Haim Pearl Email & Phone Number

Austin, Texas, United States

• Manage the EPG-PDC product line (SEMVision, CDSEM, Reveal, ComPLUS)
• Owns product change management (PCM) and controlo Unreleased product approval and controlo ECO (Engineering Change Order) approvalo Implementation of PCN (Part Change Notification), with Global Product Supporto Manages.
• Accuracy of customer shipped configurations and BOMs (Bill of Materials)o CaRM (Configuration accuracy Review Meeting) reviewso BOM (Bill of Materials) accuracyo NSR (Non Standard Request) approval
• Owns common modules roadmap and implementation post Phase 5 of ePLC.
• Implementation of component roadmaps including part obsolescence, replacements, alternative vendors and cost reduction
• Facilitates Intercompany communication to align on product strategies, provide guidance on pricing, spare level contents, and restricted part orders. Facilitates alignment meeting for product roadmap and market.

San Jose, California, United States

• Managed the total product support operation of the PDC platforms (SEMVision, Verity SEM, G3FIB, Reveal, ComPLUS).
• Ensured correct assignment of engineers to customer and product.
• Reviewed and monitored action plans to close issues to ensure customer satisfaction. For multiple products in a region, or for one global customer.
• Generated region-wide or global report to highlight customer top issues and action plans to close.
• Influenced Engineering to prioritize and close customer related design issues
• Supported GPS in the generation of documentation such as CENs and BKMs.

San Jose, California, United States

• Led the development and optimization of recipes during live demos and evaluation at customer sites through high involvement in the SOW and commitment schedule on the PDC platforms: ComPLUS, SEMVision, Verity, G3FIB
• Analyzed the overall performance of the recipes (Defect Inspection, DRSEM, CDSEM) at customer sites and presented a plan for Yield and TPT enhancement
• Through in-depth understanding of customer technologies and critical gaps and work throughout the work cycle until the implementation of the solution
• Technically leads difficult, complex application activities and team
• Interfaces with the customer regarding technical requirements analysis and schedule
• Define/approve Product application support plans for installation

San Jose, California, United States

Responsible for the wafer level failure analysis and characterization with emphasis on the following areas:1) TFH wafer visual defects related analysis2) FA and corrective action owner for wafer level failures. 3) Equipped primarily by various analytical tools such as FEI/FIB, SEM/EDS, TEM/EDS, AFM, JOEL, BF and DF In-line wafer Inspection tools such as.

Austin, Texas, United States

• Supported Sales and Marketing to define specifications on process and diagnostics tools and ensure systems would meet performance criteria agreed upon by customer, resulting in application qualification times of less.
• Conducted customer acceptance tests, training, and integration into production, resulting in multiple diagnostic tool orders (increased sales).
• Integral part of AMD/Spansion account team which received Spotlight award for outstanding support of the Metrology products.
• Increased departmental communication to global Account Manager by implementing monthly reports and charts to track customer improvement projects.
• Initiated responsibility of primary Application Support Engineer for first in fab startup at AMD/Spansion, VLSI Logic, and Freescale of Applied Materials’ diagnostics tools.

• Managed the evaluation and startup of the first wafer inspection system in the US at IBM.
• Increased market share of the wafer inspection tools in the US by working closely with the customer, handling all application and Hardware issues in a professional manner.
• Interfaced between R&D sales, marketing and the customer.
• Developed Best Known Methods (BKM) and techniques that helped Orbot and customers to improve their process and product.

• Participated in a new telecommunication product design. The job involved the following responsibilities: Hardware and software design, product technical documentation preparation, customer evaluation and acceptance.
• Redesigning the Exchange Line Interface and the Subscriber Line Interface cards of the Asynchronous Multiplexer System.
• Directed the design project of a new Leased Line interface card for the Asynchronous Multiplexer system. During that time I handled the customer training, product evaluation and acceptance tests, and was responsible.

Master, Mba

Management Information Systems (MIS)

Bs Eee, Electrical Engineering