Gary Messner Email & Phone Number

Greensboro, Nc, Us

Greensboro, Nc, Us

Irvine, California, Us

Santa Clara, California, Us

Santa Clara, California, Us

Design of multi-chip module (MCM) products containing state of the art technologies such as flip-chip, flip-stack, copper pillar, solder bump, chip & wire, high density thin substrate stack-ups. Perform LVS/DRC and comply with manufacturing requirements for high yield/high volume environments. Common tool sets: ADS, Cadence APD/SIP, ANSYS HFSS, AutoCAD. Software programming laguages: Cadence SKILL, Visual Basic .Net.

Irvine, California, Us

Principle designer of MCM modules utilizing state-of-art substrate and PCB technology(Including LTCC). Preform LVS/DRC at the schematic level, design substrate per design rules on a mixed technology (wire-bond/Flip-stack/Copper Pillar/Solder Bump). Project management of development cycle through high volume production release.

Greensboro, Nc, Us

Project Management: Packaging Technology Development:Technology Process Development: For product development, through pre- alpha and alpha stages. Interface with cross-functional team including, quality, reliability, marketing, supply chain, and manufacturing. Mitigate threats identified in potential problem analysis (PPA).Assembly Process Development: Centered on defining design rule improvement initiatives to reduce component spacing for package size reduction or increased circuit densities for low and high volume manufacturing.Substrate Technology Platform Development: For laminate (module) based products requiring thin package heights. Product Development:Support Senior Project Manager: By managing lower level project workloads including second sourcing, product derivatives, prototype assembly, cost reduction and data collection of sample lots.Customer Samples: Manage product assembly builds to meet customer sample requirements.Product Development Process (PDP) Use PDP structure for the product development life-cycle strategy.

Greensboro, Nc, Us

 Laminate Design Engineering GroupManage team of PCB and substrate layout technicians in the US and China. Services offered to design community:Provide turn-key PCB layout solutions using common PCB technology to control cost as well as designing complex multilayer stack-ups.Provide turn-key solutions using substrate technology manufactured in Asia Fabrication documentationAssembly drawings, gerber files, net lists, ODB++ database, fabrication specification (board stack)Administrators of PCB/substrate design tools (Cadence, Altium and ADS) and provide internal training of preferred practices: Corporate libraries and templatesReview layout designs meet current assembly design rules for high volume manufacturing. DFM checking and validation of module substrate layout. Surface mount design rules for die, wire-bond, flip-chip, discrete SMD, stacked die, multi-layer laminate technology used for particular application. Substrate stack-ups loaded into design kits for design community.

Greensboro, Nc, Us

Lab support for temp. testing, correlation, spacific testing and data collection for RF power amplifiers for cellular handsets. Supported operations as contact for spacific products for testing problems/low yields and problem analysis. Adress line-down conditions to assist test technicians in root-cause identification.

RF engineering technician working in an engineering lab environment. Providing testing, troubleshooting, and test fixture design. Use Lab View or Agilent HP Vee to create accelerated life programs for temp. cycling. Total automation of test equipment for transmitter and receiver testing. Senior technician lead over 5 manufacturing technicians acting as support for testing and troubleshooting of newly released products. New product introduction role was focused on the transfer of technical knowledge to manufacturing.

Master Of Business Administration (M.B.A.), Mba

Bs/Gm, Business Management

Diploma, Electronics Analysis