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Gerard has significant technology industry experience including planning, development, and leading both established and start-up engineering groups to deliver products on plan. Gerard has held management and executive leadership roles for a variety of technical functions including algorithm, system, software, test, VLSI, operations. His projects have included applications in voice, audio, video, imaging, MEMS, sensors, machine learning, and medical devices. Gerard is a hands-on leader bringing technical expertise to focus on product quality, team talent growth, and strategic customer engagements. Key Accomplishments:• Managed global R&D team of 200+ engineers • Developed products over 90M units shipped• Architected video, voice, imaging, sensor systems and algorithms, including machine learning for audio• Guided embedded, backend & mobile app software projects• Designed, verified & validated hardware and chips• Planned technology and product roadmaps • Directed matrix teams & agile execution• Supervised international teams in Canada, China, France, India, Poland, Sweden, and USA• Managed budgets, IP licensing, and tool suppliers• Ran merger technical due diligence & integrationExperiences and Skills:Competitive Analysis, Benchmark, Agile, Scrum, ULPArtificial Intelligence, Machine Learning, Deep Learning, Neural NetworkAutonomous Control, Self-Driving Car, Sensor Fusion, Kalman Filter, Mapping, LocalizationNN, DNN, CNN, RNN, LSTM, GAN, Pytorch, Torch, TensorflowTinyML, IOT, AIOT, NPI, NPD, MRD, PRD
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Vice President Of Engineering, Intelligent AudioKnowles Corporation 2018 - PresentItasca, Illinois, UsManaging a global engineering group encompassing algorithm, software, hardware, audio test, and product engineering. Developing voice and sound enabled technology products and solutions for mobile, IoT and hearable markets. Achieved volume production in mobile phones, videophone portals, and wireless headsets and speakers. Led next true wireless stereo (TWS) projects with integration of low-power edge machine learning.Technical experience: TWS, 14nm, 22nm, 28nm, TPR, FAR, IAR, Bluetooth, Agile, Scrum, Tensilica, Hifi3, Hifi5 -
Vice President Of EngineeringLeeo 2017 - 2018Hired and led engineers in a machine learning start-up. The CES Innovation Award-winning service included 2 iOS mobile apps, cloud & data backends, and an IOT device. Directed smoke, carbon monoxide, and water alarm sound classifier design based on Google VGGish neural network transfer learning.Technical experience: VGGish, Sound Classifier, devOp, iOS, EVT, DVT
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Vice President Of EngineeringConexant 2015 - 2017Irvine, Ca, UsLed global group of 90+ engineers. Products include voice-enabled IOT designs, Hearables & ANC, AMS designs. Directed development of active noise cancellation (ANC) chips & platform for TWS headset. Supported the process that led to acquisition by Synaptics. -
Director Of Engineering, Systems And ValidationInvensense, Inc. 2014 - 2015San Jose, Ca, UsLed systems engineering group for mobile, wearable, IOT, imaging, and audio markets. Validated MEMS gyro, accelerometer, and sensor hubs to specifications.Technical experience: MEMS, gyro, accelerometer, pressure sensor, sensor hubs, Zynq FPGA, ZedBoard -
Director Of Systems Engineering, Fairchild ImagingBae Systems 2011 - 2014London, GbLed imaging systems team developing computer vision, image signal processing (ISP), and high dynamic range algorithms for CCD and CIS cameras. Directed dental X-ray intraoral and extraoral sensors and software projects for FDA class-2 medical devices. Supervised test and characterization team for image sensors, modules, and cameras.Technical experience: CCD, CIS, CMOS imager -
Vp Of Vlsi Engineering, Home Entertainment DivisionZoran 2003 - 2011Sunnyvale, California, UsDeveloped SoC products that were built into over 90 million TVs and set-top boxes worldwide. Led and guided teams in algorithm, architecture, design, verification, simulation, emulation, validation, embedded software, and physical design. Cooperated with corporate functions in IP designs, applications, transfer-to-production, sustaining engineering, budgeting, contract negotiation, and technology related legal projects. Started as an engineer at start-up TeraLogic and grew to lead a global team of 100+ engineers through mergers with Oak Technology and Zoran, and across 15-year technology advances from analog TV to HDTV.Technical experience: LED-TV, 3D-TV, 120Hz FRC TV, TCON, conditional access, DDR, RF tuner -
Vice President Of Engineering, Oak Technology (Public Company Before Merger With Zoran)Zoran 2002 - 2003Sunnyvale, California, Us -
Director Of Vlsi Design, Teralogic Inc. (Start-Up Before Merger With Oak Technology)Zoran 1997 - 2002Sunnyvale, California, UsDTV and STB chip development leading to design wins at Samsung, SONY, and Mitsubishi. First mass production SONY consumer HDTV in Japan. -
Senior Design EngineerLsi Corporation 1995 - 1997San Jose, Ca, UsDesigned a 3D graphics accelerator unit for the SONY PlayStation2 project.
Gerard Yeh Skills
Gerard Yeh Education Details
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Stanford UniversityElectrical Engineering -
UdacitySelf Driving Car Engineer -
UdacityDeep Learning -
University Of California, BerkeleyElectrical Engineering And Computer Science
Frequently Asked Questions about Gerard Yeh
What company does Gerard Yeh work for?
Gerard Yeh works for Knowles Corporation
What is Gerard Yeh's role at the current company?
Gerard Yeh's current role is Technology Executive.
What is Gerard Yeh's email address?
Gerard Yeh's email address is ge****@****ail.com
What is Gerard Yeh's direct phone number?
Gerard Yeh's direct phone number is +140898*****
What schools did Gerard Yeh attend?
Gerard Yeh attended Stanford University, Udacity, Udacity, University Of California, Berkeley.
What skills is Gerard Yeh known for?
Gerard Yeh has skills like Soc, Firmware, Engineering Management, Consumer Electronics, System Architecture, Digital Tv, Product Development, Semiconductors, Systems Engineering, Algorithms, Digital Video, Analog.
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