Hansen Sy Email & Phone Number

Singapore

As a dedicated professional with a strong background in semiconductor sales, I specialize in driving global revenue growth for GaN (Gallium Nitride) RF Power transistors. With a deep understanding of RF technology and its applications across industries like telecommunications, aerospace, defense, and industrial sectors, I have successfully led strategic.

Singapore

As the Director of Global Distribution Sales at Gallium Semi, I led the development and execution of global sales strategies to drive revenue growth for our GaN RF products. I managed and expanded our international distributor network, fostering strong relationships and ensuring optimal market penetration. My role involved strategic market analysis.

Singapore

GaN-on-Silicon and GaN-on-SiC Epiwafers and GaN Technology Foundry Services, Gallium Nitride, Wideband Gap Semiconductor, Power semiconductors, RF semiconductors, 5G, mmWave, Wireless Charging, Gas Sensors, Pressure Sensors, Highly sensitive sensorsResponsible for Sales, Business Strategy, Customer Relationship Management (CRM), and Marketing

Singapore

Silicon Photonics, Silicon PIC Foundry Services, Si waveguides (Rib, Strip and Si grating coupler)SiN waveguides, Si photonics crystal, TiN heater and ion implantation doped heater, Six ion implantations (N, N+, N++, P, P+ and P++ ), Ge photodetectors (lateral, vertical NIP and vertical PIN), Two Cu BEOL metal layers with W contact Si-contact/Ge-contact.

No.3 Lorong 6 Toa Payoh

- Advised clients on market conditions, prices, mortgages, legal requirements and related matters.- Promoted sales of properties through advertisements and open houses.- Developed content for sales presentations or other materials.- Acted as an intermediary in negotiations between buyers and sellers, generally representing one or the other.- Experienced in.

• Responsible for providing technical application support to customers in South Korea, China, Philippines, Taiwan, Malaysia, and Singapore. Responsible for organizing and managing the technical aspects of the market.
• Realized and worked out qualification of fluxes and solder pastes with customers representing over $500,000 in sales
• Identified points for product improvement and interfaced with the R&D centers in Germany and USA for product modification… Show more Responsible for providing technical application support to customers in South Korea.
• Identified points for product improvement and interfaced with the R&D centers in Germany and USA for product modification
• Trained each of the Sales managers in Korea, Taiwan, Singapore, and Philippines regarding product properties and application Show less

• Responsible for development of next generation Flip Chip package and standardization of the process and materials for production of Flip Chip product across factories in South Korea, Philippines, Taiwan, and China.
• Monitored and successfully co-managed novel Flip Chip Molded Ball Grid Array product with over $1 Million development funding
• Standardized materials such as flux and underfill and processes in Flip Chip production lines in factories in South Korea, Taiwan, Philippines,… Show more Responsible for development of next generation Flip Chip.
• Standardized materials such as flux and underfill and processes in Flip Chip production lines in factories in South Korea, Taiwan, Philippines, and China Show less

• Acts as an interface between the clients and the technical staff, continually anticipate and resolve potential problems and production bottlenecks to ensure the laboratory runs smoothly. Responsible to quickly assess.
• Managed the product reliability and failure analysis laboratory to respond faster to customer needs
• Provided comprehensive and well-documented failure analysis reports for… Show more Acts as an interface between the clients and the technical staff, continually anticipate and resolve potential problems and production.
• Provided comprehensive and well-documented failure analysis reports for external customers from component level to system level products
• Conducted training for customers in Singapore and Thailand on solderability testing, SEM/EDX, and micro-sectioning techniques Show less

• Responsible for planning, execution of design of experiments, and reporting of the progress of projects for the management and members of the consortium.
• Provided laboratory support and analysis of experimental data for collaborative projects with various companies involving electronic package reliability and failure analysis
• Characterized and evaluated soldering materials for surface mount technology (SMT) and underfill adhesives for flipchip technology applications.
• … Show more Responsible for planning, execution of design of experiments, and reporting of the progress of projects for the management and members of the consortium.
• Presented and published technical papers on lead-free solders for SMT applications in electronics technology conferences resulting from consortium activities. Show less

• Responsible for providing technical support to production of magnetic products to achieve high yield and produce quality products. Supervise a team of engineers and technicians.
• Achieved a sharp increase in product yield from 95% to 99% in 6 months.
• Resolved a long-standing molded package crack problem of LAN magnetic modules in 3 months.
• Supervised and trained engineers and technicians in SPC, FMEA, 8D, and Design of Experiment (DOE).

• Responsible for providing technical support for the ball attach process of Tape Array BGA products, achieve high yield, and improve quality.
• Improved the solder ball attach process cycle time by 25% in a month by implementing a standardized process achieved through design of experiment.
• Established the solder ball attach process for Tape Array BGA start-up operations by optimization, formulation of specifications, and implementation of statistical process control.
• Sustained… Show more Responsible for providing technical support for the ball attach process of Tape Array BGA products, achieve high yield, and improve quality.
• Sustained assembly operations in die attach, wirebonding, encapsulation, solder ball attach, and singulation processes. Show less

Bs, Chemical Engineering

Master, Mba

Former Master's student.