Glenn P. Charest Email & Phone Number

Menlo Park, Ca, Us

Leading the development of the next generation OCP ORv3 Open Rack, power, and liquid cooling , and related components. Development work streams include the frame, power interfaces & solutions, connectors, rack accessories, IT gear interfaces, and specifications.OCP ORv3 Blind Mate Liquid cooling Subproject lead. The group consists of international coalition of suppliers & insustry experts working to develop rack interfaces, blind mate manifold designs and interfaces, blind mate quick connector valves, hose and tubing solutions, and unique liquid cooled IT gear designs & interfaces.

San Jose, Ca, Us

Design Lead for the development and design of Next Generation servers and storage products. Design involvement from high level architecture to detail design. Led a small team to collaborate with XFN partners to develop the best overall design. Utilized Pro/E, designblank sheet to completed designs including plastics, bus bars, die castings, PCB layout (IDF process), motion control, mechanisms, power supply form factor, sheet metal design, and rack mountrail designs. Work with manufacturing partners on tool design and process. Worked closely with connector manufacturers on connector selection, custom designs to meet application needs, and developing real world testing to ensure they will the system requirements. Perform FEA (Mechanica) on key designs to ensure designs will meet functional and test loads. Worked with cross functional teams to develop custom power supply solutions. Developed several innovative designs with patents pending related to cooling and mechanical design. Worked closely with International partners to develop custom 19" rack (Cisco R42612) and powersolutions for the data center. Working with cross-functional teams developedthe design & test specifications. Drove testing, failure analysis and design improvements.The new rack design offers improved cable management, power distribution, structure, and shock & vibration performance.

San Jose, Ca, Us

Lead the development of several UCS blade servers including Cisco B250M2 and B420M3. Provided design enhancements to M440M2 & B230M2. Lead the development of design enhancements to the UCS 5108 chassis including new power solutions (48VDC, HDVC, and dual volatage), tool-less rack rail kit,and power distribution modules.In charge of the parallel design and manufacture of multiple 1RU fabric extenders including Cisco Nexus 2232PP, 2224TP, 2248TP, and other cost reduced variations. Utilised Pro/E to do all detail design work including printed circuit boards, chassis, fan tray and PSU. Worked with thermal engineer to develop innovative ducted cooling. Developed a design concept that became a patent: US patent # 9,017,020 "Configurable fan unit". Managed the thermal testing and provided the team with appropriate thermal thresholds for normal operation as well as during service conditions. Worked closely with test teams to resolve EMI, MDVT and service concerns. Worked the our suppliers on modular tool design that allowed tools to be leveraged across the product family.

Lead a team of engineers on an enclosure design for a storage product including power, packaging, EMC, safety, and cooling. Developed several high level design concepts and worked with program management, electrical engineers, marketing, service, safety and EMC engineers, and industrial design to refine the concepts into a product. Prepared and presented a product presentation to the Team using Power Point, before detailed design began, to ensure the Team understood the design, define the plan, and get Team consensus. Response to the presentation was phenomenal. Through the product website, posted reports, drawings and concepts, analysis, BOM’s, and other key information for the project. Made early mock-ups to perform space studies, initiate Team dialog and feedback, measure bulk airflow and local air velocities, and test and compare various cooling solutions to determine the best design. Performed preliminary thermal calculations to estimate component temperatures, determine high risk components and heat sink design requirements. Worked with suppliers to locate and specify cooling fans, heat sinks, and thermal interface material. Working with other cross-functional engineering groups, developed the design schedule and DVT test plan. Directed and oversaw the efforts of the mechanical engineers supporting the project via schedule reviews, dissemination of tasks, and reviewing proposed design concepts. Utilizing Pro/E, designed the enclosure including overall layout, detail sheet metal chassis design, physical PCB layouts and component placement (IDF process), cooling solution, power supply selection, EMI containment, connector selections, custom cable harnesses and cable management, status indicator placement, plastic light pipes, rack mounting strategy, and tolerance analysis.

Design of a of a high density sheet metal 3RU disk array enclosure. Areas of responsibility included power supply housing/cooling module and ejectors/handles, EMI containment, PCB layout and component selection for several boards, disk controller assembly, rack-mount kit, plastic light pipes, and a plastic connector alignment design. The connector alignment part saved the company warranty costs by minimizing impact to the architecture and preventing bent connector pins. Managed and supervised plastic mold designs and sheet metal hard tool designs in Asia and domestically. Utilized the product web page to manage tooling drawing revisions and changes. Consulted on design of a disk drive bracket assembly. Performed stress analysis of the design utilizing Pro/E and calculations. Provided recommendations based on the analysis. As a result, design changes to strengthen the ejector handle and pivot pin were implemented. Consulted on Pro/E surface model changes to the contoured bracket.Key Team member involved in the design of small form factor high density 2RU disk array. Provided design assistance for the overall enclosure design. Through review of the overall design, made many design improvements to improve fit, function, quality, and ease of manufacturability (DFM). Designed the rack mount kit for the product.

Palo Alto, Ca, Us

Researched and recommended product environmental specifications based on competitors, end-use environments, international standards, and experience. Managed product testing in acoustics, altitude, humidity, mechanical drop and shock, temperature, vibration, and other end use simulating tests. Frequently operated test equipment including vibration tables, climatic chambers, and analyzers. Managed test technicians performing the testing. Through creative planning, maximized test leveraging of products minimizing test costs. Performed modal analysis of computer systems to identify response modes and potential areas for improvement. Documented and managed test reports, test plans, test status, test/product issues, and product specifications.