Responsible To Provide Technical Assistance, Theory And Hands-On, For The Different Process Steps Within A PCBA, Semiconductor, Led And Solar Manufacturing Process: Sintering, Printing, Reflow, Wave Solder, Induction, Selective Soldering, BGA Repair, Robot Soldering, Etc.Support On New Process Implementation/Development.Responsible To Support Customer Soldering Related Material Qualifications.Support R&D For New Material DevelopmentDesign For Manufacturability.Failure Analysis.Process Assessment.Provide Technical Training.Area Of Responsibility Is Any Customer With Manufacturing Or Development Site In Mexico, Central America And Caribbean Area , OEM Or EMS With Any Soldering And Or Sintering Manufacturing Applications Within A Variety Of Sectors Such Semiconductor, Led, Electrical/Electromechanical Components, PCBA Assembly And Solar Assembly Industries.

Lead Efforts In Concurrent Engineering To Ensure DFX Engineering Requirements Are Identified In The R&D / NPI Steps, And Implemented Early In Order To Optimize Margins Of Products By Avoiding Cost Prior To Introduction Into ManufacturingActive Participation With R&D And NPI Customer Organizations To Identify And Assure Manufacturability Opportunities Are Implemented.Responsible For Define And Document The Manufacturability Design Guidelines.Failure Analysis; Continues Improvement; Quality Metrics Follow Up; Process, PCB & Component Troubleshooting. Technical Resource To Handle Manufacturing Technology Issues Related To Design And Manufacturability ImprovementsProcess, Component And PCB Consultant Across The Organization.Responsible, Support And Implement Lead Free Process Development And Qualification: Equipment, Materials And Manufacturing Processes.Lead And Lead-Free Soldering Expert, All Soldering Processes, Responsible For Soldering Material & Equipment Selection And Qualification.New Process And Equipment Capability Implementation And Developing Process Component Second Source Qualifications, Internal And Customer: PCB, Electrical And Mechanical. (PCN Impact Analysis)Responsible For DFM Tool Set: Review Manufacturability Of The PCB DesignsUsing The Trilogy 5000 DFM Toolset From Valor.Lead Technical Discussions Between Design And Manufacturing To Ensure All DFX Issues Are Identified Document And Implement Manufacturing Recommendations Into New Designs And Sustaining Products.Technical Resource FA, Problem Solving And Continuous Improvement.Technical Resource To Drive Technological Advancements And Process Development For Electronic Assembly Equipment Tools, Materials, Components, PCBs.Member Of The Company Manufacturing & Equipment Technology Council.

(Scientific Atlanta a Cisco Company)Lead Efforts In Concurrent Engineering To Ensure DFX Engineering Requirements Are Identified In The R&D / NPI Steps, And Implemented Early In Order To Optimize Margins Of Products By Avoiding Cost Prior To Introduction Into ManufacturingActive Participation With R&D And NPI Customer Organizations To Identify And Assure Manufacturability Opportunities Are Implemented.Responsible For Define And Document The Manufacturability Design Guidelines.Failure Analysis; Continues Improvement; Quality Metrics Follow Up; Process, PCB & Component Troubleshooting. Technical Resource To Handle Manufacturing Technology Issues Related To Design And Manufacturability ImprovementsProcess, Component And PCB Consultant Across The Organization.Responsible, Support And Implement Lead Free Process Development And Qualification: Equipment, Materials And Manufacturing Processes.Lead And Lead-Free Soldering Expert, All Soldering Processes, Responsible For Soldering Material & Equipment Selection And Qualification.New Process And Equipment Capability Implementation And Developing Process Component Second Source Qualifications, Internal And Customer: PCB, Electrical And Mechanical. (PCN Impact Analysis)Responsible For DFM Tool Set: Review Manufacturability Of The PCB DesignsUsing The Trilogy 5000 DFM Toolset From Valor.Lead Technical Discussions Between Design And Manufacturing To Ensure All DFX Issues Are Identified Document And Implement Manufacturing Recommendations Into New Designs And Sustaining Products.Technical Resource FA, Problem Solving And Continuous Improvement.Technical Resource To Drive Technological Advancements And Process Development For Electronic Assembly Equipment Tools, Materials, Components, PCBs.Member Of The Company Manufacturing & Equipment Technology Council.

