Report to: Focus Factory ManagerSubordinate (dot line report): 12 contract plant employeesJob Responsibilities:1. Manage sub-contractor production, engineering & process, equipment maintenance departments, and lead them to support 3M display materials and systems division Dongguan plant for both new product & process development project and mass production operation2. Introduce new product with lab-PD team base on business demand and forecast (NPI)3. Lead drawing team and communicate with customer for sample design issues (DFM), Visit customer and understand VOC for product design and quality (balance product requirement and process capacity base on FFU)4. Develop new machine, die, fixture, material and robust parameter for new process. Maintain machines and deploy automation project to reduce headcount5. Cost saving by introduce lower cost sub-material and increase process yield6. Business transformation support about SAP BOM, routing and MES preparing7. New contract manufacturer introduction and setup for engineering, machines relocation, installation and commissioning, productionAchievements:1. Introduce new products BEF RP2 RZn, BEF4-DMH, DBEF5 from kick off, trial run, sample gate review, product release report gate review, mass production to close. Develop specific die to improve chaparral coating material burr issue and decrease customer complaint from 2000 ppm to 300 ppm2. Develop angle cut-splicing process for big bias reel format product. Increase 20% material design yield3. Eliminate ESR-PT4 reel format product 1% wrinkle issue by change the unwinding direction4. Reduce 20 inspectors by introduce vision system smart converting5. Introduced vertical winder process and decrease reel format product 2012 first defect impression return rate from 1.39% to 0.88%6. Led reel format product 2011 first defect poor cut improvement and decrease customer complaint from 1100 ppm to 600 ppm and decrease in process loss from 8300 ppm to 800ppm

Report to: Production ManagerSubordinate: 1 technicianJob Responsibility:1. Take charge of semiconductor packaging processes about molding, deflash, plating and laser marking2. Concentrate on cost saving, output promotion, quality continuous improvement (SPC monitoring, yield improvement)3. Establish equipment maintenance procedure and plan. Train technician to maintain machine on the right way. Spare part purchase arrangement and management and make sure production requirement under low inventory4. Safety evaluation for chemical, mechanical moving part, high temperature, high pressure water and noise. Take actions to eliminate risk with EHS team5. Change management, and buy-off new machine and qualify new material (DOE for new machine and material)6. Update documents for quality system, such as P-FMEA, CP, OCAP, and PM WI for operation and WI for IPC. Prepare for customer audit7. Train and certify new technicians and operatorsAchievements:1. Get STS best suggestion 3 gold awards and 1 silver award2. Promote ED-Plating 12% output capacity, cut down 12% cost of material(about 10K USD/Year) and also increase thickness Cpk from 1.8 to 2.53. Decrease first molding defect void from 2500 ppm to 1000 ppm by optimize transfer parameter (DOE)

Report to: Manufacturing Engineering ManagerJob Responsibility:PTH/PPTH copper plating process maintenance, Cost saving, Output Promotion, Quality improvement, ISO9000 and TS16949 system document revision and auditAchievements:1. Promote 18% output by optimizing production program2. Save 30000 RMB per month by using material adequately3. Monitor and make sure process Cpk above 2.0