Gabriel Arviso Sr. Email & Phone Number

SemiPack Services; one of the nations premier Value-Add providers serving the Semiconductor Industries -Military; Aerospace; Industrial & Commercial markets.With 2 facilities; Melbourne; FL. & Tempe, AZ.; SemiPack Services provides vertically integrated services & technologies for component modifications on a litany of package outlines. Technologies include full & semi-robotic automation in solder conversions for both leaded and lead-free requirements. Our process for BGA Re-Ball ( both on RoHS and Leaded Solder Spheres ) is approved by such companies as Collins Aerospace; UTAS; & Boeing to name but a few.These services are complimented with our Test Capabilities; to include, but not limited to; XRF ( Elemental & Thickness ) Solderability & Co-Planarity ( BGA Devices ). We also provide Lead Prep ( Trim & Form ) & Tape & Reel where we manufacture our own carrier tape.Please take some time to review our capabilities and share with your colleagues. AUTOMATED TINNING SemiPack’s fully automated tinning services restore the finish and soldering properties of leads for both through-hole and surface mount devices.BGA REBALLING SemiPack offers BGA Reballing Services with speed, reliability and affordability that are unrivalled in the industry.TAPE & REELSemiPack provides reliable, rapid and flexible services for automated and manual taping per industry standards.TRIM & FORMFrom fully automatic to manual Trim and Form processing.Extensive Cropping and Forming CapabilitiesActive and Passive Component ProcessingAxial to Radial Lead Forming ServicingSnap-In and Stand-Off FormsSMT ProcessingAxial and Radial

Listed skills include Continuous Improvement, Product Development, Semiconductors, Electronics, and 27 others.

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  Maricopa Community Colleges