Hakan Doğdu
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Hakan Doğdu Email & Phone Number

Automation Engineer | Embedded Systems | Hardware/Software at ThermalTech Engineering
Location: Vicksburg, Michigan, United States 4 work roles 3 schools
1 work email found @dornerworks.com LinkedIn matched
✓ Verified Jun 2026 4 data sources Profile completeness 86%

Contact Signals · 1 work email

Work email h****@dornerworks.com
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Current company
Role
Automation Engineer | Embedded Systems | Hardware/Software
Location
Vicksburg, Michigan, United States
Company size

Who is Hakan Doğdu? Overview

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Quick answer

Hakan Doğdu is listed as Automation Engineer | Embedded Systems | Hardware/Software at ThermalTech Engineering, a company with 111 employees, based in Vicksburg, Michigan, United States. AeroLeads shows a work email signal at dornerworks.com and a matched LinkedIn profile for Hakan Doğdu.

Hakan Doğdu previously worked as Automation Engineer at Thermaltech Engineering and Graduate Research Fellow at Michigan Space Grant Consortium. Hakan Doğdu holds Bachelor Of Science - Bs, Computer Engineering from Western Michigan University.

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*@dornerworks.com
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Profile bio

About Hakan Doğdu

I'm a hardware-software engineer skilled in FPGA and TSN design. My internship at DornerWorks gave me deep insights into FPGA, particularly for TSN designs on platforms like Zedboard. At University, I honed my theoretical knowledge and applied it to projects, such as a 10-bit Custom RISC-V CPU in Verilog and VME Emulation on FPGA using External SDRAM in VHDL. My experience with C programming helped me contribute to the development of a computer-controlled conveyor system on an ARM STM32F429 embedded platform. I'm passionate about bridging theory and real-world application and continuously seek innovative engineering collaborations. Familiar Tools and Languages:Programming Languages: C, C++, CMake, C#, Java, MATLAB, Python, Verilog, VHDL Software and Programs: AutoCAD, Mentor Graphics, Visual Studio, GitHub, GitLab, LTspice, Microsoft Office Suite, STM32CubeMX, Xilinx Vivado, Xilinx VITIS, PuttyOperating Systems: Microsoft, LinuxInstruments / Hardware: Logic Analyzer, STM32F4 - ARM Cortex-M4, ESP32, Nexys Artix-7 FPGA, ZedBoard Zynq-7000 ARM/FPGA SoC, Voltage DevicesInterface Designs: Analog I/O, AXI Interface, CAN bus, I2C, Input Capture, SPI, QSPI, SRAM/SDRAM ChipsPassionate about innovation in design and Engineering. Let's connect: ergunerr@hotmail.com or LinkedIn.

Current workplace

Hakan Doğdu's current company

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ThermalTech Engineering
Thermaltech Engineering
Automation Engineer | Embedded Systems | Hardware/Software
cincinnati, ohio, united states
Website
Employees
111
AeroLeads page
4 roles

Hakan Doğdu work experience

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Graduate Research Fellow

I’m collaborating with MSGC and CASSS, guided by Dr. Simin Masihi, to develop a high-fidelity pressure mapping glove for EVA spacesuits. The project aims to improve astronauts’ grip and safety using sensors for real-time tactile feedback.

Dec 2023 - Jul 2024

Fpga Engineering

3445 Lake Eastbrook Blvd SE, Grand Rapids, MI 49546

  • My internship focused on integrating the existing TSN design from the high-end ZCU102 FPGA into the more affordable Zedboard. Additionally, I worked on creating a generic version by merging these architectures into a.
  • Collaborated with FPGA teams to develop scalable TSN network systems, leading to the creation of a generic IP block design for both Time Sensitive Networking (TSN) Switch & Endpoints.
  • Debugged and designed a generic IP to ensure compatibility with both Xilinx Zynq-UltraScale+ and Zynq-7000 MPSoC devices.
  • Adapted the existing IP block design intended for the ZCU102 FPGA, making it functional with the Zedboard device.
  • Once the bitstream was generated, I created an.XSA file from the Programming Logic (PL) and verified its hardware functionality using the VITIS tool.
  • The QSPI protocol used for flash memory was redesigned to ensure compatibility between the Zynq UltraScale+ and Zynq-7000 series in terms of flash memory management. I managed the transition of software components from.
May 2023 - Aug 2023
Team & coworkers

Colleagues at ThermalTech Engineering

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3 education records

Hakan Doğdu education

Bachelor Of Science - Bs, Computer Engineering

Activities and Societies: Tau Beta Pi Engineering Honors Society Advanced Microprocessor Applications | Digital Design | Microcontroller.

Associate Of Science - As, Engineering

Advanced C# Programming | DIFFERENTIAL EQNS/LINEAR ALG | PC Hardware & Software Support | Tech Drawing w/AutoCAD | University Physics II |.

Bachelor Of Arts - Ba, Public Relations, Advertising, And Applied Communication

FAQ

Frequently asked questions about Hakan Doğdu

Quick answers generated from the profile data available on this page.

What company does Hakan Doğdu work for?

Hakan Doğdu works for ThermalTech Engineering.

What is Hakan Doğdu's role at ThermalTech Engineering?

Hakan Doğdu is listed as Automation Engineer | Embedded Systems | Hardware/Software at ThermalTech Engineering.

What is Hakan Doğdu's email address?

AeroLeads has found 1 work email signal at @dornerworks.com for Hakan Doğdu at ThermalTech Engineering.

Where is Hakan Doğdu based?

Hakan Doğdu is based in Vicksburg, Michigan, United States while working with ThermalTech Engineering.

What companies has Hakan Doğdu worked for?

Hakan Doğdu has worked for Thermaltech Engineering, Michigan Space Grant Consortium, College Of Engineering And Applied Sciences At Western Michigan University, and Dornerworks.

Who are Hakan Doğdu's colleagues at ThermalTech Engineering?

Hakan Doğdu's colleagues at ThermalTech Engineering include Robert Naber, Trenton Steele, Jeffrey Decker, Gus Scheier, and Colin Moormann.

How can I contact Hakan Doğdu?

You can use AeroLeads to view verified contact signals for Hakan Doğdu at ThermalTech Engineering, including work email, phone, and LinkedIn data when available.

What schools did Hakan Doğdu attend?

Hakan Doğdu holds Bachelor Of Science - Bs, Computer Engineering from Western Michigan University.

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