H. Daniel Park Email & Phone Number

New York, Ny, Us

Iselin, New Jersey

– Invented a lead-free adsorbent that outperforms the current commercial product by 270%, 110%, and 100% in removal capacities for carbonyl sulfide, arsine, and phosphine, respectively.– Synthesized a copper-based adsorbent that outperforms the current commercial product by 120%, 15%, and 45% in removal capacities for carbonyl sulfide, arsine, and phosphine, respectively.– Developed an energy-efficient CO adsorbent that can be operated at ~30 °C below the standard operating temperature of the current commercial product.– Scaled up production of the above adsorbents from laboratory gram-scale to commercial ton-scale.

Cambridge, Ma, Usa

– Patented an ion-exchanged metal−organic framework, Co(CO)₄⊂Cr-MIL-101, as the first heterogeneous catalyst for epoxide and β-lactone carbonylation.– Designed and built the first gas-liquid flow carbonylation process for continuous production of β-lactone and succinic anhydride through a packed bed reactor.– Developed AlMe₃-treated Cr-MFU-4𝘭 as the first metal−organic framework catalyst for gas phase olefin polymerization.

Cambridge, Ma, Usa

– Developed a carbon nanotube-based infrared fluorescent sensor for quantification of an inflammatory biomarker fibrinogen at clinically-relevant levels in serum environment. – Performed research assignments at Mallinckrodt Pharmaceuticals and SGC Energia as a part of the M.S. Chemical Engineering Practice program.

Doctor Of Philosophy (Ph.D.), Chemical Engineering

– 𝗦𝗮𝗺𝘀𝘂𝗻𝗴 𝗦𝗰𝗵𝗼𝗹𝗮𝗿𝘀𝗵𝗶𝗽 ($250,000), Samsung Foundation. – 𝗕𝗲𝘀𝘁 𝗣𝗮𝗽𝗲𝗿 𝗮𝗻𝗱 𝗣𝗿𝗲𝘀𝗲𝗻𝘁𝗮𝘁𝗶𝗼𝗻 𝗔𝘄𝗮𝗿𝗱, Catalysis and Reaction Engineering Division.

Master Of Science (M.S.), Chemical Engineering Practice

– 𝗗𝗮𝘃𝗶𝗱 𝗛. 𝗞𝗼𝗰𝗵 𝗙𝗲𝗹𝗹𝗼𝘄𝘀𝗵𝗶𝗽 ($30,000), Department of Chemical Engineering. – 𝙈𝙄𝙏 𝙉𝙚𝙬𝙨 𝗥𝗲𝘀𝗲𝗮𝗿𝗰𝗵 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁, Massachusetts Institute.

Bachelor Of Science (B.S.), Chemical And Biological Engineering

– 𝗦𝘂𝗺𝗺𝗮 𝗖𝘂𝗺 𝗟𝗮𝘂𝗱𝗲 𝘄𝗶𝘁𝗵 𝗩𝗮𝗹𝗲𝗱𝗶𝗰𝘁𝗼𝗿𝗶𝗮𝗻 𝗛𝗼𝗻𝗼𝗿𝘀, Department of Chemical and Biological Engineering. – 𝗡𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗦𝗰𝗶𝗲𝗻𝗰𝗲 𝗮𝗻𝗱 𝗘𝗻𝗴𝗶𝗻𝗲𝗲𝗿𝗶𝗻𝗴.