Gilbert Shi Email & Phone Number

Shanghai, CN

Shanghai

Power & Signal Conversion IC BG Quality Head

Shanghai

• 5 Departments reporting, Fab QRA, Product Quality, QMS-DCC, Product QRA Lab & Wafer Analysis Lab;
• Shanghai Fab has 2 wafer fabrication plants (until 2021 end)and is producing 6” and 8” wafers with more than 1200 employees;
• QRA Org had support SFAB Site to achieve 200M USD Sales Revenue in 2016;
• QRA supporting scope not only included wafer fabrication activities, but also local product group/BU;
• 4 Analog IC product groups sitting in SFAB Site;
• 5 Discrete BU had started volume production in SFAB site;

Shanghai City, China

• Complete BE Operation team including subcontractor operation and Enhance Quality team from 2015 Oct.
• Continue 2nd source development strategy and build more major subcontractors.
• Capex plan owner for WeEn.
• Protect, monitor and create gross margin as WeEn Management Team member
• Justify business case with overview strategic thinking to product technology, manufacturing, quality and cost
• Build industrial strategy for WeEn.

Shanghai City, China

Shanghai, China

Operation:- Integral interface between Product Line Bipolar and Internal assembly & testing sites, Subcontractor Operation team and Foundries / Waferfab; interact with BU SP OPR Manager- Select, evaluate, assess and develop new subcontractors in alignment GEM- Set up proper business control and process flow;- Support new product release as industrial.

RFID equipment lead provider, major in electronical article security system for retail supermarket.; Build up supplier evaluation criteria and scorecard Build up supplier corrective action, supplier part submission and supplier selection process.Set up quality criteria for plastic parts in newly developed China suppliersCharged to all the commodity.

Supplier Development Engineering, Corp ISCCharged comprehensive Quality functions including: New part qualification, Supplier Quality, Supplier Plant Audits, Process Change Management, and Six Sigma implementation. Qualified Semiconductor (Digital/Linear/Logical) parts with PPAP, Top defect matrix, PSO, FMEA, FAI and control plan tool. Managed and improved.

Managed 3 Assembly and Testing Subcontractor Plants. Directed Supplier Quality in China region to meet customer Quality goals. Directed process improvements in subcontractor assembly line. Assisted Global Packaging Engineering team to decide non-confirming material on line. Interfaced with key suppliers and subcontractors including: ASE Material

Developed local subcontractor plant to start volume production for PBGA and EPBGA package type.Released Bonding Diagram with confirmation with Distribution list.Support Supplier Quality team to conduct on line assessment.Defined and released assembly process and bonding diagram to subcontractor. Analyzed failure from assembly line and customer end, and.

Achieved new package type introduction into Tianjin assembly plant smoothly in 2001 Led cross function team to introduce QFN from HKG plant to Tianjin.Coordinated MAP BGA, SOIC, DIP and QFN assembly line to support on time delivery and resolve all the technical issue.Improve wire bonding process capability with increasing Cpk from 1.0 to over 1.67.Evaluate.

Master Of Engineering Science, Engineering Mechanics

Bachelor Of Engineering Science, Automotive Engineering