Hing Chan Email & Phone Number

Charlotte, North Carolina Area

Initial Funding activities

Montrose, CO

Provides failure analysis and quality problem solving for III-V CPV receivers. Responsible for prototype and pilot manufacturing and selection of final overseas CM.

San Francisco Bay Area

CPV receiver development for 1000 sun application

Responsible for first and second generation HCPV product development at 500 suns. Focused on component development and technology roadmap. Managed multi-disciplinary team to focus on glass forming process, receiver assembly, solar cell testing as well as reliability and failure analysis. Assisted in controller and tracker management to define detail.

Investigated and incorporated new business venture in LED lighting and layout basic operating structure. Developed a series of light curing tools for overseas manufacturing.

Responsible to restore Singapore's internal development effort on flip chip packaging after two years of continuous failure. Introduced and maintained website to improve communication among US and Singapore entities. Focused on low cost high-speed substrate development with vendors and digital designers. Incorporated mechanical and thermal effects to.

Set up the packaging development area for hermetic laser transmitter module targeted the metro and long haul applications. Identified processes and procured equipments for fluxless soldering, fiber & laser diode active alignment and attachment. Managed mechanical design and outsourcing.

Managed flip chip VCSEL development program including both internal and external vendors. Investigated thermal management, MEMS, flip chip VCSEL and wafer scale packagingOptoelectronic Division (OED), Hewlett Packard Project management included local and transcontinental product development and pilot line production for LED's. Managed budgeting including.

Major contributor in quality and product research in III-V material systems. Core member of product development teams for surface mount devices: Soldering, packaging, materials. Extensive experience with problem solving using various analytical means including SEM, TEM & various thermal analyses techniques.

Metal, ceramic and composite powder processing research. Responsible for the design and implementation of research projects. Interacted extensively with universities and government funding agencies. Invited speaker for various conferences.

M.S, Materials Science And Engineering

Ph.D, Materials Science And Engineering

B.S, Chemical Engineering