· Leading the development of a manufacturing ramp-up strategy, equipment capacity, hiring matrix and process improvement initiatives to scale current production to automotive volumes - Includes sourcing and selection for volume contract manufacturing - Mapping and resource planning of competency gaps - Capacity and project planning for implementing ramp-up plan· Responsible for the management and performance of 4 teams consisting of 4 team leaders and 14 engineers and technicians. - Manufacturing production support for equipment, material and quality issues - Assembly and test process development and validation - Manufacturing equipment selection, sourcing and qualification - Equipment calibration and maintenance activities for manufacturing

· Responsible for leading and growing a team of NPI Engineers to support the manufacturing implementation and transfer of new prototypes and various product features into Pilot Manufacturing from Product Development· Drive implementation of process improvement activities to improve quality, yield and cycle time of released products in Pilot Manufacturing

Led the RemoraPlus printhead product development as Technical Core Team Lead/Project Manager from process development in Sydney through to manufacturing set-up and transfer in our Taiwan manufacturing plant· Successfully led a task force that addressed a color-mixing product failure due to CTE differences between the encapsulation material used and our plastic substrates; this resulted in a change in the scope of the project that continued manufacturing transfer· Successfully introduced and qualified a new epoxy-based potting material (and associated dispense equipment) to replace the existing material that was obsoleted by our external supplier; this led to a 2-month risk production period with no stoppage to the manufacturing line

- Responsible for managing and assessing the process build health of printhead products from development through to manufacturing using statistics and yield analysis, failure analysis and root-cause analysis investigations. Key focus areas involve front-of-line assembly involving die-attach, wirebond and encapsulation.

· Completed the manufacturing release of Remora printheads to Manufacturing Operations; identified and closed gaps required to close the manufacturing release in time; 19 materials and process specification limits verified

- Responsible for technology development of new and derivative semiconductor packages (based on SOIC, TSSOP and exposed pad packages)- Key focus areas include selection and qualification of alternate assembly materials (leadframes, epoxy, molding compound) and development of cost-effective package and manufacturable semiconductor packages- Instrumental in the development and industrialization of the highest-density of SOIC8 packages that can be put on a leadframe array which led to significant assembly cost-savings

- Responsible for development and introduction of new products (NPIs) in Leadframes and Modules production lines --- 60% of total committed 2008 NPI sales for Manila site- Introduced and qualified an infrared(IR)-blocking cast epoxy in 2007 -- led to development and introduction of a NEW family of ambient light sensors for PerkinElmer Optoelectronics (second NPI owned and developed in Manila)- Conceptualized and developed high-volume process for encapsulation of Xenon-based flash modules used in mobile phone cameras (Nokia N82) --- strategic business impact of $14M for PerkinElmer Singapore (Oct 2006-Feb 2007)- Coordinated the production ramp-up of a surface-mount phototransistor used in mobile phone cameras across 4 sites (Montreal, Manila, Singapore and Germany) --- from process development to production in a span of 5 months

- Responsible for test process engineering and support for Headers production line (involving Ceramics, Metal Can, and Chip-on-Board devices) --- mapped a 3-point plan to improve test capability and accuracy across the 3 lines- Part of Dark Current (ID) Reduction Team that spearheaded site-wide efforts to reduce the dark current rejects encountered in photodiodes --- top electrical test failure across all devices for the site - Line-sustaining process support for Chip-On-Board devices (from front-of-line to back-end) --- initiated automation initiatives at FOL and process improvements at coating and test

- First-half of training in St. Louis, MO (USA) introduced design history and concepts of existing Manila sensors and emitters --- interfaced with original design and product engineers of Manila devices, learned product qualification planning and reliability testing- Second-half of training in Montreal, QC (Canada) introduced wafer fabrication technology (based on Silicon and III-V semiconductors) of existing Manila sensors and emitters, and learned internal system (NPI-FUEL) on product development and new product introduction

- Principal research focus on electro-magnetic characterization of high-temperature superconductors (BSCCO, YBCO, MgB2) - Responsibilities included development, operation and maintenance of different electro-magnetic characterization set-ups (magnetic susceptibility, Hall effect, electronic resistivity and electron tunneling)- Adept at various materials characterization techniques and methodologies (SEM, XRD, DSC, TGA, TMA)- Familiar with various materials fabrication and growth techniques (bulk ceramic processing, thin-film growth via RF-sputtering, LPE, PECVD, and MBE)- Published related researches in international (4) and local (11) publications.