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Rameen Hadizadeh Email & Phone Number

Director, Package Engineering at Rambus at Rambus
Location: Austin, Texas, United States 8 work roles 2 schools
1 work email found @wispry.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email r****@wispry.com
LinkedIn Profile matched
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Current company
Role
Director, Package Engineering at Rambus
Location
Austin, Texas, United States
Company size

Who is Rameen Hadizadeh? Overview

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Quick answer

Rameen Hadizadeh is listed as Director, Package Engineering at Rambus at Rambus, a company with 820 employees, based in Austin, Texas, United States. AeroLeads shows a work email signal at wispry.com and a matched LinkedIn profile for Rameen Hadizadeh.

Rameen Hadizadeh previously worked as Director, Package Engineering at Rambus and Senior Manager, Packaging at Rambus. Rameen Hadizadeh holds Msme, Mechanical Engineering from Georgia Institute Of Technology.

Company email context

Email format at Rambus

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{first}.{last}@wispry.com
86% confidence

AeroLeads found 1 current-domain work email signal for Rameen Hadizadeh. Compare company email patterns before reaching out.

Profile bio

About Rameen Hadizadeh

Rameen Hadizadeh is a Director, Package Engineering at Rambus at Rambus. They possess expertise in matlab, ansys, failure analysis, computer aided design, microfabrication and 17 more skills.

Listed skills include Matlab, Ansys, Failure Analysis, Computer Aided Design, and 18 others.

Current workplace

Rameen Hadizadeh's current company

Company context helps verify the profile and gives searchers a useful next step.

Rambus
Rambus
Director, Package Engineering at Rambus
san jose, california, united states
Website
Employees
820
AeroLeads page
8 roles · 22 years

Rameen Hadizadeh work experience

A career timeline built from the work history available for this profile.

Director, Package Engineering

Current

Austin, Texas, United States

Mar 2024 - Present

Senior Manager, Packaging

Austin, Texas, United States

Feb 2023 - Mar 2024

Manager Of Package Development

Austin, Texas, United States

Aug 2019 - Feb 2023

Packaging Technology Manager

Orange County, California Area

Jun 2016 - Jul 2019

Senior Ic Packaging Engineer

San Diego, California

Jun 2013 - Jun 2016
Team & coworkers

Colleagues at Rambus

Other employees you can reach at rambus.com. View company contacts for 820 employees →

2 education records

Rameen Hadizadeh education

Msme, Mechanical Engineering

Activities and Societies: Mechanical Engineering Graduate Association (MEGA), Intramural Sports included Soccer/Flag.

Bsme, Mechanical Engineering

Activities and Societies: Tau Beta Pi, Pi Tau Sigma, UK Men's Club Soccer Team, Various Intramural Sports

FAQ

Frequently asked questions about Rameen Hadizadeh

Quick answers generated from the profile data available on this page.

What company does Rameen Hadizadeh work for?

Rameen Hadizadeh works for Rambus.

What is Rameen Hadizadeh's role at Rambus?

Rameen Hadizadeh is listed as Director, Package Engineering at Rambus at Rambus.

What is Rameen Hadizadeh's email address?

AeroLeads has found 1 work email signal at @wispry.com for Rameen Hadizadeh at Rambus.

Where is Rameen Hadizadeh based?

Rameen Hadizadeh is based in Austin, Texas, United States while working with Rambus.

What companies has Rameen Hadizadeh worked for?

Rameen Hadizadeh has worked for Rambus, Cirrus Logic, Wispry, Qualcomm, and Texas Instruments.

Who are Rameen Hadizadeh's colleagues at Rambus?

Rameen Hadizadeh's colleagues at Rambus include Sadeka A., Sibin Sibin, Paul Zhou, Harish G, and New S1 Naredla.

How can I contact Rameen Hadizadeh?

You can use AeroLeads to view verified contact signals for Rameen Hadizadeh at Rambus, including work email, phone, and LinkedIn data when available.

What schools did Rameen Hadizadeh attend?

Rameen Hadizadeh holds Msme, Mechanical Engineering from Georgia Institute Of Technology.

What skills is Rameen Hadizadeh known for?

Rameen Hadizadeh is listed with skills including Matlab, Ansys, Failure Analysis, Computer Aided Design, Microfabrication, Machining, Photolithography, and Thin Films.

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