Frank Goodwin Email & Phone Number

Hillsboro, Oregon, United States

Rio Rancho, NM

Albany, New York Area

• Managed Pathfinding Lithography Team supporting technical alliance program with IBM and Samsung Electronics Corporation (SEC) at Colleges of Nanoscale Science and Engineering (CNSE) facility. Responsible for.
• Built Albany team from 5 to 12 nanolithography researchers, filling engineering headcount gaps of JDA and process transfer team.
• Led cross-functional group, providing patterning options table for 3nm nanosheet device architecture, including full risk analysis.
• Completed, ahead of schedule, the transfer of an EUV 7nm nanolithography process transfer to GLOBALFOUNDRIES’a leading-edge FAB that demonstrated as-good or better yield as reference process.
• Delivered method to assess and quantify stochastics errors in EUV resists as screening test for materials and processing defects.
• Organized and managed GLOBALFOUNDRIES internal cross-functional team to characterize performance on state-of-the-art EUV exposure tools prior to shipment from vendor site, providing sufficient imaging data to deliver.

Albany, New York Area

Albany, New York Area

• Spearheaded external program to develop Accelerated Neutral Atom Beam technology into commercialized product to grow a New York based startup, Neutral Physics Corporation. Managed internal research team of 6 process.
• Developed program and project plans with detailed cost analysis, resource requirements and dependencies.
• Determined staffing needs based on input from project management, sales, and operations.
• Demonstrated ANAB’s atomic layer etch capability, enhancing package and increasing investor attraction.

Albany, New York Area

• Oversaw the collaborative SEMATECH and SUNY Poly CNSE program supporting CNSE’s Planarization Center. Directed nanolithography and patterning process development teams and CNSE collaboration projects.
• Delivered design and layout of a front-end 14nm CMP test mask set to CSNE.
• Led technical team in recovery of leading-edge imaging performance of SEMATECH’s EUV micro exposure tool.

Albany, New York Area

• Managed SEMATECH’s Advanced Mask Program supporting process development of Multilayer Deposition, Substrate and Mask Blank Cleaning, Failure Analysis and Advance Defect Characterization of (EUV) mask blanks..
• Met overall program deliverable of demonstrating ability to build defect-free EUV mask blanks capable of meeting manufacturing specifications.
• Turned around underperforming program through developing philosophy of teamwork, apllicarion of project management principles, improved design of experiments, statistical analysis, and adopting the practice of making.
• Provided technical leadership in implementation of Agile and Standard project management and development of reporting templates.
• Facilitated transfer of EUV mask blank manufacturing processes, metrology, failure analysis, and tool knowledge to SEMATECH’s associate members, reducing their process development and learning cycles.
• Communicated status of program projects to SEMATECH’s member company technical advisory groups,. Provided updates on budgets, delivery schedules, and alignment of program content, ensuring member company expectations.

Albany, New York Area

• Managed projects addressing requirements and performance of EUV sources to meet power and debris requirements of full field exposure tools. Adminstrator of SEMATECH’s research protfolio sensor development contacts and.
• Oversaw transfer of SEMATECH’s EUV source characterization and development responsibilities to commercial suppliers after delivering on final program objectives and ramp down of project.
• Chaired IEUVI Source Technical Working Group and organized the annual SEMATECH EUV Source Workshop.
• Maintained and managed EUV source program budget.

Albany, New York Area

• Senior technical assignee to INVENT Nanotechnology Consortium focused on EUV, 193nm immersion, and 157nm lithography process development. Provided technical leadership to the consortia research team, mentoring to.
• Delivered first viable 193 immersion process using a prototype 193i immersion scanner from ASML in collaboration with consortia partners and materials suppliers.
• Isolated processing defects being generated by prototype 193i immersion head and developed mitigation schemes.
• Represented Lithography on team overseeing transfer, qualification and matching performance of new technologies and technology shrinks from reference site to Richmond FAB.
• Led project transferring and qualifying Richmond FAB APC lithography controller across international FAB cluster.
• Worked with supplier to deliver advanced overlay analysis package, providing superior performance and better integration into lithography APC systems.

Richmond, Virginia Area

• Managed a team of 42 engineers and technicians responsible for engineering support of lithography process recipes, acceptance and qualification of all litho exposure tool clusters, support of fab-wide metrology tools.
• Spearheaded a program which reduced the average litho rework rate from 4.5% to 0.8% over 30 months and 2 technology shrinks.
• Led program transitioning litho process from DUV step and repeat technology to step and scan technology.
• Implemented litho manufacturing scheme that optimized product flow within the technical constraints of tool dedication and APC rules which resulted in a 20% increase in litho capacity.
• Established a project to enhance APC through replacement of in-house system with commercial product

Richmond, Virginia Area

Pocatello, Idaho Area

Pocatello, Idaho Area

Greater Boston Area

Master Of Science - Ms, Electrical Engineering

Bachelor Of Science - Bs, Electrical Engineering