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Gary Chi Email & Phone Number

IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer
Location: New Taipei City, Taiwan, Province of China 2 work roles 2 schools
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Role
IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer
Location
New Taipei City, Taiwan, Province of China

Who is Gary Chi? Overview

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Gary Chi is listed as IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer based in New Taipei City, Taiwan, Province of China. AeroLeads shows a matched LinkedIn profile for Gary Chi.

Gary Chi previously worked as IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer at 台達電子 and IC Package Design Simulation Engineer at 台達電子. Gary Chi holds Master'S Degree, Power Mechanical Engineering from 國立清華大學.

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About Gary Chi

My name is Gary Chi. I have been in Delta Electronics for nearly twelve years since graduating from National Tsing-Hua University and major in mechanical engineering. I am currently the R&D project manager. Mainly responsible for the design and development of the key component of the motor drives, we call it the power package or IGBT package. The product categories can be divided into general purpose IGBT modules used in industrial motor drives, low-voltage MOS modules used in e-scooter motor drives and customized module used for specific customer application. In addition, wide bandgap semiconductor (silicon carbide, SiC/ gallium nitride, GaN) power package have also been developed in recent years.

2 roles · 17 years

Gary Chi work experience

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Ic Packaging/Power Chip (Igbt/Mos/Sic) Package Project Engineer

台灣 桃園市

1. Solve process issue (Co-work with process engineer/OSAT/In-house production line)2. New material implement3. Develop new package structure

2015 - 2024 ~9 yrs

Ic Package Design Simulation Engineer

台灣 桃園市

1. Electrical simulation--Q3D software2. Stress/Warp simulation--ANSYS Mehanical3. Thermal simulation--ANSYS Thermal4. 2D/3D Drawing--AutoCAD, Solidworks

2010 - 2015 ~5 yrs
2 education records

Gary Chi education

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What is Gary Chi's role at their current company?

Gary Chi is listed as IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer.

Where is Gary Chi based?

Gary Chi is based in New Taipei City, Taiwan, Province of China.

What companies has Gary Chi worked for?

Gary Chi has worked for 台達電子.

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What schools did Gary Chi attend?

Gary Chi holds Master'S Degree, Power Mechanical Engineering from 國立清華大學.

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