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Greg Burda Email & Phone Number

Director, Engineering at Microsoft
Location: Raleigh, North Carolina, United States 6 work roles 1 school
2 work emails found @microsoft.com LinkedIn matched
✓ Verified July 2026 4 data sources Profile completeness 100%

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Current company
Role
Director, Engineering
Location
Raleigh, North Carolina, United States
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Greg Burda is listed as Director, Engineering at Microsoft, a with 231118 employees, based in Raleigh, North Carolina, United States. AeroLeads shows a work email signal at microsoft.com and a matched LinkedIn profile for Greg Burda.

Greg Burda previously worked as Director Of Engineering at Microsoft and Director, Engineering at Qualcomm. Greg Burda holds Bsee, Electrical Engineering from Wilkes University.

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{first}.{last}@microsoft.com
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Profile bio

About Greg Burda

Highly-motivated, results-driven technical leader of teams developing high-speed, low-power memories and foundational IPs across a broad range of compute and artificial intelligence products. 20+ years of experience with a track record of productive collaboration across a variety of teams, including architecture, physical design, CAD/EDA, DFT, process technology, post-silicon, and product engineering teams. From concept to productization, my team's charter is to provide differentiated memory and DTCO standard cell IP and solutions that give Microsoft products a strategic advantage in the marketplace.

Listed skills include Eda, Circuit Design, Microprocessors, Testing, and 5 others.

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Microsoft
Microsoft
Director, Engineering
Raleigh, NC, US
Website
Employees
231118
AeroLeads page
6 roles · 29 years

Greg Burda work experience

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Director, Engineering

Raleigh, Nc, Us

Director Of Engineering

Current

Redmond, Washington, Us

Director of circuit and CAD/EDA team designing memory and foundational IPs for a broad range of compute and AI products. Custom memories, DTCO stdcell, clocking circuits, storage elements, structured datapath, testchip design on multiple process nodes with full RTL-to-GDS responsibilities and more. CAD/EDA teams develop methodologies for simulation, LPE, physical verification, timing, functional verification, infrastructure, etc. Created scalable architecture for advanced process node testchips and led teams performing RTL, DV, PD, circuit, board & package, and post-silicon characterization.

Jul 2018 - Present

Director, Engineering

San Diego, Ca, Us

Manage a team of 40 custom digital circuit, methodology, post-silicon characterization, and mask layout designers in the development and productization of high-performance, low-power mobile (Snapdragon) and server (Centriq) products. All products demonstrate industry-leading power-performance metrics. Team has designed custom SRAM, custom and compiler register files, CAMs, pulse latches and stdcell libraries in technologies ranging from 45nm to 7nm with performance up to 3GHz+.Drive team members to the on-time delivery of circuit deliverables such as LIB, LEF, GDS, APL, CMM. Ensure high-quality, error-free delivery through the development of a detailed and thorough release checking system. Able to quickly react to technology PDK revisions with little-to-no schedule impact.Circuit techniques include custom single Vdd bitcell design, 6T/8T/10T SRAM memory arrays, read/write assist, static/dynamic comparators, multi-Vdd domains, single-ended/differential sensing, low-skew clocks. Performed PPA evaluations of various stdcell library architectures across multiple technologies.Work closely with foundry suppliers on new circuit technology initiatives such as diffusion-bridged libraries, custom single Vdd bitcells, groundrule relaxations, yield improvements. Designed and did post-silicon characterization of testchips for next-generation CPU and technology development. Post-silicon test team tasks included development of random instruction generator, targeted vectors, debug of Vmin-limiting paths, triage and debug of RMAs, work with foundry and process team on DLY and PLY detractors. Methodology team supports simulation environments, timing and power characterization, and Cadence tool suite, PDK. High-sigma statistical analysis, Hspice, Hsim, Finesim. Various custom methodologies written to support circuit team.Mask layout design team for custom digital and analog circuits. Attention to LDE, yield detractors, layout efficiency, DFY/DFM.

2008 - Jul 2018

Cpu Circuit Designer

San Diego, Ca, Us

Lead custom circuit designer for multi-port CAM-RAM used as part of Execution Unit Register Renaming Scheme. Fully-associative CAM-RAM with multiple tag-write ports, CAM search ports, RAM read ports. Schematic and layout entry in 45nm, 65nm, and 90nm process technologies. Designed CAM bitcell with read ports, row/column circuitry, decode, matchline hierarchy, input/output latches. RAM bitcells, read precharge/evaluate circuits. Write-through-read comparators and bypass circuitry. Performed Hspice/Hsim circuit analysis. Supported BIST testplan and ATPG scan methodologies.Layout tasks included floorplanning, wire track planning, noise shielding considerations, power grid, transistor-level layout. DRC/LVS/ERC, antenna checks.Schematic-to-RTL verification with ESPCV symbolic checks, functional SLS, BIST SLS. Statistical analysis for bitcell write-ability, read, keeper sizing.Interfaced with process technology team on technology issues related to CPU low-Vt transistors, bitcells, spice models. Worked with team to develop a principal-component variation model for statisical analysis.

2003 - 2008 ~5 yrs

Cpu Circuit Design Engineer

Ibm

Armonk, New York, Ny, Us

Custom circuit design engineer for embedded microprocessors. Performed full-custom digital design for multi-port register files. Read/write decode, bitcell design, local-to-global bitline design, scan test methodology. Also performed mask layout design for register files in 90nm, 130nm, 180nm technologies. Supported in-house parasitic extraction methodologies, batch submission jobs. Shell script and GUI for job submission. Performed various debug and support of RC and device extraction issues.Spearheaded efforts for custom macro design team to use in-house formal verification for schematic-to-RTL equivalence checking. Also moved team into Innologic symbolic verification engine for schematic-to-RTL equivalence checking.

1998 - 2003 ~5 yrs

Electrical Engineering Intern

Ibm

Armonk, New York, Ny, Us

Worked in EDA team charged with developing in-house device-level parasitic extraction tool (ERIE). Created layout testcases and performed HSPICE benchmarking analysis of ERIE vs. 3-D field-solver extractions.

May 1997 - Aug 1997
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1 education record

Greg Burda education

  • Wilkes University
    Wilkes University
    Electrical Engineering
FAQ

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What company does Greg Burda work for?

Greg Burda works for Microsoft.

What is Greg Burda's role at Microsoft?

Greg Burda is listed as Director, Engineering at Microsoft.

What is Greg Burda's email address?

AeroLeads has found 2 work email signals at @microsoft.com for Greg Burda at Microsoft.

Where is Greg Burda based?

Greg Burda is based in Raleigh, North Carolina, United States while working with Microsoft.

What companies has Greg Burda worked for?

Greg Burda has worked for Microsoft, Qualcomm, and Ibm.

Who are Greg Burda's colleagues at Microsoft?

Greg Burda's colleagues at Microsoft include Path An, René Höppner, Jess J., Ahmed Essid, and Ali Boubou.

How can I contact Greg Burda?

You can use AeroLeads to view verified contact signals for Greg Burda at Microsoft, including work email, phone, and LinkedIn data when available.

What schools did Greg Burda attend?

Greg Burda holds Bsee, Electrical Engineering from Wilkes University.

What skills is Greg Burda known for?

Greg Burda is listed with skills including Eda, Circuit Design, Microprocessors, Testing, Verilog, Integrated Circuit Design, Processors, and Asic.

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