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Takashi Hirano Email & Phone Number

Hardware Design Engineer at TIER IV
Location: Tokyo, Japan 10 work roles 2 schools
1 work email found @digitite.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

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Current company
Role
Hardware Design Engineer
Location
Tokyo, Japan
Company size

Who is Takashi Hirano? Overview

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Quick answer

Takashi Hirano is listed as Hardware Design Engineer at TIER IV, a with 83 employees, based in Tokyo, Japan. AeroLeads shows a work email signal at digitite.com and a matched LinkedIn profile for Takashi Hirano.

Takashi Hirano previously worked as Senior System Design Specialist at Amd and System Design Specialist at Xilinx. Takashi Hirano holds Bachelor’S Degree, Electrical And Electronics Engineering from 東京工業大学 / Tokyo Institute Of Technology.

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Email format at TIER IV

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{last}@digitite.com
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Profile bio

About Takashi Hirano

Over 30 years of experience developing digital signal processing systems for image and audio applications using ASIC, FPGA, and DSP technologies, serving both as an engineer and as a project leader. Areas of expertise include logic design for system-level architecture with processors and block-level micro-architecture.

Listed skills include Soc, Asic, Semiconductors, Digital Signal Processors, and 40 others.

Current workplace

Takashi Hirano's current company

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TIER IV
Tier Iv
Hardware Design Engineer
tokyo, tokyo, japan
Website
Employees
83
AeroLeads page
10 roles

Takashi Hirano work experience

A career timeline built from the work history available for this profile.

Hardware Design Engineer

Current

Tokyo, Japan

Oct 2022 - Present

Senior System Design Specialist

Amd

日本 東京都 東京

Feb 2022 - Sep 2022

System Design Specialist

日本 東京都 東京

Dec 2021 - Feb 2022

Representative Director

Within 23 Wards, Tokyo, Japan

Led development of an FPGA-based image processing system with a stereo camera for an algorithm of OpenCV.Developed an IP for an ISP with a high-level synthesis tool.Developed a DMA controller of a 3D graphics ASIC for medical equipment.Developed a DSP program for an automotive audio system.Evaluated an AI device designed by a start-up company for an automotive company.Promoted a multi-core processor designed by a US-based LSI vendor to prospective Japanese customers.Supported Japanese customers in the use of an ASIP tool by an EU-based EDA vendor.Helped a laboratory at a Japanese university to layout an asynchronous PUF circuit on an FPGA.

Aug 2009 - Dec 2021

Deputy General Manager

Olympus Digital System Design

Within 23 Wards, Tokyo, Japan

Promoted an ASIC project for a next-generation endoscopic product.Led an evaluation of a high-level synthesis tool for image processing.

May 2007 - Jul 2009

Senior Engineer

Aoi Technology

Within 23 Wards, Tokyo, Japan

Led development of an ASIP with SIMD instructions for image processing including CODEC.Led an IP project based on multi-core ASIPs for digital still camera.Led a bus architecture evaluation of an ASIC for a digital still camera with a NoC IP.Developed an interrupt controller for a multi-core processor system.Developed an affine transform module for a 2D-graphic IP.

Nov 2003 - Apr 2007

Design Engineer

Kawasaki, Kanagawa, Japan

Developed digital audio circuits in an ASSP for DVDs, which included two DSPs and I/O peripherals. Developed audio firmware for a DSP on an ASSP for DVDs, and obtained a Dolby certification.

Feb 2000 - Nov 2003

R&D Engineer

Outside 23 Wards, Tokyo, Japan

Developed a data capturing board for a mixed-signal LSI tester and designed digital circuits with an FPGA, which performed data processing and peripheral control.

Jul 1997 - Nov 1999

Application Engineer

Within 23 Wards, Tokyo, Japan

Developed firmware on a SIMD-DSP for a copier and won a design-win from an office equipment company.Developed an evaluation board for an ASSP for DVDs as well as programs for the host processor.

Apr 1994 - May 1997
Team & coworkers

Colleagues at TIER IV

Other employees you can reach at tier4.jp. View company contacts for 83 employees →

2 education records

Takashi Hirano education

High School, 普通科

徳島県立富岡西高等学校
FAQ

Frequently asked questions about Takashi Hirano

Quick answers generated from the profile data available on this page.

What company does Takashi Hirano work for?

Takashi Hirano works for TIER IV.

What is Takashi Hirano's role at TIER IV?

Takashi Hirano is listed as Hardware Design Engineer at TIER IV.

What is Takashi Hirano's email address?

AeroLeads has found 1 work email signal at @digitite.com for Takashi Hirano at TIER IV.

Where is Takashi Hirano based?

Takashi Hirano is based in Tokyo, Japan while working with TIER IV.

What companies has Takashi Hirano worked for?

Takashi Hirano has worked for Tier Iv, Amd, Xilinx, Digitite, and Olympus Digital System Design.

Who are Takashi Hirano's colleagues at TIER IV?

Takashi Hirano's colleagues at TIER IV include Guolong Zhang, Shintaro Tomie, 吴雄飞, Seio Inoue, and Asami Morita Schott.

How can I contact Takashi Hirano?

You can use AeroLeads to view verified contact signals for Takashi Hirano at TIER IV, including work email, phone, and LinkedIn data when available.

What schools did Takashi Hirano attend?

Takashi Hirano holds Bachelor’S Degree, Electrical And Electronics Engineering from 東京工業大学 / Tokyo Institute Of Technology.

What skills is Takashi Hirano known for?

Takashi Hirano is listed with skills including Soc, Asic, Semiconductors, Digital Signal Processors, Eda, Ic, Verilog, and Fpga.

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