Gary Lee Email and Phone Number
Gary Lee is a Faraday Future - Director Of Mechanical Engineering at Faraday Future. He possess expertise in design for manufacturing, engineering, fmea, manufacturing, mechanical engineering and 8 more skills. He is proficient in English.
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Director Of Mechanical EngineeringFaraday Future Sep 2015 - PresentBeijing◆ Department: Intelligent hardware / In-Vehicle Infotainment / Autopilot◆ Responsibilities: RD team build, coach, management. Planning, Milestone check Mechanical, thermal, LCM, EMC, Validation and Production.Main Products： Intelligent hardware: Router, TV box, Somatosensory camera, Projector and so on Vehicle Equipment: Central Display, instrument display, rear display, dash camera, autopilot device and infotainment device. -
Mechanical Architecture Specialist微软 Microsoft May 2015 - Sep 2015BeijingNew project architecture design and new technology development. -
Mechanical ManagerBluebank Mar 2014 - May 2015Beijing◆ Responsibilities: RD team build, coach, management Planning, Milestone check◆ Key Projects: HP: INT70A (Slate 7 PLUS in market, MP) Casper: INT70C (7inch project, MP) Prestigio: INT80BP (8 inch project, MP)
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Mechanical ManagerByd Jul 2008 - Mar 2014Beijing◆ Responsibilities： Team Management: RD team build, coach, management Project Management: Planning, Quality and Cost management. Milestone checkKey Projects： NOKIA：Guanyu09（6788 in market），Guanyu10（6788i in market），X phone MOTO: Tahiti （MT620 in market）， IronMax-TD（MT680 in market），IronPrime （MT788 in market） Lenovo: E300C（E300C in Market）,T702T（A66t in Market）,T801T（A668t in Market） ACER: T603T（MP）, WG431A （MP） Dell: P706 (Venue 7 in market), P801 (Venue 8 in market) HP：P702 (Slate 7 in Market) Intel: Gillian（4 inch phone, MP） P701T (7 inch education PAD, MP), LAVA （4.3 inch phone, MP） -
Mechanical EngineerTechfaith Sep 2007 - Jul 2008BeijingTechnology (Beijing) Limited，design 3G mobile phones, following the tooling and manufacture. * Muse, a super slim bar phone: Responsible for manufacture tracking, review the issues in building and solve it. This one is exported to Russia. * U_Pike：Responsible for rear housing and battery cover design, tracking the issues in building, make sure the product MP successfully. * HG_twins, dual card phone：Responsible for front part design
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Mechanical EngineerInventec Multimedia & Telecom Corp Jul 2006 - Sep 2007Working at RD department of Inventec Multimedia & Telecom Corp, designing consumer electronics products such as U-disk, MP3, voice recorder, gateway equipment and so on.
Gary Lee Skills
Gary Lee Education Details
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Shandong UniversityMechanics
Frequently Asked Questions about Gary Lee
What company does Gary Lee work for?
Gary Lee works for Faraday Future
What is Gary Lee's role at the current company?
Gary Lee's current role is Faraday Future - Director Of Mechanical Engineering.
What schools did Gary Lee attend?
Gary Lee attended Shandong University.
What skills is Gary Lee known for?
Gary Lee has skills like Design For Manufacturing, Engineering, Fmea, Manufacturing, Mechanical Engineering, Six Sigma, Engineering Management, Injection Molding, Pro Engineer, Project Engineering, Solidworks, Product Design.
Who are Gary Lee's colleagues?
Gary Lee's colleagues are David Mellia, Yanbin Bai, Eric Blair, Xiaoyan Xie, Basma Ibrahim, 刘慧姣, Terence Ward.
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