sector
* Responsible for assembly process sustaining that included Die Attach, Wire Bond, Transfer Molding, and DTFS.* Characterized and qualified new packages for mass production.* Developed SPC, process FMEA, Control Plan, and OCAP.
1994 - 1998
~4 yrs
3 education records
Fernando Chen education
Bsme
The University Of Texas At Austin
Msme, Microelectronics Packaging
Southern Methodist University
Mba
St.Edward'S University
FAQ
Frequently asked questions about Fernando Chen
Quick answers generated from the profile data available on this page.
What company does Fernando Chen work for?
Fernando Chen works for Faraday Semi, a TDK Company.
What is Fernando Chen's role at Faraday Semi, a TDK Company?
Fernando Chen is listed as Vice President of Operations at Faraday Semi, a TDK Company at Faraday Semi, a TDK Company.
What is Fernando Chen's email address?
AeroLeads has found 1 work email signal at @microchip.com for Fernando Chen at Faraday Semi, a TDK Company.
What is Fernando Chen's phone number?
AeroLeads has found 1 phone signal(s) with area code 208 for Fernando Chen at Faraday Semi, a TDK Company.
Where is Fernando Chen based?
Fernando Chen is based in Chandler, Arizona, United States while working with Faraday Semi, a TDK Company.
What companies has Fernando Chen worked for?
Fernando Chen has worked for Faraday Semi, A Tdk Company, Compound Photonics, Microchip Technology Inc., Stats Chippac, and Amkor Technology.
How can I contact Fernando Chen?
You can use AeroLeads to view verified contact signals for Fernando Chen at Faraday Semi, a TDK Company, including work email, phone, and LinkedIn data when available.
What schools did Fernando Chen attend?
Fernando Chen holds Bsme from The University Of Texas At Austin.
What skills is Fernando Chen known for?
Fernando Chen is listed with skills including Six Sigma, Semiconductors, Design Of Experiments, Product Engineering, Ic, Lean Manufacturing, Engineering Management, and Continuous Improvement.
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