Gerald Mccarthy Email & Phone Number

Chelmsford, Ma, Us

Manchester, Nh, Us

- Principal failure analysis engineer

Wilmington, Ma, Us

- Worked with Design, Test, Marketing and Application groups to develop characterization plans for new amplifier products.- Conducted the electrical characterization of a low power, high-speed amplifier (ADA4805) and a difference amplifier (ADA4830) that was released to sales for automotive applications.- Utilized electrical measurement equipment such as oscilloscopes, network analyzers, spectrum analyzers, function generators, DMMs and automated test systems to characterize new products- Provided technical support to quality and reliability groups to successfully qualify new amplifier products- Led product sustaining activities aimed at reducing cost, improving yields and satisfying customers

Wilmington, Ma, Us

- Performed failure analysis of Analog IC’s and advanced packaging solutions- Verified reported failure modes and used numerous failure analysis techniques to identify failure mechanisms - Documented findings in published reports for customers and internal engineering staff- Communicated time critical failure analysis updates to top tier customers and senior management- Handled volatile chemicals in decapsulation and deprocessing of integrated circuits- Supervised, mentored and trained new FA engineers, collaborated with peers, worked in cross-functional teams, reviewed FA reports, delegated work to lab techniciansKnowledge of silicon wafer fabrication processes and IC packaging technology led to the completion of over 1000 failure analysis reports identifying various failure mechanisms including electrostatic discharge (ESD), electrical overstress (EOS), electro migration, mobile ionic contamination, kirkendall voiding, corrosion, intermittent contacts (vias and metallization), fabrication defects, test coverage, assembly/packaging defects and various low-tech issues.Failure Analysis Skills:optical microscope, scanning electron microscope, environmental chamber, electrostatic discharge (ESD) and latch-up simulation equipment, X-ray imaging, time domain reflectometry, liquid crystal analysis, photo emissions analysis, IR imaging, XIVA, passive voltage contrast, mechanical microprobing, energy dispersive x-ray spectrometry, die level mechanical cross section, package cross section, chemical/mechanical decapsulation of packaged IC's and chemical/mechanical deprocessing of various wafer fabrication processes Lab skills:oscilloscope, digital multimeter, source meter, curve tracer, power supply, signal generators, network analyzer, spectrum analyzer, automated test equipment (LCT40), thermal stream, environmental chamber