• August 2019 – Present: NPI Team Leader in DONG DO Electronic Company(Supply the circuit board for LG Electronics Viet Nam_Trang Due Industrial Park, An Duong District, Hai Phong City “ In vehicle infotainment product”) Research & Development- Establish team’s strategy & action plan- Review Product and Process risky for new product before launch.- Establish process based on current line status for new product- BOM design and management (MBOM, EBOM…)- Responsibility for APQP (Advaced Product Quaity Planning).- Prepare (CP) control plan and working guide detail for all process & PFMEA & PFD- Collect issue and make action plan to clear all before Pre-MP event- ST checking and processing cost analysis for new model- Make new production schedule for each line.- Meeting to deployment new products samples- Defect process analysis and improvement.- Develop process completely for new model of Daimler, GM, Renault, Honda, Volkswagen, Toyota, Hyundai… - Strong knowledge about soldering process (Reflow, Selective,Wave…).- Strong knowledge about electronics material (Bare PCB, SMT part, solder paste, under fill, silicon, mechanic…)- ESD/EOS control.- Understanding almost SMT machine.- SMT stencil design skill (Laser, Step, Electroforming)- Co-work with supplier to develop tool, jig matching with product’s requirement- Strong knowledge about IPC (Special class 3):- IPC 600 - Acceptability of Printed Boards- IPC 610e - Acceptability of Electronic Assemblies- IPC 7530-Reflow Profile- IPC-7525a -Stencil Design.- Quality management, new samples, management of design changes and reporting.- Control line of balance to find out bottom neck of process and give improvement plan- Training new and old engineer to skill up SMT technology.- Process Loss Improvement Task (PLI)