Provide training for awareness of counterfeit electronic parts, avoidance of inadvertently purchasing counterfeits, and inspection of purchased parts to determine whether they are counterfeit or genuine.

Act as component engineer primarily for crystal oscillator hybrids, relays, thermal resistors, and other parts as necessary. Review EEEE parts for suitability for space missions, review test data to assure qualification, serve on teams resolving part problems.Perform source inspections on hybrids at manufacturer facilities; certified by JPL and Hi-Rel Labs to inspect to MIL-STD-750 and MIL-STD-883, and certified by IPC to inspect per J-STD-001.Serve as a subject matter expert for counterfeit part avoidance and suspect counterfeit analysis, primary trainer for JPL and NASA-wide Counterfeit Parts Avoidance courses, certified to IDEA-ICE-3000 for counterfeit inspection, review GIDEP reports for impact on JPL. Research JPL's suspect counterfeits, wrote GIDEP E4-SC-2023-0001. Have presented at, been panelist for, and currently serve on Technical Committee for national SMTA/CALCE counterfeit symposium.Work with Defense Logistics Agency on supplier site audits and Revision F of MIL-PRF-55310, incorporating JPL requirements. Wrote much of the text of the thermal sensor section of the upcoming NASA-STD-8739.11.Performed failure analyses, destructive physical analyses, and constructional analyses on electronic parts for JPL NASA missions, operating most lab equipment myself: electrical testing, cross-sectioning, scanning electron microscopes, etc. Reviewed and edited the reports of other analysts prior to publication, shared knowledge with the more junior analysts. Served as backup operator of JPL's Feinfocus real-time x-ray machine. Coordinated and provided technical guidance for (outsourced) computed tomography (CT) work.

Responsible for quality assurance for the Torrance TCS plant site, including certifications for AS9100, ISO 27001, and DO-254 for three business units: high-reliability electronic component sales to international and domestic space customers, rocket launch tracking, and production of ruggedized solid-state drives. Managed staff of QA engineers and technicians, resolved customer claims, surveyed suppliers, and myriad other QA tasks. [TCS has since been acquired by Comtech Telecommunications Corp.]

[Trident was acquired in 11/2011 by TCS and known as TeleCommunication Systems--Space & Component Technology thereafter] Served as a component engineer for primarily international satellite and rocket manufacturers who did not have their own CEs to manage U.S.-made electronic parts. Led anomaly and failure analyses on behalf of customers, directed the work of outside labs in such investigations, served as technical interface between foreign customers and domestic manufacturers. Set up new x-ray fluorescence and real-time x-ray equipment, served as primary operator, trained other staff. Served as focal for counterfeit parts prevention program, inspected suspect incoming parts, monitored GIDEP database for problems affecting TCS, ensured compliance with AS5553 and AS6081, actively participated on the JEDEC G-11 and G-12 component committees and SAE G-19 Counterfeit Electronic Parts Committee. Certified to IDEA-ICE-3000 for counterfeit detection. Performed source inspections for complex devices, surveyed suppliers, managed custom part specifications and test procedures, performed internal AS9100 audits, performed BOM reviews, assisted customers with part selection and custom part design, coordinated with internal procurement and quality assurance departments to assure quality and on-time delivery.

Managed all contested destructive physical analyses (DPAs) and supplier corrective actions, led resolution of pure tin issues. Led all AS9100 audit and CMMI activities for Component Engineering. Represented Parts, Materials and Processes Control Board for government customer on DPA Review Board, Qualification Review Board, and Component Engineering Change Control Board. Negotiated with customer for waivers, tailoring MIL requirements, and contract wording for part, material, and process requirements.

Managed DPA, failure analysis (FA), component testing, radiation, and technical services (TS) staff and work. Reviewed FA work performed by Hughes, Raytheon, and Boeing engineers for technical accuracy, clarity, and completeness. Served as the interface between Hughes, Raytheon, and Boeing customers, management, and employees in joint lab. Led critical failure investigations, guided and trained other engineers, performed analyses myself. Led ISO 9000 and AS9100 certification activities for Component Engineering, published all department command media. Mentored several junior engineers.

Led FA and TS teams: managed up to 18 Hughes and Raytheon employees (hired, trained, evaluated, rewarded, disciplined, and terminated), tracked and presented cost, quality, and schedule metrics to Raytheon management, held staff meetings with employees. Trained team leaders and other engineers, performed analyses myself. Led and supported engineers in critical failure investigations. Wrote command media for FA and DPA processes.

Led FA team: received and assigned failed components for analysis, guided and trained engineers, reviewed the reports of as many as 16 engineers, presented to Failure Review Boards. Managed up to 7 engineers: assisted in hiring, evaluating, and disciplining them. Tracked metrics, presented them to management. Helped merge Hughes’s Space & Communications, Electro-Optical, Radar, and Ground Systems FA and DPA labs. Served as lab safety monitor, wrote safety manual, did audits. Performed FAs and TSs as time allowed.

Performed FAs, TSs, and constructional analyses on electronic and other components—attenuators, cables, capacitors, circuit boards, connectors, crystal oscillators, diodes, fuses, hybrid microcircuits, inductors, integrated circuits, lamps, mixers, relays, resistors, resolvers, solar cells, thermistors, transformers, transistors, and some structural parts. Performed bench electrical testing, inspections, film radiography, hermeticity and particle impact noise detection testing, cross-sectioning, chemical etching, electrical microprobing, scanning electron microscopy and energy-dispersive x-ray analysis, infrared thermography, hardness and microhardness testing, and die bonding and bond pull testing. Wrote clear, thorough reports documenting all work. Served as lab safety monitor (after 6/87).