François Ostermann
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François Ostermann Email & Phone Number

Embedded Firmware Engineer at Sauter
Location: Basel Metropolitan Area, Switzerland 8 work roles 5 schools
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Current company
Role
Embedded Firmware Engineer
Location
Basel Metropolitan Area, Switzerland
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Who is François Ostermann? Overview

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Quick answer

François Ostermann is listed as Embedded Firmware Engineer at Sauter, a with 583 employees, based in Basel Metropolitan Area, Switzerland. AeroLeads shows a matched LinkedIn profile for François Ostermann.

François Ostermann previously worked as Embedded Firmware Entwickler at Sauter and Head of Firmware R&D Team Saint-Louis at Diehl Metering. François Ostermann holds Master Degree, Business Administration from Em Strasbourg Business School.

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Sauter

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Profile bio

About François Ostermann

Welcome on my LinkedIn page where you will find all the information you need about me, my skills, my studies... As an experienced engineer I am looking for interesting projects in which I will learn but also inject my abilities and motivation. Thanks to various experiences I am quite strict and organized in my work. Always looking for learning, I like to work in a team.

Listed skills include R&D, Electronics, Coding Languages, Debuggage, and 16 others.

Current workplace

François Ostermann's current company

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Sauter
Sauter
Embedded Firmware Engineer
basel, basel-city, switzerland
Employees
583
AeroLeads page
8 roles

François Ostermann work experience

A career timeline built from the work history available for this profile.

Embedded Firmware Entwickler

Current

Bâle, Suisse

Mar 2022 - Present

Head Of Firmware R&D Team Saint-Louis

Saint-Louis Et Périphérie

Supervision of development of product and Team animation- Technical support to other department (quotation, product, technology)- Risk assessment- Reporting to top management- Steer and follow-up of other entities contribution to projects (Nuremberg and Ansbach)- Setup of requirement process and tracking;- Setup of Agile method of development (Sprint, Demonstration)- Release planning and follow-up- Ressource management (6 internal Engineers and 3 external)- Team animation and follow-up (work attribution, employee talk, training)- Follow-up of external partners (Consulting company, Tools purchasing)

Jan 2019 - Mar 2022

Electronics R&D Engineer

Saint-Louis, France

Design, development and maintenance of 169/868 MHz Radio based on Wireless MBus or OMS Standard (20 years of lifetime only battery powered). - GrDF Gazpar (biggest IoT Netowk in Europe)Tender of 11 Millions of Smart Gaz Meter for the French distributor of gaz GrDF- VHF CP V2 and evolutionsDevelopment for the customer Suez of a Smart Water Meter- Firmware design (architecture, documentation and implementation)- Development in C and ASM of low power consumption firmware on MSP430 targets (from drivers to application)- Development of an NFC Stack and associated Security (AES 128, CMAC)- Development of Customer features based on specifications- Debugging - Setup of Continuous Integration strategy and tools (Unit Tests, Component Test, Hardware in the loop tests, Static Analysis)- Quotation to the customer’s change request and technical support to the project manager- Field return analysis of quality issue

Jun 2013 - Jan 2019

Intern

Aceltis

Geispolsheim

Strategical marketing and engineering.

Mar 2013 - Jun 2013

Internship: Improvement Of The Architecture Of Internal Vehicle Communication Networks

Vilvoorde

In each vehicle are there nowadays internal communication networks. There are different kinds of networks: high speed, low speed, wireless. The actual challenges are the growing number of applications and interconnect inside the vehicle. Special requirements for vehicle control such as verification of the proper transmission, safety integrity, redundant routing, compatibility with existing norms, and good performance versus electro-magnetic disturbances as well as low cost are mandatory. Protocols include Controller Area Network (CAN), Local Interconnect Network (LIN) and others.ON Semiconductor has developed a proof of concept board with an FPGA allowing these challenging requirements for proper communications.Based on an existing patentable idea, ON Semiconductor is willing to verify the concept with a state machine (in VHDL) into an existing board and platform.The main target of this internship was to improve, adapt, simplify and validate this new algorithm.This new idea will allow the auto-addressing of component for LIN bus.The validation will be done by verifying the new algorithms in an existing board and a new daughter board. These two boards will be control by a graphical user interface.

