Geonedick Bascones Email & Phone Number

Edmonton, Ab, Ca

Edmonton, Ab, Ca

Edmonton, Alberta, Canada

Process Engineering-Dry ModuleDRIE (Bosch)|ICP RIE | RIE | Plasma Etch | PECVD | LPCVD | Tystar Dry/Wet Oxidation, Anneal |

Singapore

o Drive Quality& Reliability risk assessment for wafer quality indicators and quality events highlighted by YE, RDA or Fab engineeringo Works with cross functional teams to contain non-conforming wafers (unplanned deviations) and assess risk to outgoing quality.o Initiate and lead MRB (Material Review Board) to conduct risk assessment, gather data, and drive decision on product disposition of non-conforming materialo Drive compliance to customer quality indicators like SPC, WLR, Inline spec limits, and Electrical spec limitso Review conversion plans for process changes, ensure compliance to process change standards, assess risk to outgoing quality, ensure right data collection and disposition material appropriatelyo Collaborate with Global Quality/PE teams on assessing customer notification (PCN) for planned and unplanned deviationso Collaborate with Global Customer Quality Engineers to understand customer requirements and drive micron internal efforts on global complianceo Lead global projects to deploy and improve Quality systems and business processeso Drive global alignment and continuous improvement efforts leveraging Failure Mode Effect Analysis(FMEA) and 8D processeso Drive validation of 8D - Root cause, CA/PA and Manufacturing improvements for Quality events

Singapore

o Process Engineer for Gate Etch from 180nm up to 40nm CMOS wafer fabrication.o Responsible for Qualification, Tool Matching, Process troubleshooting, % Utilization and Maintenance of LAM Kiyo Versys TCP chamberso Responsible for production line sustainability, process indices monitoring (SPC) and conducting of effective root cause analysis on a daily basis to assist process and tool drift issues.o Responsible for establishing adequate inline process monitoring indices (FDC Strategies, Tool specs, alarm tolerances) to improve early detection of out of control processo Responsible for management of process recipes (RMS) and characterization of etch process for margin improvement.o Responsible for identifying failure reaction mechanism on every recipe process steps (FMEA)o Responsible for Disposition of out of control lots thru Material Review Board (MRB)o Driver for Continuous Improvement of Process (CIP) including management of yield and quality, improvement of process robustness and CpK for high volume manufacturing using statistical tools, data driven decision making and systematic problem solving skills. o Supports the efforts of the internal technology development (TD) and integration teams (PI) to ensure that process is optimized to meet the qualification and reliability requirements before technology transfer. Key Achievements:o Responsible for Qualification of LAM Kiyo ICP Chm from Installation to Full Manufacturing which resulted to more than 200% increase in throughput capacity.o Defectivity improvement projects such as Optimization of Waferless auto clean (WAC) recipe and Gas Injector (new design) on LAM Kiyo platform which resulted in improvement of chamber MTBC ( production throughput)o Establishing FDC (Fault Detection and Classifications) and eSPC controls based on critical equipment parameters to mitigate process deviation risks.

Singapore

o Chairs the Daily Process Line Engineering Update to Etch Moduleo Coordinates with Manufacturing on Production management to meet daily targetso Summarizes and presents daily process indices fall out during morning meeting to trigger appropriate actions from the process owners. (Includes out of control charts, wafer scraps, equipment alarms, YDD performance, Tool setup monitoring)o Identifies and supports manpower requirement within the shift.o Supports other Process related tasks as instructed by Principal Engineer (Supervisor).

Singapore

o Front line troubleshooting of Process abnormality (process drift and trend)o Process Handledo FEOL: STI; Gate; Spacer; MOL; Contacto BEOL: Metal and Via SiCOH; Pad ; Aluminum MIMo Metrology: Critical Dimensions / Film Thickness / Optical CDo Recovery and Requalification after PM or unscheduled downtimes of different Etch chambers such as Lam 2300 Verys Kiyo/ Exelan, Telius SP SCCM / Jin, Mattson Aspen III /Suprema, AMEC Primo D-RIE Dielectric, AMAT Producer eXTo Clearing, Reprocessing and Disposition of Etch Tool Alarm waferso Creates/ Optimize Measurement Recipe Job file for CD (Critical Dimension) and THK (Thickness) on different Metrology tools such as Applied Materials and Hitachi CDSEM, KLA Tencor ASET F5x /SpectraFX200 Thin film systems Spectra CD.o Assists Manufacturing in WIP management (Wafer Moves)Supports other Process related tasks as instructed by Shift

Marilao, Bulacan Philippines

Worked as a Production Engineer / Supervisor in a Metallurgical Plant (Lead Smelting/ Refinery). Subsidiary of RAMCAR Group ( Motolite Batteries)