Vice President Worldwide Automotive Solutions
CurrentManage global automotive engagements for Innovusion's exceptional LiDAR solutions.
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@innovusion.com
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2 phones found area 510
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Bill Fleck is listed as Vice President Worldwide Automotive Solutions at Innovusion at Innovusion, based in Portland, Oregon, United States. AeroLeads shows a work email signal at innovusion.com, phone signal with area code 510, and a matched LinkedIn profile for Bill Fleck.
Bill Fleck previously worked as Vice President Worldwide Automotive Solutions at Innovusion and Vice President of Automotive, Americas at Gracenote. Bill Fleck holds Bachelors, Electrical Engineering from Uc San Diego.
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Sales, business development & product marketing in the high tech sector. I have spent equal time in each discipline, with a strong, recent focus on automotive telematics and infotainment systems, both domestically and overseas. Prior to my experience in automotive, I focused on embedded microprocessors, IC design and PCB layout technologies.Specialties: Emerging Market Technologies, Automotive Telematics, Automotive Infotainment/Entertainment Market, Digital Music Services, Music Management, Embedded Microprocessor Technologies.
Listed skills include Product Management, Sales Management, New Business Development, Product Strategy, and 9 others.
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Manage global automotive engagements for Innovusion's exceptional LiDAR solutions.
Managed direct sales to all North American automotive OEMS and Tier Ones. Coordinated cross-regional automotive engagements in Europe, Japan, Korea, India and China with our sales, technical support, and marketing teams to help achieve deployment of Gracenote solutions in over 250 million vehicles, making Gracenote the #1 supplier of metadata solutions in.
Developed the requirements and managed the introduction of the successful MPC5200 PowerPC processor into the automotive telematics and consumer markets. Quickly secured strategic cross-market wins in North America, Europe, and Asia. Market lead on the “transumer” team responsible for defining system and chip-level product strategy to bridge the automotive.
Sales of CAE software, custom IC development tools and computer platforms.
Managed multiple product engineers responsible for HP’s microprocessor emulators, debuggers, simulators, and CASE products.
Responsible for HP’s line of embedded processor emulators and related third-party relationships. Pioneered next-generation, PC-based 32-bit processor emulation support.
Sales of the aforementioned products, in addition to HP's electronic instrumentation product line. Additionally served as area sales and technical expert on HP's logic and communication/protocol analysis products.
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Bill Fleck works for Innovusion.
Bill Fleck is listed as Vice President Worldwide Automotive Solutions at Innovusion at Innovusion.
AeroLeads has found 1 work email signal at @innovusion.com for Bill Fleck at Innovusion.
AeroLeads has found 2 phone signal(s) with area code 510 for Bill Fleck at Innovusion.
Bill Fleck is based in Portland, Oregon, United States while working with Innovusion.
Bill Fleck has worked for Innovusion, Gracenote, Motorola Freescale Semiconductor, Synopsys, and Mentor Graphics.
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Bill Fleck holds Bachelors, Electrical Engineering from Uc San Diego.
Bill Fleck is listed with skills including Product Management, Sales Management, New Business Development, Product Strategy, Product Marketing, Strategic Partnerships, Telematics, and Competitive Analysis.
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