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Goal: To success in career, gain more knowledge, skills, experiences and further self improvement.-Execute reliability stress and conducts statistical data analysis to provide effective reliability reports for product qualifications, customer complaint, production material reviews boards (MRB) and cost saving projects to cross functional teams.-Coordinate in Part Production Approval Process (PPAP) ,Shipment Judgment Meeting (SJM), New Product Qualification -Skill / Equipment :To evaluate new materials by perform reliability or approval check item such as Solderability, Reflow Solderability, Zero Cross Time Check, measurement on Plating Thickness and Composition, Product measurement by profile projector or STM measuring scope, Shear Strength measurement, Cross Section, SEM & EDX method, reflow planarity and retention force measurementACHIEVEMENT2009 • Super capacitor Using Carbon Electrode From Oil Palm Empty Fruit Bunches (OPEFB)–Award from MASS (The Malaysian Solid State Science & Technology Society).2010• Copper Expose Problem Elimination –Tebim Award from Renesas Semiconductor (Malaysia) Sdn. Bhd2011• Mark Improvement Process –Tebim Award from Renesas Semiconductor (Malaysia) Sdn. Bhd• ED-LH Capacity Up for HF Resin (UFP-HF)–Tebim Award from Renesas Semiconductor (Malaysia) Sdn. Bhd• Introduction URP-4L New Package in MOL Process–Tebim Award from Renesas Semiconductor (Malaysia) Sdn. Bhd