Drive new package development for the GaN application that meets product performance and board-level reliability standards.Work closely with cross-functional and assembly house engineering teams to define optimum packages and processes.Led assembly package research & development initiatives for new package solutions on different product applications and integrated cutting-edge assembly process technologies and materials.

- Responsible for developing reliable packaging and assembly solutions for Gallium Nitride (GaN) power transistors and ICs.- Interact with design, application, and marketing teams to develop the optimal packaging and assembly solutions for HVM.- Responsible for qualifying board level reliability of various footprint power devices.- Trouble shoot and work on board level related failures.

- Responsible for design and development of package solution for Power and UHV Power devices for DC/DC and AC/DC products and manage qualification to production release - Design lead frame/package lay-out and provide recommendation based on package FEA (mechanical stress analysis) and thermal simulation using SolidWorks CFD & Flowtherm XT - Interact extensively with design, technology, marketing and application team to forge decisions over new designs influencing overall packaging and product roadmap - Work with OSAT assembly suppliers on package and product risk analysis, mitigation plans, execute DOE’s for process stability from qualification to HVM - Highly experience in package design, assembly process, BOM selection and complete package solution for Power devices (Power Discrete packages, Power Stages, Power Block, Point of Load, DC/DC and AC/DC) - Interface very closely with assembly suppliers to understand roadmaps and assembly process capabilities - Coordinate the introduction of new package assembly process and materials into volume production - Hands-on experience in developing and executing Design of Experiments (DOE) to fine tune assembly process and selecting BOM for new package - Select and qualify new vendors and manufacturing suppliers to support quick turn assembly builds - Experience with ongoing quality audits including with customer audits of manufacturing sites - Knowledgeable on statistical process controls (SPC) and work with the team for process improvements

- Proficient in industry standards for package reliability test and qualifications- Close interaction with IFX FET/IC designer, application team, marketing and business units for new product design and project roadmaps- Provide package design proposal of lead frame and clip based on the requirements of new products- Work closely with sub-contractor assembly site for new product risk assessment, project updates, mitigation plans to have a flawless execution of the project - Knowledge using 3D software (e.g. AutoCAD 3D, Inventor, and SolidWorks) - Knowledge to do package simulation software (SolidWorks) for FEA, thermal analysis and joule heating- Excellent in statistical analysis that can provide a clear direction based on package/process DOE- Working knowledge of DFMEA during design phase and ability to create strategy to mitigate the risk

Qualification of new product from different business units. Design new LF & Cu clip based on product and customer requirements.

Generate design rule for packaging concepts. Recommend the optimum package solution for new products. Qualify new package and new material that improves the package reliability of the product with lower unit cost. Develop package technology roadmap based on future product needs. Provide resolution on any quality failure during qualification. Responsible for driving quality and reliability improvement.

Determine strategy and tactics for executing customer product solutions from design to production. Work closely with customer and internal teams to develop program schedules, milestones and deliverables. Regularly communicate program status and key issues to the customer, internal teams and senior management. Develop a close working relationship with the customer development team and use creativity to find solutions to their issues.

Coordinate to customers all new technical requirements and project developments. Provide technical solutions within package integrity, reliability and process capability. Coordinate all the qualification from package design & process capability review to white space build pre-production run. Spearhead customer quality issue thru 8D’s supported by analytical & statistical analysis. Spearhead leadership programs for process and break through process improvements.

Spearhead for the design and review of new development package for BGA products. Develop and qualify new package, process and material for meeting customer target with the shortest time-to-market goal. Develop and qualify new package for new market penetration or specific customer requirements. Buy-off new assembly machines.