• Drop/shock simulation (Hypermesh, Abaqus) for audio systems equipment: microphones, conference room speakers, headphones, earbuds, wireless microphone and monitoring systems (racks and body packs), professional entertainment equipment. Correlate simulation to test. Guide design direction with high fidelity simulation results.• Develop/implement simulation techniques such as: woven wire mic grill modeled with beam elements, material behaviors for hyperelastic, hyperfoam, viscoelastic, composite, creep, damage.

• Drop/shock simulation (Hypermesh, Abaqus) for mobile point of sale terminals.• Determine equivalent PCB modulus with 4-point bend test+sim.• Simulate tumbler drop test (random drop angles) using Python scripting.

• Drop/shock simulation (Hypermesh, Abaqus) for devices such as smartphones, game phones, credit card readers, laptops, phone-tablets, battery chargers, point of sale terminals, High Fidelity speakers. Analyze and assess risk of failure for glass, housings, PCB BGAs, battery bounce, components strike, gap openings. Correlate simulation to test. Measure mechanical properties for materials/parts/systems as needed. Suggest design solutions to address high risk items and verify with simulation. • Thermal analysis (FloTherm, ICEPAK) for handhelds and IOT devices such as appliance human-machine interface units, smartspeakers, smartphones. Assess risks for too-hot-to-touch surfaces, battery overheat, IC overheat. Simulate the use of heat spreaders and heat pipes to alleviate thermal risks.• Stress/structural analysis (Abaqus) on button actuation and latching, device 3-point bend tests, ground contact springs, seal compression, connector contact force, flex bend fatigue, cable crimp, simcard tray insertion.• Acoustic simulation (Abaqus, Ansys) of smartphone speakers. Correlate Sound Pressure Levels at some distance from the speaker against measurement. • Simulate attraction force between permanent magnet and metal (Abaqus, Ansys, FEMM), which is used on modular battery pack that attaches onto a game phone product. • Simulate water ingress for smartphones submerged in water tank (Ansys Fluent), for IP67 waterproof protection.

•Simulation of Diesel Engine Fuel System.•Electromagnetic analysis of diesel engine fuel injector control valve; solenoid Joules heating. •Crankshaft torsional vibration analysis.•CFD, thermal, thermal stress analyses of after treatment injector; A/C ducting system, Exhaust Gas Recirculation cooler.

•Simulation of cellular phone products - thermal, structural, drop/shock, creep, fluid flow, and haptics. Model validation, simulation process improvement.•Neural Networks based tool for phone impact prediction; accurate to within 10%. •Produced professional videos on simulation methodologies to train up new staffs across the globe.

•Responsible for the hardware quality of all 3G products. Drive quality in design, manufacture, supply chain, and field performance. •Successfully transitioned the team to an improved reliability qualification process.•Coordinated the successful ISO 9001 audit for 3G.

•Simulated communication network for automotive application. Compared performance of bus versus mesh architectures.•Analyzed a commercial Mobile Access Router for wireless communication to/from roaming automobiles.

•Outsourced software staffs to internal Motorola accounts. Marketed services and products. Matched customer’s needs based on skills and domain. Gathered requirements, bid for projects, responded to RFPs.•Provided liaison between customer and development teams, ensuring and enhancing communication flow.•Oversaw project management - statements of Work (SOWs) and Project Management Plans, resolved issues, mitigated risks, tracked cost and schedule.•Communicated program status to all levels of stakeholders.•Business planning, forecasted staff requirement as a function of customer roadmap.

•Led a team that provided consultation to nearly all Motorola businesses in electronic packaging and reliability; with Profit & Loss responsibility.•Solved product design and reliability problems by using simulation, testing, and model validation, as means for identifying root causes and creating innovative solutions. Examples include: BGA reliability, creep, PA heatsinking, gas sensor, pressure sensor, metal forming, solder joint formation, Known Good Die burn-in, MTTF prediction.•Groundwork research on Knowledge-based Neural Network for training reliability models on real field return data.

•Simulated metal forming, flex circuit thermal analysis; integrated CAD with FEA. •Designed, developed, and analyzed Anti-lock Braking Systems, silicon pressure sensors, and battery chargers.•Initiated Computational Fluid Dynamics simulation.

•Thermal, structural, and vibration analyses, with experimental validation, of airborne electronics.