As the Lead Developer and Manager of the Integrations Team my responsabilities involve:• Planning developments with other teams. • Architecting cloud solutions that meet the needs of stakeholders. • Building the technical bridge between EDP Comercial and partners.• Supervising other developers.• Ensure quality of developments.

• Responsible for the backend development of EMCP cloud platform, used by EDP Solar clients in Iberia region.• Design and implementation of serverless cloud solutions using microservices like Lambda, API Gateway, Athena, S3, Cognito, IAM, RDS, DynamoDB, ElasticCache, VPC, EventBridge, Cloudwatch, SQS, SNS, etc.• Use of Bitbucket, AWS Cloudformation and Bash as DevOps tools.

SMEAP project collaboration:• Mantained a cloud data stream for IoT devices and developed monitoring dashboard.• Utilized AWS services (Kinesis, Lambda, Cloudwatch) and various technologies (Django, JavaScript, JQuery, HTML5, CSS, Bootstrap, DynamoDB, RDS) for implementation.• Project focused on using Machine Learning for flood prediction but put on hold due to the pandemic.Solo project as a full-stack developer:• Developed web application for cloud storage, integrated with AWS S3.• Utilized AWS services (IAM, Cognito, Lambda, S3, API Gateway) and frontend technologies (Django, JavaScript, JQuery, HTML5, CSS, Bootstrap).• Project involved migrating office servers' storage to the cloud and creating a user-friendly web app.Consilium project:• Built web application for online shareholders meetings.• Leveraged AWS services (RDS, EC2, Lambda, API Gateway) for database, logic operations, and REST API development.• Collaborated with frontend team for integration.

• Worked in the development of an electronic nose.• Co-supervised a master's thesis student for 6 months, providing support and assistance with daily tasks.• Co-mentored students from the University of São Paulo (Brazil) for 3-month periods as part of an exchange program.• Worked under the project "SCENT: Hybrid gels for rapid microbial detection," funded by the European Research Council (ERC-2014-StG-639123).

For one month, I worked as an intern at a company that produces electronic components, where I measured the thickness of the final tin plating and analyzed the data using quality control tools.