Gabriel Kuhn Email and Phone Number

Materials Science and characterization techniques are used to solve a variety of engineering and manufacturing challenges. Job duties include a wide range of activities such as materials selection, characterization testing, process development, and optimization. Primary duties also include Failure Analysis (FA) and Destructive Physical Analysis (DPA) of electronic components and printed wiring boards.Skills include characterization techniques such metallography, optical microscopy, scanning electron microscopy & energy dispersive spectroscopy (SEM/EDS), x-ray fluorescence (XRF), real-time and CT (3D) x-ray. Additional thermal characterization techniques include differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and thermomechanical analysis (TMA). Skills also include familiarity with Microsoft Office applications (Word, PowerPoint, Excel, & Access) with strong written and oral presentation capabilities. I am self-driven, and work well individually and in multi-functional group environments. I frequently develops strong working relationships with suppliers and customers alike.In 2010, I was appointed Lead M&P Engineer on Navigation Systems Division space products as well as a role as the Co-Chairman of the Space Parts, Materials & Processes Control Board (PMPCB).In November of 2012, promoted to Engineering Fellow (Band 5C). In November of 2014, promoted to Advisory Engineer (5B), which has a strong emphasis on mentoring other engineers while maintaining the listed engineering duties and activities.In May of 2018, promoted to Sr. Advisory Engineer (TA5) with a new emphasis on cross-site and cross-sector collaboration.

This master’s thesis work involved microfabrication processes and characterization of ultrasonic MEMS transducers using PZT films on silicon substrates and membranes.

This work involved the research and development of 3D interconnected ceramic-metal composites made with the use of rapid prototyping (additive manufacturing) and other processes.