Guan-Wei Li Email and Phone Number

• Evaluating the package proposal which includes package type, package size, substrate layer count based on the chip design requirement and figuring out the cost competitive solution with good performance • Choosing appropriate assembly supplier for the product based on process capability assessment then cooperating with supplier to make sure the quality of product and delivery date can meet client’s requirement• Cooperating with SoC designer, figuring out the best pad/bump assignment and distribution of power/ground domain to enhance the substrate design • Completing the substrate design, working with package simulation team, performing electrical simulation and thermal simulation to optimize the package structure, elertrical performance and thermal performance of the product • Participating and supporting package development for new project to lower the risk of failure • Discussing package roadmaps with subcontractor and designing the test vehicle to bring in the new assembly technology• Assembly yield and engineering improvement (FCCSP/FBGA/SiP/FCBGA/PBGA/WLCSP/LF)

• Bringing in new assembly process, optimizing the process parameters through DOE• Solving the issue of production line• New product introduction