François Ostermann Email & Phone Number
Who is François Ostermann? Overview
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François Ostermann is listed as Embedded Firmware Engineer at Sauter, a company with 583 employees, based in Basel Metropolitan Area, Switzerland, Switzerland. AeroLeads shows a matched LinkedIn profile for François Ostermann.
François Ostermann previously worked as Embedded Firmware Entwickler at Sauter and Head of Firmware R&D Team Saint-Louis at Diehl Metering. François Ostermann holds Master Degree, Business Administration from Em Strasbourg Business School.
Email format at Sauter
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About François Ostermann
Welcome on my LinkedIn page where you will find all the information you need about me, my skills, my studies... As an experienced engineer I am looking for interesting projects in which I will learn but also inject my abilities and motivation. Thanks to various experiences I am quite strict and organized in my work. Always looking for learning, I like to work in a team.
Listed skills include R&D, Electronics, Coding Languages, Debuggage, and 16 others.
François Ostermann's current company
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François Ostermann work experience
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Head Of Firmware R&D Team Saint-Louis
Supervision of development of product and Team animation- Technical support to other department (quotation, product, technology)- Risk assessment- Reporting to top management- Steer and follow-up of other entities contribution to projects (Nuremberg and Ansbach)- Setup of requirement process and tracking;- Setup of Agile method of development (Sprint.
Electronics R&D Engineer
Design, development and maintenance of 169/868 MHz Radio based on Wireless MBus or OMS Standard (20 years of lifetime only battery powered). - GrDF Gazpar (biggest IoT Netowk in Europe)Tender of 11 Millions of Smart Gaz Meter for the French distributor of gaz GrDF- VHF CP V2 and evolutionsDevelopment for the customer Suez of a Smart Water Meter- Firmware.
Intern
Strategical marketing and engineering.
Internship: Improvement Of The Architecture Of Internal Vehicle Communication Networks
In each vehicle are there nowadays internal communication networks. There are different kinds of networks: high speed, low speed, wireless. The actual challenges are the growing number of applications and interconnect inside the vehicle. Special requirements for vehicle control such as verification of the proper transmission, safety integrity, redundant.
Internship: Modelling Of Thermal Impedance Of Power Devices
The integration of ever more transistors in smaller areas is an unavoidable trend in microelectronics. According to the fact that every electrical device produces heat, thermal management is today a very important subject in high power density devices. We also have to develop some tools and techniques in order to predict and to control the temperature on.
Projet Ingénieur: Réalisation D’Un Modèle Réduit De Barre D’Hopkinson
- Objectifs:Réalisation d’un modèle réduit de barre d’Hopkinson permettant la caractérisation dynamique des matériaux.Une fois ce système réalisé il sera utilisé comme démonstrateur du savoir faire de l’IMFS.Réalisations:
- Réalisation d’un modèle réduit (échelle 1:10) d’une barre de Hopkinson permettant la caractérisation dynamique (Module d’Young…).
- Suivi d’un long projet sur une période de 18 mois.
- Gestion d’une équipe et d’un projet.
- Planification de jalons pour réussir ce projet qui a abouti. Environnements techniques:
- Programmation avec Matlab.
Internship: Conception Of A Printed Circuit Board
The subject proposed by my mentor was ‘Execution of an educational paste upincluding a measure of acceleration on a remote control vehicle’ required a lot of technicalskills I acquired during my first year at the ENSPS. It also required a lot of otherqualifications I had to learned. I also had to use softwares like: Altium Designer which is asoftware used.
Colleagues at Sauter
Other employees you can reach at sauter-controls.com. View company contacts for 583 employees →
Pascal Deklippel
Colleague at Sauter
Brussels Metropolitan Area, Belgium
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LK
Lukas Kunz
Colleague at Sauter
Basel Metropolitan Area, Switzerland
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CT
Carlos Torras
Colleague at Sauter
Greater Barcelona Metropolitan Area, Spain
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RF
Rayan Fayadh
Colleague at Sauter
Lebanon, Lebanon
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GD
Graham Driver
Colleague at Sauter
Greater Portsmouth Area, United Kingdom
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CC
Christian Cullmann
Colleague at Sauter
Frankfurt Rhine-Main Metropolitan Area, Germany
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DM
Dilmi Mahmoud
Colleague at Sauter
Algeria, Algeria
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HR
Hubert Raml
Colleague at Sauter
Austria, Austria
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EP
Eduardo Patelli
Colleague at Sauter
Turin, Piedmont, Italy, Italy
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HÇ
Hasan Çağrı Köse
Colleague at Sauter
Kadıköy, Istanbul, Türkiye, Turkey
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François Ostermann education
Master Degree, Business Administration
Engineer Diploma, Microelectronic, Electronic
Master Degree, Micro And Nanoelectronic, Cum Laude
"Classes Préparatoires", Pcsi - Psi
Baccalaureate, Scientifique, Magna Cum Laude
Frequently asked questions about François Ostermann
Quick answers generated from the profile data available on this page.
What company does François Ostermann work for?
François Ostermann works for Sauter.
What is François Ostermann's role at Sauter?
François Ostermann is listed as Embedded Firmware Engineer at Sauter.
Where is François Ostermann based?
François Ostermann is based in Basel Metropolitan Area, Switzerland, Switzerland while working with Sauter.
What companies has François Ostermann worked for?
François Ostermann has worked for Sauter, Diehl Metering, Aceltis, On Semiconductor, and Institut De Mécanique Des Fluides Et Des Solides.
Who are François Ostermann's colleagues at Sauter?
François Ostermann's colleagues at Sauter include Pascal Deklippel, Lukas Kunz, Carlos Torras, Rayan Fayadh, and Graham Driver.
How can I contact François Ostermann?
You can use AeroLeads to view verified contact signals for François Ostermann at Sauter, including work email, phone, and LinkedIn data when available.
What schools did François Ostermann attend?
François Ostermann holds Master Degree, Business Administration from Em Strasbourg Business School.
What skills is François Ostermann known for?
François Ostermann is listed with skills including R&D, Electronics, Coding Languages, Debuggage, Vhdl, Microsoft Office, C, and Contact Client.
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