Keshav Garg Email & Phone Number

Hamburg, HH, DE

Hamburg, Germany

• Lead developer, responsible for software and hardware industrialisation, in a wafer-level conversion of a mixed-signal sensor product from a SPEA to Advantest 93k ATE platform
• The multisite increase of the conversion is forecasted to lead to up to 4x energy and cost savings in wafer testing - helping to meet long term ESG goals
• Performing validation and characterisation of the sensor product using oscilloscopes and other standard lab measurement equipment
• Designing and evaluating PCBs for the ATE load boards
• Writing and converting over 100K mass-production quality LOC in C/C++ as well as developing custom MATLAB scripts and tools
• Working with product, quality, and design engineers to create higher-quality tests that capture fails earlier in the testing cycle - leading to significant cost savings

Stuttgart, Baden-Württemberg, Germany

• Conducted scientific signal analysis of an ASIC for biomedical applications using MATLAB and C++
• Analysis focused on assessing signal quality, multi-channel, and cross-talk performances
• Tested and debugged circuits using oscilloscopes and ECAD software

Stuttgart, Baden-Württemberg, Germany

• Iteratively designed and built custom tactile sensors for a child-sized humanoid robot using electrically conductive fabric and foam
• Delivered full-body tactile sensing coverage, expanding the system from four prototype sensors to sixteen sensors
• Streamlined sensor design and fabrication process using drafting software, a laser cutter, and a mug press machine - resulting in reducing production time by over 50% and higher quality standards of reproducibility
• Conducted sensor characterisation to ensure sensor performance consistency and wrote MATLAB scripts to generalise sensor data
• Documented all technical processes in a scientific manner resulting in a co-authored scientific abstract presented at the 2022 IROS Workshop on Large-Scale Robotic Skin in Kyoto, Japan

Ann Arbor, Michigan, United States

• Independently integrated a TI MSP430 microcontroller into an embedded sensor system to remove basic system control functions from FPGA firmware
• Using a microcontroller instead of VHDL-based code for ancillary controls resulted in an improvement of over 70% in firmware flashing - which is why this implementation is still used in currently sold commercial systems
• Assisted the quality engineering team in writing procedures to help the organisation achieve ISO:9001 compliance
• Worked on testing and measuring devices to help ensure incoming quality of electronics and sensor components
• Mentored other interns, which included delegating tasks and providing technical assistance

Bse, Electrical Engineering, Minor: Physics, 3.65/4.00 (4.00 Highest)

Activities and Societies: IEEE HKN, Society of Physics Students, Michigan Recreational Tennis Club

Msc, Electrical Engineering, Focus: Smart Systems, 1.70/5.00 (1.00 Highest)

Activities and Societies: Intercultural Mentoring Program, Vaihingen Tennis Club, Badminton Club, Basketball Club

Summer Study Abroad, International Programs In Engineering (Ipe)

Launch - High School Summer Program, Entrepreneurship/Entrepreneurial Studies

Mibytes - High School Summer Program, Electrical And Computer Engineering

High School Diploma, 4.25/4.00 (4.00 Highest)