Responsible for developing defect detection algorithms for high-speed X-ray semiconductor inspection tools. (C#, C++, Python, Emgu, OpenCV)Develop X-Ray metrology algorithms for semiconductor inspection. (C#, C++, Python, Emgu, OpenCV)Develop 3D tomography wire segmentation and path finding optimization

Develop software for label free scanner to detect biological responses for drug discovery.Develop inspection systems and algorithms for micro defect detection and structural stress analysis for various Corning products.Develop deformable edge detection algorithms to identify and track target reflections on glass surface. The results are used to measure glass warpage based on ray-tracing technology.Develop image feature extraction algorithms to analyze the flow of viscous fluid.Develop spline based algorithms to measure mesh deformity.Develop and deploy state of the art systems integrating machine vision, high performance computing platforms, advanced signal processing, measurement systems, and both hardware and software based imaging tools to address a wide array of R&D & business imaging needs. Implement computer vision or pattern recognition software with a focus on image segmentation, object detection/recognition, vision-based machine learning.

Develop medical imaging system software.Develop high-speed imaging algorithms for autofocus, image sharpening, image registration and tissue segmentation. Implement a suite of software tools for various types of image analysis. Developed integrated customizable platform that can be used to construct a variety of engineering systems for tool calibration, prototyping and data analysis. This platform offers built-in 3D and 2D image data visualization,

Develop software for wafer inspection systemsDevelop fully automated real-time all-surface wafer inspection systems to detect microscopic defects on wafer edges, back-side and front-side.Develop a complex polygonal approximation, clipping and stitching system to simplify defect shapes into convex hulls or sets of high curvature points. This provides a more accurate and intuitive representation of the wafer defects. Develop an automated wafer inspection recipe setup system that reduces the time and specialized knowledge required to setup the inspection tool. This system uses a combination of image processing techniques to locate all user-defined die or reticle on the wafer and computes the die layout automatically. The algorithm will also perform sub-pixel pattern rotational and positional alignment.

Develop machine vision software for semiconductor inspection systemsImplement various real-time image processing algorithms to detect and measure 2D and 3D wafer defects Develop algorithm to align randomly positioned and rotated dies on post-saw wafer accuratelyImplement probe mark inspection algorithm for polygonal bond pads of any shapesDevelop wafer handler system to control robot motion for post-saw wafer inspection and die packaging machinesImplement software image processing algorithms to improve system performance (accuracy, repeatability, and speed) and extend existing inspection capabilitiesImplement and maintain necessary system software components such as operating system drivers and hardware interfaces to cameras, optical illuminations and frame-grabbers. Participate in product requirement definition, engineering project planning and reviewProvide troubleshooting expertise, technical training, and system documentation to customers, field service, management and marketing staff