Henry Potts

Henry Potts Email and Phone Number

Vice President, Software and Digitalization @ Renesas Electronics
santa clara, california, united states
Henry Potts's Location
Guntersville, Alabama, United States, United States
About Henry Potts

Driving innovation in the Electronics industry for over 4 decades. Senior executive and technology leader at multiple Electronics OEM companies (Motorola, TI, Hitachi, VLSI Technology, Schlumberger) as well as leading Electronic CAD software companies (Mentor Graphics, Altium). Holds 31 patents in the areas of systems, hardware and software.

Henry Potts's Current Company Details
Renesas Electronics

Renesas Electronics

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Vice President, Software and Digitalization
santa clara, california, united states
Website:
renesas.com
Employees:
5650
Henry Potts Work Experience Details
  • Renesas Electronics
    Vice President Software And Digitalization
    Renesas Electronics Sep 2024 - Present
    San Diego, California, United States
  • Byzyn Llc
    Principal Owner
    Byzyn Llc Oct 2022 - Oct 2024
    Guntersville, Alabama, United States
    Consulting and executive management services focusing on development and realization of electronic and software centric systems.
  • Altium®
    Sr Executive Vice President
    Altium® Apr 2015 - Sep 2022
    La Jolla, California
    Introduced Enterprise Solutions into the Altium product offerings. The solution combined the easy to use design automation software which Altium has been noted for with a configurable workflow environment which addressed enterprise needs without adding significant complexity to the overall design process.
  • Mentor Graphics
    Vice President And General Manager - Systems Design Division
    Mentor Graphics Mar 1999 - Mar 2015
    Longmont, Colorado, United States
    Developed the Systems Design business within Mentor Graphics over the course of 16 years starting initially with PCB then through acquisitions and internal development expanded the business to include electronic manufacturing analytics, electronic interconnect design and manufacturing and mechanical analytics specifically related to electronic design.
  • Hitachi Microsystems
    Vice President Of Engineering
    Hitachi Microsystems Mar 1997 - Mar 1999
    San Jose, California, United States
    Managed the marketing and engineering team developing the Hitachi SuperH 32-bit reduced instruction set computer for the embedded market. The SH-4 which was developed principally within the US team was superscalar and included a SIMD vector floating-point unit suited for 3D graphics. Development teams in the US and China.
  • Motorola Semiconductor Segment
    Managing Director
    Motorola Semiconductor Segment Mar 1994 - Mar 1997
    Austin, Texas Metropolitan Area
    Managed a specialized lab developing SIMD processors for inclusion in Systems on Chip ICs.Development teams in Australia, China and the US.
  • Vlsi Technology
    Vice President - General Manager
    Vlsi Technology Apr 1989 - Mar 1994
    Tempe, Arizona, United States
    Managed the PC Chipset Division which at the time was the world’s market leader for personal computer chip sets. Lead and participated in the evolution and development of chip set ICs for 4 generations of Intel processors. Lead a joint venture with Intel to develop one of the electronics industry’s first single chip System on Chip solutions for handheld computing.
  • Diversified Technology
    Vice President Of Engineering And Marketing
    Diversified Technology Nov 1987 - Apr 1989
    Jackson, Mississippi, United States
    Managed manufacturing factory and the development teams for single board PC systems. Lead the adoption of CAE systems for the design of PCB based systems as well as the deployment of surface mount manufacturing assembly processes for low volume manufacturing – an early first in this space in the US.
  • Helix
    Founder And Ceo
    Helix May 1983 - Nov 1987
    Houston, Texas, United States
    Started and ran a PC computer systems centric company which developed and sold rugged industrial PCs to replace minicomputers. The PCs were some of the first developed using chip sets compatible with the IBM PCs which were configured in unique industrial formats. Self-funded by contract development of custom intelligent industry automation solutions. Sold the company to Diversified Technology in 1987.
  • Schlumberger - Johnston, Macco, Mwd Divisions
    Vice President Of Engineering
    Schlumberger - Johnston, Macco, Mwd Divisions Oct 1974 - May 1983
    Sugarland, Texas, United States
    Developed and lead multi discipline engineering teams (electronic, mechanical, petroleum, software engineering) developing electro-mechanical systems for data acquisition during drilling wells. These systems operated at the extremes of what was possible from a technology perspective (temperature, shock, vibration, processing power, etc).
  • Texas Instruments
    Semiconductor Engineer
    Texas Instruments Aug 1973 - Oct 1974
    Stafford, Texas, United States
    NMOS static memory design.
  • United States Air Force
    Pilot - Combat And Instructor
    United States Air Force May 1968 - Aug 1973
    Laughlin Afb, Texas, United States
    Fighter pilot 1969 – 1970, Instructor Pilot (T-38) 1970 - 1973

Henry Potts Education Details

Frequently Asked Questions about Henry Potts

What company does Henry Potts work for?

Henry Potts works for Renesas Electronics

What is Henry Potts's role at the current company?

Henry Potts's current role is Vice President, Software and Digitalization.

What schools did Henry Potts attend?

Henry Potts attended University Of Louisiana At Lafayette.

Who are Henry Potts's colleagues?

Henry Potts's colleagues are 畑尚志, Gelora Cuteee, Matt Park, Chris Voerman, Muhd Adzim, Chen Youonn.chen.rh, Florin Pop.

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