Principal Manufacturing Engineer with expertise in low/medium volume high mix Circuit Card Assembly. Emphasis on surface mount assembly meeting IPC 610 Class 3 workmanship standards. Self motivated team player continuously looking for ways to improve efficiency, throughput and yield.Defect Analysis -- Process/Yield Improvement -- New Product Introductions -- Capacity Analysis --Production/Technical Support -- Capital Equipment Justification
Listed skills include Manufacturing, Engineering, Process Improvement, Engineering Management, and 9 others.