Hakeem Smith Email & Phone Number

Cupertino, California, Us

Milpitas, California, Us

Product integration lead for all new production hardware boards.• Established all test infrastructure and transitioned to overseas manufacturing.• Performed site audits, test equipment training, and documentation • Created hands-on debug guides to troubleshoot board and system level issues.

Austin, Texas, Us

Responsible for server and switch hardware manufacturing test processes.-Developed, qualified and implemented NPI hardware from concept through production. -Failure analysis during NPI and sustaining life cycles down to the component. -Analysis of Product designs relative to DFx Criteria (DFM, DFA, and DFT). -Drive design of ICT fixtures and BFT (board functional test) to support/improve manufacturing products.-Board bring up and system validation testing (managed vendors in Asia).-Continuous improvement of yields at all relevant logical system and/or PCBA test operations.

Bangalore, Karnataka, In

Working with Cisco developing Manufacturing Test Platform for N7K Apex boards.Implemented design verification testing for a custom manufacturing test platform that reduces production cost. -Created validation test criteria for a custom test platform. -Conducted schematic and layout design reviews with vendors in India and China.-Responsible for SerDes/ASIC testing and tuning parameters to meet Cisco’s product requirement. -Schematic capture, prototype bring-up, validation testing.

Carrollton, Tx, Us

Delivered three complex hardware projects one as a lead and two within a team. •Technical lead for 12 layer PCB GigE line module designed to reduce the cost of previous generation.•Supported principle engineers by supervising PCB layout, schematic error checking, signal integrity measurements, recordings and analysis on high speed buses. •Authored functional specifications for new hardware designs and certified the behavior with a DVT/plan/document executed at prototype bring-up and debug that provided a guideline for manufacturing.•Devised component selection and validation strategy for 160G switch fabric that uses DDR, SSD and PCIe.•Implemented failure isolation techniques down to the component and used results to correct manufacturing/OEM issues which reduced customer product complaints for each product line in a year.•Responsible for offsite NEBS compliance test scheduling, system setup and debug.•High Speed Digital Design experience (Signal Integrity, Stack-up, LVDS,DDR2,PCIe), 12-32 layer PCB’s.•Performed schematic capture, symbol creation (Mentor Graphics DxDesigner) and authoring functional specifications Interacted with component OEM’s and suppliers in the Asia, DVT and DFM.•Fault isolation techniques at chip level as well as board, documenting failure modes and verified corrective actions.•Installed base, field, and RMA tracking and support.

Chicago, Us

Supported patient monitor hardware development from concept through release and installed base failure issues.•Liaised between manufacturing and design team, and provided guidance for test strategies.•Led in house EMC compliance documentation, test, training, as well as environmental and life testing.•Reduced onsite manufacturing issues by 33% with six sigma green belt certification project.•Lead engineer for hardware prototype bring-up, debug and root cause analysis for validation.•Hardware design, development and implementation from concept through product release, schematic capture, technical specifications, bring-up, layout, routing guidelines, and system functional testing.•Design verification testing ( Hass/Halt, Temperature profiling, immunity, emissions, static, vibration).•Root cause analysis, defect resolution and corrective actions for development, installed base and manufacturing.

• Designed analog and digital circuits• Programmed microcontrollers in assembly and C languages.• Circuit board layout and design.• Diagnosed and repaired SMT boards for final production.• Created smart charger battery station.

• Analyzed and evaluated intellectual properties.• Utilized technical background to assess various technologies.• Reviewed analog, digital and PCB designs.• Researched technologies from semiconductor etching to network hardware

Designed control systems that measured the thickness of metal strips using radiation.• Analog and digital circuit design• Authored instruction manuals and field installation guidelines• Component review and obsolescence replacement

Ms, Information Systems And Technology

Bs, Electrical Engineering