Provide project and technical leadership within Materials Technology/Advanced Development group.• Responsible for identification/selection of materials and associated processes which are capable of providing necessary design functionality and performance.• Responsible for identification of technical risks and recommended mitigation activities.• Function as liaison between Materials group and other groups (e.g. Design, Manufacturing, Reliability) to ensure alignment to technical and schedule requirements.• Took on role as interim manager in Sept 2012, currently transitioning responsibilities to new Materials Director.• Leading development of new conductor, electrode, and coating materials.• Leading development and integration of materials and materials processing technologies for next generation MRI-safe Tachy, Brady, and CRT leads.

Provided technical leadership to develop new materials technologies for use in implantable pacing/defibrillation lead platforms and products.• Defined and maintained group strategy and roadmap for metals-related materials and technologies. • Advanced and applied materials technologies and technical rigor to troubleshoot and solve complex problems. • Partnered with technology and new product development teams to identify and develop new materials and processing technologies for improved quality/reliability, competitive/design advantages, lower cost etc. • Collaborated with global sourcing and other functional groups to develop and manage key suppliers and commodities/components, and to troubleshoot issues and qualify/implement changes. • Collaborated with business development teams to identify and assess new technologies. • Used critical thinking skills, design for reliability and manufacturing (DRM) principles, and analytical tools. • Managed engineers/technicians and lab. Responsible for cost center management. Actively participated in annual strategic and budget planning processes.

Proposed and championed creation of a Materials Technology group within the Tachyarrhythmia Leads organization to drive development of materials needed for the anticipated growth in the defibrillation leads market.• Developed Platinum/Iridium-clad Tantalum wire as a lower-cost replacement to solid Platinum/Iridium defibrillation electrode wire, and implemented in the Medtronic Sprint Quattro lead platform.• Led Materials Technology group through reorganization and consolidation of Brady/Tachy into CRM Leads. • Responsible for managing new cost center, planning projects/resources, and executing projects per plan. • Leveraged existing expertise and knowledge to expedite implementation of new materials/processes. • Provided materials expertise and training to all functional groups on the development teams. • Supervised and mentored engineers, technicians and interns in the materials group, and mentored/advised colleagues from other functions in the organization.

Design Engineer and Project Leader in Tachyarrhythmia Leads organization.Primary Design Engineer for a novel defibrillation lead, the world’s first active-fixation lead based on multilumen construction:• Solved key problem identified at the start of the clinical study and partnered with clinical and regulatory representatives to quickly implement required design changes.• Met with key opinion leaders and other physician customers, and reviewed returned product data to define and design product attributes and features.• Worked effectively with all functional representatives on the team to develop, evaluate, and qualify components and the final lead design assembly.• Coordinated bench/animal testing, drafted regulatory submission documents, and supported human clinical studies for market-release.• Materials and features developed for this lead have enabled the current generation of active-fixation pacing and defibrillation leads marketed by Medtronic and our competitors. Designed, developed and successfully led a team responsible for transferring a molded silicone connector adaptor product to a European manufacturing operation.

Responsible for project leadership in solid state chemical sensor technology group.• Led project to investigate silicon fusion bonding as a process to complement anodic bonding, and partnered with product/process engineering to transfer technology• Invented and developed novel silicon micromachining, wafer sealing, and packaging processes necessary to produce a helium-hermetic silicon microvalve. Received patent related to this work.• Performed proof-of-concept and early-stage development of a solid state trace moisture sensor. Designed device/package interface and developed processes and test methods to ensure conformance to product requirements. Interfaced regularly with marketing, customers, design and manufacturing functions.• Characterized iridium oxide thin films used in a pH sensor, using scanning electron microscopy, energy dispersive x-ray spectroscopy, transmission electron microscopy, x-ray photoelectron spectroscopy, Auger electron spectroscopy, and x-ray diffraction techniques.• Designed a flow-through gold-plated kovar package and developed associated processes for assembly of a suspended thin film platinum filament thermal mass flow sensor.• Regularly presented program status at quarterly and design reviews. Consulted frequently with Manufacturing Engineering on various packaging issues. Provided work direction for two technicians.

Responsible for sustaining and developing lithium-iodine battery manufacturing processes, and equipment design/qualification. Participated in new product design and aided Development Engineering in transfer of new designs to Manufacturing. Resolved process/material problems and product performance issues as needed.

Reliability Engineer: Responsible for bipolar and CMOS IC reliability assessment - predicted failure rates and device lifetimes. Initiated and lead a "Product Monitor Program" to provide accelerated life test and reliability feedback to Operations and customers.Packaging Development Engineer: Assisted in monolithic and multichip module assembly development and Tape Automated Bonding process development and failure analysis. Responsible for selection and qualification of device assembly contractors.Production Engineer: Responsible for the wirebonding process used in semiconductor IC and hybrid packaging, resulting increased yields and decreased scrap/rework. Conducted process development and qualification of products, materials, and equipment using DOE techniques. Implemented SPC and held "Zero Defect" meetings with operators/technicians. Generated and maintained all wirebond process documentation.

Product Design Engineer: Responsible for battery design, development, and introduction to Manufacturing. Procured required materials and tooling, built and evaluated design verification/ qualification test samples, and generated necessary documentation. Interfaced regularly with customers, Marketing, and Manufacturing.Metallurgical Engineer: Evaluated product and process problems, and participated in product liability failure analysis and materials development. Initiated and coordinated a lead alloy analysis program with vendors and Manufacturing. Developed skills in metallography and microstructural analysis.