George Melcer Email & Phone Number
@boxunfolded.com
2 phones found area 732
LinkedIn matched
Who is George Melcer? Overview
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George Melcer is listed as Co-Founder/CEO ShinePay at ShinePay, based in Oakland, California, United States. AeroLeads shows a work email signal at boxunfolded.com, phone signal with area code 732, and a matched LinkedIn profile for George Melcer.
George Melcer previously worked as Co-Founder/CEO at Shinepay and CEO at Boxunfolded. George Melcer holds Computer Engineering, Computer Engineering from Georgia Institute Of Technology.
Email format at ShinePay
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AeroLeads found 1 current-domain work email signal for George Melcer. Compare company email patterns before reaching out.
About George Melcer
Leading a revolution in coin-op laundry payments.
Listed skills include Debugging, Hardware Architecture, Firmware, Fpga, and 33 others.
George Melcer's current company
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George Melcer work experience
A career timeline built from the work history available for this profile.
Ceo
-Responsible for embedded Hardware design and architecting of multiple Bluetooth Low Energy/IoT/Wearable products. Task include: system architecture, prototyping, component selection, circuit design, schematic capture, PCB layout, PCB fabrication and assembly management (100 pcs runs), and bring-up. -Responsible for embedded C Firmware design and architecting of multiple Bluetooth Low Energy/IoT/Wearable products. Tasks include: implementing I2C/PWM/TIMERS/UART/SDIO/SPI/IRQs/PM, motion algorithm development, motor control, high-power AC control, and more. -Worked with multiple development environments including gcc, Keil, IAR, and Atmel Studio. Altium Designer for hardware.-Responsible for Project Management by creating schedules, holding weekly staff meetings, updating schedules, and 1:1’s with other vendors and individual contributors. -Responsible for Client Communications by: -Communicating cost, scope, duration of projects before they begin. -Making sure the specifications are clear and complete and proposing alternative lower risk, lower cost, and/or higher quality alternatives. -Communicating regularly through projects. -Providing clear documentation for easy hand-off to internal teams. GENERAL CAPABILITIES:- Hardware Project Management- Product Feasibility Studies- Hardware Architecture- Component Selection- Circuit Design -- [Analog, Mixed-Signal, Digital]- PCB Layout -- [Analog, Mixed-Signal, Digital, High-Speed, RF]- PCB Fabrication and Assembly Management- Firmware Architecture- Firmware Implementation- iOS Development- Sensorswww.BoxUnfolded.com
Hw Design Engineer
-Completed circuit design of an HDMI 1.4a transmitter and receiver proto-board to do functional testing on chip manufactures claims. -Completed Python scripts that controlled two Quantum video signal generators and the HDMI proto-board. Receiver chip had measurement functionality and the script would ensure measurements were correct (comparing to signal generators) and port switching (on two port HDMI receiver) took place in expected amount of time.-Completed airflow and noise measurements for a 6-RU rack-mount box. Using an air velocity meter I took measurements at different locations to get an understanding of flow over a cross-sectional area and using different cross-sectional areas an idea of turbulence within the box. This was done to ensure we are getting enough airflow for cooling. -Designed a switching power supply to control cooling fans. The controller was capable of 65W, 8V to 12V output, 11V -12.5V input, short-circuit protection, buck-boost design. It was controlled via I2C DAC with 4096 points of granularity.-Assisted with FCC compliance testing regarding electromagnetic radiation from electronic device.
Graphics Hardware Engineer
• Detailed knowledge of graphics processors and the Intel 3D graphics pipeline with emphasis on analog operation of digitaldisplay technologies (DisplayPort, HDMI, and FDI).• Triage and debug of issues from over/under equalization of HDMI/DP signals to driver state programming of graphics pipeline.• Debugged critical and time sensitive issues for all major OEMs (i.e. HP, Dell, Toshiba, Sony) with emphasis on Apple.• Worked directly with customers under strict NDAs as I am previewed to customer board layouts, schematics, and other sensitivedesign documents.• Successful one-on-one communication with volatile customers due to looming deadlines to release (laptop/desktop) systems.
Hardware Design Intern
-Successfully completed the circuit design and layout of an Inertial Navigational System via Cadence Design Entry CIS and Allegro. My design reduced cost by a factor of 10 relative to the previous solution. (Wikipedia: Inertial Navigational System)-Utilized an ARM-based STM32 MCU, 3-axis MEMs accelerometer, 3-axis MEMs gyroscopic sensors, 8-LED Drivers, 24 LEDs, and 3-axis magnetometers. -In cooperation with several coworkers integrated (in Palo-Alto) Tsunami Warning technology on a Wave Glider™. -Responsible for leading Hawaiian team-members in setup/debugging of Tsunami Warning technology on a Wave Glider™ for testing in Hawaiian waters.
Platform Architecture Engineering Intern
-Developed a library supporting I2C, SPI, ADC, Timers, Interrupts, and GPIO for an Analog Devices MCU for use as a rapid prototyping platform. -Utilized the above library on various sensor technologies for detection of human presence and interaction. -Created Cocoa applications that visually represents sensor data to convey significance of data over time and relative to additional sensors. -Wrote Atmel MCU code to communicate with MagSafe™ via 1-Wire.-Created an internal application for computer stability testing using a proprietary version of Lua w/ low-level hardware API.
Algorithms Intern
-Setup development and test environments in Red Hat Linux for members of my team. SSH and VNC servers were setup and utilized for remote access to these environments. -Developed algorithms to autonomously manage a highly scalable system, which holds thousands of data servers with millions of users. -The algorithm ensured maximum server productivity while minimizing the amount of hardware usage. Accomplished this by working in a team environment with two other interns and various full-time employees. -All algorithms were implemented using ANSI C in a Unix/Linux environment.
Firmware Design Engineer
• Smoothed curves inputted through a low-resolution touch screen and outputted through a high-resolution printing unit.• Manipulated sets of Cartesian Coordinates using: Bezier Curves, Parametric Equations, Intelligent Point Averaging, and AlphaBlending methods.• Hardware Constraints to overcome: 1MB of RAM to store a 6.6MB Bitmap. No hardware FPU implementation, ergo limitationson floating-point calculations.• Worked independently with assistance, as needed, from various co-workers. Self-determined dates of completion.
George Melcer education
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Georgia Institute Of Technology
Frequently asked questions about George Melcer
Quick answers generated from the profile data available on this page.
What company does George Melcer work for?
George Melcer works for ShinePay.
What is George Melcer's role at ShinePay?
George Melcer is listed as Co-Founder/CEO ShinePay at ShinePay.
What is George Melcer's email address?
AeroLeads has found 1 work email signal at @boxunfolded.com for George Melcer at ShinePay.
What is George Melcer's phone number?
AeroLeads has found 2 phone signal(s) with area code 732 for George Melcer at ShinePay.
Where is George Melcer based?
George Melcer is based in Oakland, California, United States while working with ShinePay.
What companies has George Melcer worked for?
George Melcer has worked for Shinepay, Boxunfolded, Rgb Spectrum, Intel, and Liquid Robotics.
How can I contact George Melcer?
You can use AeroLeads to view verified contact signals for George Melcer at ShinePay, including work email, phone, and LinkedIn data when available.
What schools did George Melcer attend?
George Melcer holds Computer Engineering, Computer Engineering from Georgia Institute Of Technology.
What skills is George Melcer known for?
George Melcer is listed with skills including Debugging, Hardware Architecture, Firmware, Fpga, Embedded Systems, Algorithms, Programming, and Circuit Design.
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