• Analyze WLCSP product field failures and internal rejections to determine fundamental causes and patterns of customer-caused or defective component failures.• Presents data and FA report in meetings with other functional peer groups.• Focal person for the maintenance, spec. modifications, and improvements of the PVA Tepla CSAM tool.• Supervise FA technicians to ensure that FA functions are performed in a methodical manner.• Writes thorough FA reports that include root cause and/or failure hypotheses.

• Perform failure analysis on components from in-process failures, customer rejects, and other internal rejects.• Analyze the electrical, thermal, and mechanical characteristics of integrated circuits, components, sub-components, and systems to determine the underlying cause of failure.• Responsible for analysing Analytical requests from Assembly, Reliability and Quality Test Departments.• Validate electrical failures and analyze the data taken during retest of returned materials to correlates result on customer complaint.• Familiarity with bench test equipment and setup to validate device failure.• Perform electrical fault isolation such as PEM, OBIRCH and LCTA to locate the potential failure mechanism.• Conduct circuit analysis using a device layout and schematic tool.• Perform mechanical die probing.• Perform destructive analysis such as decapsulation (laser ablation and chemical), die delayering/deprocessing, mechanical lapping and cross section.• Providing detailed failure analysis report based on analysis findings.

• Focal person for the set up of production lots for test.• Performs handler conversions –kit change and critical alignments of different packages.• Troubleshoots setup break down like O/S over rejection and other functional failure.• Help improve the yield of set up and reduce unscheduled downtime.