LiDAR Engineerhttps://sdc.yandex.com/

We created multi-material printhead capable to deal with PEEK, feedstock and other "common" printing materials.

Implemented collaborative cloud CAD solution for: - version control ; - files exchange; - easy cross-device web view and control.Development of wearable products and devices:  - glasses with lifting rim;  - active noise canceling headphones;  - wearable bluetooth electronics with integrated media center.

Identified and reduced bottlenecks which increased productivity in 4 times.Implemented standard operating procedures.Reduced DPU from 0.9 to 0.4. Automated the process of controlling raw material consumption.Improved supply chain efficiency by implementing automating purchasing and inventory management. - processes that require an excess of working time were identified (bottlenecks); - special tools were selected and purchased, an additional unique equipment was developed and manufactured, which significantly reduced the time spent on performing the processes, which are the bottleneck of the production cycle; - an updated timeline for the process of manufacturing blocks has been created for the updated time intervals; - an additional 2 sets of equipment were introduced to parallelize the manufacturing processes of the remaining bottlenecks; - a strict technological map of the production cycle was developed and communicated to the performers; - regular monitoring of compliance with the technological map was introduced.Unique 3D printer development.Developed paraffin 3D printer based on unique technology of paraffin deposition and carefully tuned the printing process.

Reduced customer complaints within the first month of exploitation from 2 to 0.5 issues per unit.Lowered the production cost by 15% by improving the design of the product and revising production network.

In addition to previous responsibilities in MCST:Design of electrical wire bundles (both power and signal) for equipment designed in the company (large racks with electronic equipment, stand-alone electronic equipment) using products of well-known companies (such as Molex, Samtec, TE Connectivity, Amphenol, Foxconn, 3M). All wires were also modeled in detail in 3D software (SolidWorks Pipes) for further using in PDM system. Design of cable distribution elements for unique electronic cases and server racks.

Design of cases, racks and enclosures for electronic equipment. Design of heat sinks for unique appliances.Selection of third-party components for equipment developed at the company: power supply units, cooling fans, heat-sinks, standard case elements, electric filters, connectors, plugs, power and signal wires, relays.Creation of complete sets of design documents for the products under my development: assemblies, specifications, electrical schematic diagrams, electrical connection diagrams, datasheets, detailing