Define Parameters For Screen Printers, Chip Shooters, Pick & Place, Axial AndRadial Inserters, Glue Dispensers, Wave Solders, Rework Stations, And So.Establish Guidelines For Stencil Design.Sn63 Solders Paste Evaluation For Manufacturing Sites.Definition And Documentation Of The SMT Process.Standard Time, Lay Out. Line Configuration For NPI.SMT Line Capacity Studies.Improve Yield And DPMO’s By Continuous Process Improvement.Standardize And Improve Reflow Oven Profiles On 2 Up To 32 Layers Boars With IWT ImAg, HASL, And ENIG FinishQualify Cleaning Chemicals And Processes.Support The Introduction Of The New Models At Smt.Develop The PFMEA And Control Plan For The SMT Process.SMT Process Troubleshooting. (Chip Bonder Dispensing, Solder Paste Printing, Reflow And Curing Oven Profiles, ESD Control, Stencil Designs, Solderabiliy, Equipment, Wave Solder, Components, Process, Finishes, Etc.)Evaluate And Implement 0402 Components And Double Sided Reflow.Qualification Of New SMT Process & Technologies.Develop And Perform Training Modules For Supervisors, Technicians AndOperators, Related To SMT Process (Screen Printing, Component Placement,Reflow, Auto Insertion On PTH, Dispensing, Curing, Acceptance Criteria,Rework, ESD).

(Optek Technology)Responsible Of The SMT Area (Process & Maintenance).Implement, The New Models (BOM, Part List, Programs, Set Up List, Trial AndPilot Run, Capability Of The Area, Golden Samples,… Etc.).Developing Process And Operating Instructions. Control Plan, PFMEA, Flow..(Process Definition And Documentation). Developing Program Patterns For Cam/Alot 2800 Glue Dispensing Machines.Developing Programs For The Philips Topaz Pick And Place Machines.Developing Software For DEK 265 Lt Paste Printing Machines.Improving And Resolving Quality And Perform Problems (Adhesion Force For SMD Components, Solder Paste, Glue Dots, Reflow And Curing Oven Profiles, ESD Control…).Responsible For The Preventive And Corrective Maintenance Of The SMT Area.Dek 265lt Printer Machines, Philips Topaz Pick And Place Machines, Cam/Alot2800 Dispensing Machines, Polysmt 318 Pcb Washer Machines, Nutek PcbHandlers, Austin Technology Stencil Cleaner Machine, Conceptronic Curing/Reflow Ovens.

Responsible Of Implement, The New Models From Taiwan In The ACI And SMD Areas In Juárez. (BOM, Part List, Programs, Set Up List, Hardware Requirements, Initial Cost, Trial And Pilot Run, Capability Of The Area, Golden Samples,) Developing Process And Operating Instructions (Process Definition And Documentation).Developing Of Universal Auto Insertion Programs; For Sequencers, VCV’s And Radial Machines (PPU Software).Developing Fuji Programs For CP III And GL Ii (MCS/2 V1.30)Developing The Philips Programs For FCM Base I (Fast Component Mounter) On PPS Software 3.0.Improving And Resolving Quality And Perform Problems (Monitoring Adhesion Force For SMD Components, Glue Dots, Reflow Ovens, ESD Control…).Working To Decrease The Fall Of Rate, On ACI/SMD And Manual Assembly Lines.Support To The Production And Maintenance Teams (Technicians And Engineers).Improving And Developing Production Tools (Fixtures, Visual Aids, Golden Samples, Set Up Sheets, And Others)Responsible For The Implementation Of Engineering Changes Notifications; On The ACI/SMD Area.; & Implementation Of Corrective Actions.