Accountable for the Deep Ultraviolet Laser New Product Development, Continuous Improvement, and Cost Reduction Engineering. Functional Design Engineering: Systems, Plasma Chamber Modules, Optical Modules, and Mechanical. Ensured technical leadership and excellence is maintained by leading in the planning, selection, retention, and development of the required management, professional, and technical talent. Managed the establishment of design concepts, criteria, and engineering efforts for product development, testing, and integration. Responsible for the release of all engineering documentation and transition of designs to manufacturing. Designed and executed system and module validation tests. • Developed the Requirements Management System to drive appropriate design requirements across multiple modules and software. • Developed and released new products to reduce the spectral bandwidth variation by 90% resulting in tighter critical dimension uniformity (CDU) during exposure. • Oversaw the technology development and hardware validation tests to introduce a new product operating at a lower and tighter spectral bandwidth, an improvement of 67%. • Reduced plasma chamber electrode material evaluation cycle time through the design and implementation of a materials test apparatus. Reduced material evaluation cycle time by 10X. • Implemented a new electrode material and shape resulting in a plasma chamber lifetime improvement of 11%. • Implemented optics damage criteria to qualify the re-use of optical elements while balancing reliability risks. Resulted in $7M annual savings with no impact to laser reliability. • Formed, led, and championed a cross-functional engineering team to resolve a fatal metrology error. Identified the root cause and implemented solution reducing the error rate by 98%. • Program manager for a process gas recovery and recycle system. Validation tests resulted in a 90% reduction in process gas consumption.

Accountable for all Mechanical Functional Engineering for the Extreme Ultraviolet (EUV) and Deep Ultraviolet (DUV) products. Utilized Cymer's Configuration Management system to release BOMs, part drawings, and specification documents. Specific EUV designs include the plasma vessel, tin droplet generator/catcher, and optical-mechanical modules. Led the mechanical utilities & interconnects designs. Developed manufacturing and field tooling designs. Designed and executed system and module validation tests for EUV and DUV. Awarded additional management responsibilities for the Systems and Module Engineering teams.• Instituted engineering processes that include: requirements gathering and validation, concept design reviews, design concept down-select, final detailed design reviews, drawing reviews, and validation tests. The process clarified design requirements and identified design gaps to resolve during the design phase thus minimizing prototype errors.• Designed and released the first operational prototype EUV plasma source; designed, released, and shipped the first pilot EUV plasma source.• Developed and integrated CMOS photo diode array (replacement for NMOS), resolved a reliability issue with the wavelength metrology module. Module reliability improvement of 60%.• Generated DUV module lifetime tracking and paretos for de-install causes to identify the top loss leaders for early module replacement in the field. Utilized this information to drive continuous improvements for all DUV modules.

Managed multi-disciplined team for designing and developing a laser based wafer singulation system. This $3 million program was ESI’s most recent ground up machine design with eight month duration from the feasibility study to customer shipment of the first pilot system. Project Management of cross-functional team, project actual cost, completion cost estimates, project schedule, risk management, and managing the transition to manufacturing. The project involved mechanical, electrical, firmware, software, laser, and optics designs, development, verification, and testing.• Drove adherence to ESI’s New Product Introduction (NPI) process and requirements.• The system met requirements and was released to production on schedule.RD&E Semiconductor Link Processing Program ManagerManaged Semiconductor Link Processing group’s 9850 dual beam memory repair processing tool. The tool was released to the market in 2006. Managed project cross-functional team of 15 individual contributors.• The system met the performance requirements and was released to production on schedule.RD&E Platform Development Program ManagerManaged development team for ESI’s internal common control system platform. Responsibilities included development and execution of project plan, schedule, cost, completion cost estimates, and deliverables to internal customers. The platform consists of new PCB designs, firmware, and software.• The control system has been released for use and deployed on ESI systems.

Recruited back to Merix by the CEO as a Process and Equipment Engineering Manager to lead the engineering effort in implementing a green field world class printed circuit board (PCB) manufacturing facility in Wood Village, OR. Managed multiple site manufacturing engineering teams. Equipment selection, layout, installation, and production start-up. Managed program schedule and budget ($42M). The factory was designed for high technology, high volume production to double Merix’ printed circuit board production capacity.• Delivered the new Wood Village facility per schedule and within budget.• Implemented the first integrated and automated liquid imaging line that doubled the inner layerproduction capacity (preclean through auto-print processes).• Successfully met internal and external customer qualification requirements on time.

Managed team of Engineers in support of developing Intel’s first 300mm wafer fab. Research and Pathfinding (RP1) Fab program manager leading a cross-functional team.

Accountable for all Mechanical Process Engineering for the Printed Circuit Board facility.