Haibo Li Email and Phone Number

• Field Application Engineering, Product Planning and Business Enabling.• Technical support for 3D NAND component sales and manage multiple accounts of customers who build flash solution (i.e., SSD, mobile and client applications).• Identify all flash business opportunities and provide optimal NAND Flash technologies and solutions for future designs for the specific assigned accounts, and managing all technical related issues.• Customer qualification management with technical documents and samples.• Technology, specific application type, market demand/sector, lifecycle, global qualification activities, and technical data in order to secure maximum design-wins• Future product planning discussion and alignment in new demand opportunity.• Manage the customers to assure that a technology leadership is maintained and sales are enabled and maximized. Act as an escalation path on occasions where there are (internal or external) obstacles impeding key design wins.• Provide strategic input to Korea HQ regarding the Flash solution or application technology trend in order to create new product offerings or to improve the R&R and the strategic partnership with the customers.• Visit and interact directly with the customers to maintain customer product roadmap updates. Track and report project details, design-in and qualifications plan as well as the competitive analysis in roadmap, process technology and qualification status.

• 3D NAND and SSD system technical integration and product lifecycle management.• Manage technical inputs and drive 3D NAND and SSD system alignment in the Success Criteria Document (SCD).• Work together with Media Architecture Group (MAG), System Architecture (SA), Business Units (BU), Application Engineering (App) and Technology Development (TD) team to resolve any gaps between NAND commits and system requirements.• Represent NAND team in System Product Development Teams (PDT) and collaborate about changes required to achieve competitive systems.• Manage NAND milestone and sample delivery schedules, in sync with system development timeline, provide system development teams with relevant documentation, and drive meetings to garner approval from stakeholders.• Communicate proper priorities within NAND development team to maintain focus on achieving system specs and highlight concerns to both Component and System teams for any issues, and drive the technical issue resolutions.• Manage communication with system teams regarding any NAND (Engineering Sampling) ES / (Qualification Release) QR capability issues. Assist with risk assessment and resolution for any identified issues.• Summarize key technical issues and present team progress, achievements and challenges to upper management.• Work closely with pathfinding team members to stay on the technology frontier, have internal technical publications and patent applications.

• Built up the team of product device engineering and the 3D NAND characterization lab.• Provide training, guidance and mentoring to team members.• Responsible for developing 3D NAND operational algorithms and invention of new solutions for high performance, reliability, and power efficiency.• Developed advanced simulation platforms for novel operation schemes and virtual experiments.• Communicate and work closely with other teams: Design, Cell Device, Process, Reliability, Product and Test engineering, to deliver the innovative solutions to tackle challenging problems.• Led the team, participated and successfully developed 32-layer MLC, 64-layer TLC, 128-layer TLC/QLC 3D NAND products.• Team members earned YMTC Individual Excellence Awards (2018Q4, 2019Q1 and 2019Q2)• YMTC Team Excellence Award 2020Q3 for extraordinary technical contributions.• Serve as a member of patent committee.• Serve as a member of product path-finding team.

• Section leader of SSD/NAND failure analysis• SSD failure analysis and characterization.• Develop FW tools for failure analysis.• Determine SSD/NAND testing and characterization methods.• Develop SSD/NAND flash endurance enhancement algorithms.• Develop SSD operation algorithms, i.e., background media scan, garbage collection, read reclaim policy, etc.• NAND threshold voltage distribution modeling for ECC simulations.

Enterprise SSD technology development including:• NAND specs, features, command sequences and qualification testing.• NAND characterization, optimization, and failure analysis for state-of-art SSD architecture.• Algorithm development for SSD endurance and reliability improvement.

• NAND flash memory technology development over many technology nodes: 70nm, 56nm, 43nm, 32nm, 24nm, 1xnm and 3D NAND.• World’s first TLC (3 bits/cell) NAND flash memory technology development on 56nm node. • Novel BiCS (Bit-Cost-Scalable, 3D NAND) technology development.• Expert in NAND flash operations, device characterization, parameter adjustment and optimization, failure mechanism analysis.• Expert in reliability testing and product qualification: endurance, data retention, program disturb, read disturb, yield enhancement, etc.

• Embedded Logic NVM technology development and retention reliability modeling• Device characterization (NVM, CMOS, LDMOS, diode, resistor, etc.) and SPICE modeling• Oxide reliability (FN tunneling and hot carrier injection characterization and modeling, TDDB, BVDSS measurements)• Test device design, layout, and test chip tapeout• High voltage design rules creation and advancement• Wafer level yield analysis and enhancement• Process and device simulation using Silvaco• Experience with many technology nodes including TSMC 90nm, 0.13um, 0.18um, 0.25um, UMC 0.13um, Chartered 90nm, 0.18um, Tower 0.13um, Canon 0.35um, etc.