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@us.henkel.com
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George Carson is listed as Retired to Indianapolis area! based in Carmel, Indiana, United States. AeroLeads shows a work email signal at us.henkel.com and a matched LinkedIn profile for George Carson.
George Carson previously worked as Director Of Manufacturing Engineering at Lark Rf Technology and Executive MBA Program at University Of California -Irvine Merage School Of Business. George Carson holds Ph.D., Materials Science, College Of Engineering from University Of Illinois At Urbana-Champaign.
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George Carson is a Retired to Indianapolis area!.
Listed skills include Product Development, Manufacturing, Electronics, Materials Science, and 24 others.
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Phoenix, Arizona Area
Responsible for specifying equipment, designing and laying out the cleanroom (with my invaluable coworker Michael Buckley), and establishing the engineering group. This new team in this new space started from nothing to establish the processes for manufacturing Lark's first microE-based communications products!
Merge School Of Business
Reported to the Vice President of Global Product Development and Market Manager.Directed development and commercialization activities for new handheld device thermal films.• High-risk, new-to-world multilayered thermal absorber lacking test or material specs• Customer thickness expectations dropped from 1.2mm to 40um in one year• Assembled custom test equipment and test protocols • Negotiated and presented customer specific testing
Reported to the Vice President of Global Product Development and Market Manager.Directed development and commercialization of new conductive die attach films.• First sales of two new-to-market products each in in 2012 and 2013• Implemented printing process for 50% cost reduction• Negotiated and completed commitments for joint customer developments
Reported to the Vice President of Global Product Development.Developed and recommended novel material technology for further development. • Completed a world-class thermal lab to characterize high thermal die attach• Developed a unique wafer coating robot with an external partner• Organized and coordinated monthly technical seminars amongst 8 global R&D sites
Global technical support of packaging products. Product development support through assembly level testing of packaged devices.Staff of 22 engineers from technicians to Ph.D.• Managed handling and application related customer complaints and emergencies• Consolidated Henkel’s 3 North American Engineering sites to Irvine• Developed leadframe, flip chip, and stacked die test packages for process and material testing• Implemented standard and custom process and reliability testsWe sought to establish Henkel as an expert in the development and application of electronic-grade organic adhesives. I established a fantastic organization of assembly engineers to drive new product development with the development scientists. Over several years we built applications engineering at Henkel Electronics to include capability of assembling a broad array of packages and board assemblies, including stacked die, CSP's, QFN's, QFP's, Flip Chip BGA, and others. The organization consisted of die attach (paste and film), mold compound, and underfill assembly experts. Expertise extended to the associated customer applications of these devices.
Schaumburg And Austin
Responsible for ensuring that substrate and underfill technologies required for advanced PBGA's were available. This included defining future material requirements and associated design rules, identifying cost effective, reliable technologies, and working with suppliers on technology developments.
B.S. Ceramic Engineering
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George Carson is listed as Retired to Indianapolis area!.
AeroLeads has found 1 work email signal at @us.henkel.com for George Carson.
George Carson is based in Carmel, Indiana, United States.
George Carson has worked for Lark Rf Technology, University Of California -Irvine Merage School Of Business, Henkel Electronic Materials Llc, Henkel Electronic Materials, and Motorola (Mobile And Semiconductor).
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George Carson holds Ph.D., Materials Science, College Of Engineering from University Of Illinois At Urbana-Champaign.
George Carson is listed with skills including Product Development, Manufacturing, Electronics, Materials Science, R&D, Failure Analysis, Adhesives, and Design Of Experiments.
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