Subject Matter Expert for DSM Flex Front End operation whose main KPI is to drive efficiency and efficacy of the manufacturing process. Provide technical support to achieve the required quality and quantity at the lowest production cost through the use of SPC, OEE and key engineering tools.Executes machine optimization through HMI and PLC(Schneider, and Beckhoff TwinCAT3 via Visual Studio).Uses KNEAT Application when creating my authored Specifications, Site Acceptance Test(SAT), Installation Qualification(IQ), and Quality Project Assessment(QPA).Drafted the URRA for Toric together with the corresponding RA.Drafted the IOQ protocol for the activation of Toric Feature of Casting together with its inline Inspection Camera and using GR&R and Gage Linearity and Bias as the basis for the inline Cognex Camera's qualification.Executed the SAT, IQ, OQ and IOQ for the newly installed Curing Ovens, PP Resins System, Casting and DnD machines at Alcon's expansion in Tuas.Uses DOE(using minitab software) to correlate parameters that have impact towards eliminating bubbles from contact lenses.Optimizes the cycle time of Casting and De-molding/De-lensing modules to ensure a balance flow while at the same time achieve the desired OEE target and Yield.Uses Trackwise application for my Change Request(CR) project and Non-Compliance(NCR) report.Design toolings using Fusion, Autocad and Flash Macromedia for design animation.Manages my projects through the use of PROGGIO software.

Improved the air circulation of Nikon’s PCB Rack to eliminate frequent power shutdown due to overheating. Created the Photolithography MEE’s video training materials to help newly hired technicians understand certain PM procedures at a much shorter time.

Was part of the team which helped the company in becoming a ROHs compliant by transforming its SMT Production from being a Leaded solder paste user to Unleaded solder paste user. Spearheaded DOEs such as the determination of the optimum Reflow oven profile in order to meet the reflow curing of the unleaded solder paste. Resolved the issue of tombstone defect through the study that I have conducted to identify the optimal viscosity of unleaded solder paste that minimizes poor adhesion to PCB pads.Performed machine buy-off at machine maker's site (such as Sony AOI in Malaysia and Siemens HS60 in Singapore to name a few) in terms with 6sigma and process capability. Utilizing tools such as GR&R, Anova, Gage Linearity and Bias, Design of Experiment using SAS-JMP, Cpk during machine buy-off, Machine Parameter optimization, and Process improvements.

Awarded for the initiative and rapid progress in solving SMT related issues by IBM-Yasu.