Signal integrity for device packaging

-Responsible for overlay metrology of intel 7 technology for Front End and Back End Of Line-Responsible for multiple inline overlay metrology tools to ensure stable process control, including development of several automation projects to improve tool availability and stability-Development of metrology recipes to improve overlay margin and yield, including involvement in several taskforces to solve critical yield issue-Supporting multiple globally distributed factories in solving technical challenges and reaching root cause

Responsible for the development of thin film superconducting microwave cables. Duties included the design and simulation of microstrip, stripline and coplanar waveguide cables.Developed the fabrication process and layout for several rf cables that is continued to be used today in the group

Worked closely with student's in a laboratory setting. Duties included teaching them basic circuit theory, using measurement equipment, and Matlab. In addition, I was also responsible for generating weekly quizzes and helping them improve their technical written and oral presentation skills.

Worked for several different research groups in which I had various responsibilities. Electronic Nose Group:* Developed LabView code to interface sensors and sensing systems via GPIB and serial interface.* Responsible for operating a water analysis system to detect carbon content in the ppm for International Space Station water studies.Thermoelectronics group:* Responsible for diffusion bonding studies of differential materials such as metals and bulk semiconductors.* Responsible for determining the electrical properties at the different interface materials as well as preparing these samples for Scanning Electron MicroscopyHydrogen Fuel cell group:Develop software in LabVIEW to interface several different equipment to control a Hydrogen-fuel cell setup via NI-USB DAQ.

Fabricated Metal Oxide Capacitors with High-K dielectric materials (Al2O3, HfO2, AlxHfOy)Responsible for the design and fabrication of MOS-CAP devices. Duties included: photolithography, DC sputtering, dry-etching, and electrical and surface characterization of the materials deposited.

• Developed testing protocol for High Altitude Electromagnetic Pulse (HEMP) susceptibility for multiple points of entrance.• Developed software in LabVIEW for data acquisition of HEMP testing for onboard ship testing.

Developed software in LabVIEW for the characterization of semiconducting devicesExamples include: Photoluminescence (PL), Electroluminescence (EL), and Current-Voltage (I-V) measurements.

* Developed software in C++ to automate testing of firmware and hardware for the E-series fantray in order to validate new hardware before release.* Decreased testing time from four hours to less than thirty minutes

* Developed software in C to process telemetry data from the International Space Station (ISS)* Developed software in C to test and debug an embedded Linux system* Engineered software to prepare the JPL Electronic Nose for delivery on ISS

• Aided in the development of software in LabVIEW to operate the 3rd generation JPL Electronic Nose• Studied the degradation of ethyl cellulose polymer on quartz crystals using a quartz crystal microbalance