Feb 2012 - Jul 2012

Internship: Modelling Of Thermal Impedance Of Power Devices

Oudenaarde

The integration of ever more transistors in smaller areas is an unavoidable trend in microelectronics. According to the fact that every electrical device produces heat, thermal management is today a very important subject in high power density devices. We also have to develop some tools and techniques in order to predict and to control the temperature on such chips.My subject was about the characterization of the dynamic transient thermal impedance of the power device in its power package mounted on its PCB. The main purpose of my internship was to create a program using C language that can provide to the designer the behavior of the tested component for an input power and to deduce an electro thermal network that will be added in the design system.

Jun 2011 - Sep 2011

Projet Ingénieur: Réalisation D’Un Modèle Réduit De Barre D’Hopkinson

Institut De Mécanique Des Fluides Et Des Solides

Région De Strasbourg, France

Objectifs :Réalisation d’un modèle réduit de barre d’Hopkinson permettant la caractérisation dynamique des matériaux.Une fois ce système réalisé il sera utilisé comme démonstrateur du savoir faire de l’IMFS.Réalisations :• Réalisation d’un modèle réduit (échelle 1 :10) d’une barre de Hopkinson permettant la caractérisation dynamique (Module d’Young…).• Suivi d’un long projet sur une période de 18 mois.• Gestion d’une équipe et d’un projet.• Planification de jalons pour réussir ce projet qui a abouti. Environnements techniques :• Programmation avec Matlab.• Acquisition des données des jauges de contraintes à l’aide de Labview.• Dimensionnement de la barre d’Hopkinson. • Réalisation d’une maquette virtuelle à l’aide de Solidworks.

Sep 2010 - May 2011

Internship: Conception Of A Printed Circuit Board

Télécom Physique Strasbourg, École D'Ingénieurs

Strasbourg Area, France

The subject proposed by my mentor was ‘Execution of an educational paste upincluding a measure of acceleration on a remote control vehicle’ required a lot of technicalskills I acquired during my first year at the ENSPS. It also required a lot of otherqualifications I had to learned. I also had to use softwares like: Altium Designer which is asoftware used in order to design circuit board but also Labview used for data gathering of theaccelerometer and MPLAB for the programation of the PIC.Before using all this programs I had to understand the needs of my tutor for thistraining. I also had to learn how to make a circuit board with all the steps it includes. Ifirst realized an experimental paste-up and then I used Altium Designer in order to create thecircuit board.This introduction in the great world of electronics was a huge advantage for my second year at Telecom Physic Strasbourg.

Jun 2010 - Jul 2010
Team & coworkers

Colleagues at Sauter

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5 education records

François Ostermann education

Master Degree, Business Administration

EM Strasbourg Business School is the only French Business School to be part of a multidisciplinary academic centre of excellence.

Engineer Diploma, Microelectronic, Electronic

Telecom Physique Strasbourg (Former Ensps)

Activities and Societies: Student at the conservatoire of Strasbourg in the organ class of Christophe Mantoux (International concert.

Master Degree, Micro And Nanoelectronic, Cum Laude

The University of Strasbourg in Alsace, France, is the second largest university in France which is now amongst Europe's best.

"Classes Préparatoires", Pcsi - Psi

Lycée Condorcet, Belfort

Activities and Societies: Majors in Physics, Mathematic and Engineering Sciences. Two-year undergraduate program in Liberal Arts preparing.

Baccalaureate, Scientifique, Magna Cum Laude

Lycée Jean Jacques Henner

Major in Physics, Mathematics and Engineering sciences.

FAQ

Frequently asked questions about François Ostermann

Quick answers generated from the profile data available on this page.

What company does François Ostermann work for?

François Ostermann works for Sauter.

What is François Ostermann's role at Sauter?

François Ostermann is listed as Embedded Firmware Engineer at Sauter.

Where is François Ostermann based?

François Ostermann is based in Basel Metropolitan Area, Switzerland while working with Sauter.

What companies has François Ostermann worked for?

François Ostermann has worked for Sauter, Diehl Metering, Aceltis, On Semiconductor, and Institut De Mécanique Des Fluides Et Des Solides.

Who are François Ostermann's colleagues at Sauter?

François Ostermann's colleagues at Sauter include Hasan Acar, Wilfried Dedek, Patrick Hochenauer, Imran Shabbir, and Ludovic Kuhn.

How can I contact François Ostermann?

You can use AeroLeads to view verified contact signals for François Ostermann at Sauter, including work email, phone, and LinkedIn data when available.

What schools did François Ostermann attend?

François Ostermann holds Master Degree, Business Administration from Em Strasbourg Business School.

What skills is François Ostermann known for?

François Ostermann is listed with skills including R&D, Electronics, Coding Languages, Debuggage, Vhdl, Microsoft Office, C, and Contact Client.

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