Special Turnkey Program, Advanced Packaging Technology and Service (NPI)Principal Engineer- InFO LSI Substrate (70mmX70mm) NPI for company-A: Yield significantly raised up and migrated to high volume manufacture (4k/month)- New substrate fab bring-up and successfully met mass production schedule- Substrate supplier (Korea and Japan) bring-up: cross supplier NPI experience to fasten the bring-up schedule- Customer returns verification: substrate defect escaping prevention, and guide supplier for failure analysis- Cross team (substrate supplier, BU, CE, in-house OSAT and QA) cooperation: Ensured NPI schedule, suppy plan, and qualification plan for recent mass production

TSV Integration Program, Integrated interconnect & Package DivisionCoWoS process research and development, product management, transition to mass production- Qualified Gen-1 ~ Gen-2 CoWoS-S package process with compliant JEDEC standard, and demonstrated significant assembly yield for Gen-3 CoWoS-S- Expanded CoWoS-S technology envelop: demonstrated integration of homogeneous, heterogeneous FPGA, and SoC with 3rd party HBM die.- Extended package size from 45mmX45mm to 70mmX70mm: introduced and verified reliability for adhesive, lid/ring surface treatment, substrate core material - Extended the interposer size from 1X reticle (800mm2) to 2X reticle (1600mm2): introduced CoW and oS underfill, and broke through interposer size by stitching masks - Increased C4 bump counts from 15k to 80k: introduced and verified reliability for oval Cu bump, coordinate compensation, and bump size control for C4 joint ability - Increased uBump counts from 350k to 1000k: introduced and verified reliability for multiple pitch and structure ubump, and broke through joint ability by joint condition

TSV Integration Program, Integrated Interconnect & Packaging DivisionCoWoS process research and development, product management, transition to mass production

Fab12 Nano Tech. Integration IV Department- N45/N40 CMOS integration for product ramp-up: support to qualify N40 interconnect reliability, successfully ramped up to 200pcs/month with yield >98% for N40 product- N80 product sponsor for 8,000pcs/Quarter of GPU wafers, taped out and delivered ~40K pcs wafer of GPU chips