Ic Packaging/Power Chip (Igbt/Mos/Sic) Package Project Engineer
1. Solve process issue (Co-work with process engineer/OSAT/In-house production line)2. New material implement3. Develop new package structure
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Gary Chi is listed as IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer based in New Taipei City, Taiwan, Province of China. AeroLeads shows a matched LinkedIn profile for Gary Chi.
Gary Chi previously worked as IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer at 台達電子 and IC Package Design Simulation Engineer at 台達電子. Gary Chi holds Master'S Degree, Power Mechanical Engineering from 國立清華大學.
My name is Gary Chi. I have been in Delta Electronics for nearly twelve years since graduating from National Tsing-Hua University and major in mechanical engineering. I am currently the R&D project manager. Mainly responsible for the design and development of the key component of the motor drives, we call it the power package or IGBT package. The product categories can be divided into general purpose IGBT modules used in industrial motor drives, low-voltage MOS modules used in e-scooter motor drives and customized module used for specific customer application. In addition, wide bandgap semiconductor (silicon carbide, SiC/ gallium nitride, GaN) power package have also been developed in recent years.
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台灣 桃園市
1. Solve process issue (Co-work with process engineer/OSAT/In-house production line)2. New material implement3. Develop new package structure
台灣 桃園市
1. Electrical simulation--Q3D software2. Stress/Warp simulation--ANSYS Mehanical3. Thermal simulation--ANSYS Thermal4. 2D/3D Drawing--AutoCAD, Solidworks
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Gary Chi is listed as IC Packaging/Power Chip (IGBT/MOS/SiC) Package Project Engineer.
Gary Chi is based in New Taipei City, Taiwan, Province of China.
Gary Chi has worked for 台達電子.
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Gary Chi holds Master'S Degree, Power Mechanical Engineering from 國立清華大學.
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