Ben Ben-Ari Email & Phone Number

San Diego Ca Usa

QualSense Engineering Services Provide engineering services leading the development of ASIC's, CDMA cellular RF and GPS products, custom PCB printed ceramic patch and diversity antennas, Cellular, Bluetooth, GPS, RF reference design, test and validation platforms.• FramelessArtworks - Specialty Home decor accessories ,Scarf and Artworks Hanging Systems Design and manufacturing. Scarf and Artwork hanging system are Made in USA. Patent and Trademark Pending • QualSense Software development of GAriGrid Professional PC and Mobile smart games.

San Francisco Bay Area

Led and managed team of engineers in the design and development of GPS ASIC’s validation platforms including RF, FPGA, RFIC, SoC reference designs, EVK’s, SDK’s and custom GPS/UHF/VHF/ MTV antennas. Also responsible for GPS ASIC bring up, RF bench characterization and system validation. Managed joint development projects with vendors, OEM /ODM in Taiwan, Korea, and India. Successfully completed and delivered multiple ASIC validation platforms and reference designs to customers supporting the release of new GPS ASIC’s.

Redmond, Wa Usa

Led the design and development of Xbox wireless radio for FFSW (force feedback wireless steering wheel) including BB and RF circuits, board layout and SW reference development platforms. Developed with Microsoft partner’s RF transceivers and smart diversity antennas embedded inside Xbox wireless accessories. Worked with OEM manufactures in China and released to high volume production several wireless accessories that contributed to the successful launch of Xbox 360 during 2005 holiday.

Led the design and evaluation of new technology projects involved with CDMA wireless phones, GPS, digital compass and MCM-multi-chip module using Flip-Chip/WB technology. Developed multiple CDMA reference phones based on Qualcomm CDMA ASIC's. Worked with carriers, OEM manufactures and marketing creating cellular, GPS RF compliance specifications and the released to high volume manufacturing.• Represented Qualcomm/Kyocera Wireless in the TIA45/3GPP2 and IDB Automotive groups developing Mobile and GPS standards. Submitted several patent applications on GPS and Digital compass for cellular applications.

Led engineering design and development team and responsible for all the electronic hardware and packaging development of embedded communication systems including the HW design,custom ASIC, IC and mechanical packaging. Managed the project schedule, budget, engineering resources and QA test and validation team. Majority of the projects designed with high density, SMT, C.B Die’s bonding and Flip Chip technology on ceramic and FR4 substrates. Contracted several projects with OEM in Japan and China and released multiple products to high volume production.