Greg Ison Email & Phone Number

Holland, Michigan, United States

GREGORY ISON260-433-4118 Huntertown, IN 46748 gwison@comcast.netLinkedIn URL: gregison1959SUMMARYPrincipal Manufacturing Engineer with expertise in low/medium volume high mix Circuit Card Assembly (CCA). Emphasis on surface mount assembly meeting IPC 610 Class 3 workmanship standards. Self-motivated team player continuously looking for ways to improve efficiency, throughput and yield.• Defect Analysis • Process/Yield Improvement• New Product Introductions • Production/Technical Support• Capital Equipment Justification • Capacity AnalysisPROFESSIONAL EXPERIENCEYANFENG AUTOMOTIVE INTERIORS, Holland, MI 11/2016 to 4/2020 SMT/PCBA Process EngineerPart of 5 person team tasked with setting-up the first in-house Circuit Card Assembly operation at Yanfeng Automotive Interiors to support initial production of 1.6 million CCA’s per year for automotive overhead console electronics.• Implemented connector lead trim process to reduce solder bridging at select solder from 70% to less than 2%.• Performed DFM on panel design to reduce warpage and decrease select solder cycle time by 17%.• Provide support to meet production schedule of 2.6M CCA’s across 9 programs.• Program and support screen printer, reflow oven, select solder, conformal coat, laser marker and SPI/AOI.• Perform DFM reviews on PWB design.• Performed capacity analysis for SMT Placement, Selective Solder, Conformal Coat, Manual Assembly.• Assisted in developing floor layout and production flow for SMT Placement, Select Solder, Conformal Coat, In-circuit Test and Router workcells with future addition of second SMT placement line. • Wrote work instructions, machine operating procedures, PM’s and trained 20 operators on SMT assembly equipment, selective solder and conformal coat.

Fort Wayne, In

Provided support to the Circuit Card Assembly (CCA) work center to meet production schedules, New Product Introductions, process/yield improvements, performed capacity analysis, capital equipment research/justification, and production floor layout.• Programmed and provided production floor support for 6 Surface Mount Technology (SMT) assembly lines, meeting a production schedule of 25k CCA’s per week.• Analyzed quality/workmanship/test defects to determine root cause then implemented corrective action to maintain a 97% first pass yield at in-circuit test.• Supported the company transition of Circuit Card Assembly production and SMT assembly equipment from Fort Wayne to Rochester, New York, creating new line layout for 2 new SMT lines and developing placement programs for 58 circuit card assemblies.• Trained engineers, technicians and operators on equipment operation, ensuring smooth transition and meeting production schedules/deliveries by spending 13 weeks in Rochester, NY, assisting in start-up of all SMT assembly equipment.• Evaluated, cost justified and directed installation of $3M in Capital Equipment, supporting New Product Introduction (NPI) Circuit Card Assembly in the newly formed Advanced Manufacturing Center (AMC) while providing a dedicated assembly area to support Design Engineering.• Provided technical/manufacturing engineering support for all NPI CCA’s..• Determined the additional type and quantity of surface mount assembly equipment required to support a ramp-up from 1,000 to 6,000 military radios per month by performing capacity analysis; cost justified and oversaw installation.• Increased in-circuit first pass yields from 94% to 97% using pareto metrics, in-circuit test data and defect analysis by supporting cross-functional team.• Performed solder paste evaluation and developed process to support component miniaturization (1005/ 0201 chips, 0.4mm pitch QFP’s/BGA’s, 0.2mm Flip Chip’s and QFN’s) being designed into new products.