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Hongfei Tian Email & Phone Number

SEG Integration at Apple
Location: Los Angeles, California, United States 3 work roles 2 schools
1 work email found @apple.com LinkedIn matched
✓ Verified Jul 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email h****@apple.com
LinkedIn Profile matched
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Current company
Role
SEG Integration
Location
Los Angeles, California, United States

Who is Hongfei Tian? Overview

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Quick answer

Hongfei Tian is listed as SEG Integration at Apple, based in Los Angeles, California, United States. AeroLeads shows a work email signal at apple.com and a matched LinkedIn profile for Hongfei Tian.

Hongfei Tian previously worked as Summer Intern-System Engineer at Geiri North America and Senior Embedded Software Engineer at Galaxy Space. Hongfei Tian holds Master'S Degree, Electronic Engineer from University Of Southern California.

Company email context

Email format at Apple

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{first_initial}{last}@apple.com
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AeroLeads found 1 current-domain work email signal for Hongfei Tian. Compare company email patterns before reaching out.

Profile bio

About Hongfei Tian

Hongfei Tian is a graduate student in The University of Southern California(USC) with a specialization of Very Large Scale Integration(VLSI). He began to create small model of planes and tanks since the age of 8, which proved to play a very crucial role of his choice to become a hardware engineer. Hongfei was born in China. In the year of 18, he entered one of the best university in China---- Harbin Institute of Technology(HIT). From there he gained a lot of knowledge about circuits design. In his sophomore year, he caught a chance to go to The University of Adelaide as an international exchange student to learn more about circuits. Moreover, during this process he received a scholarship from The China Scholarship Council(CSC) because of his good performance in the school. After that, in the fourth year, he was chosen to go to the University of California, Riverside to attend a programme in the field of Internet of Things(IOT). He completed that programme perfectly and graduate from HIT in the year of 2016. Meanwhile, in July of the same year, he find himself an internship in a Beijing company called Galaxy Space. In that company, he worked as embedded systems engineer. During that experience, Hongfei anticipate in the design and produce of the software system of the satellite named Yanqun NO.3 which will launch in the Match of 2018. After half years’ internship, he decided to go to a international university to continue his study in the field of VLSI, so he came to USC in the year of 2017. In the future, he will complete his graduate programme in the USC and go to some good company to gain a better career.

Listed skills include 嵌入式 Linux, Arduino 平台, Stm32, Freertos, and 9 others.

Current workplace

Hongfei Tian's current company

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Apple
Apple
SEG Integration
AeroLeads page
3 roles

Hongfei Tian work experience

A career timeline built from the work history available for this profile.

Seg Integration

Current

Cupertino, California, Us

Mar 2020 - Present

Summer Intern-System Engineer

San Jose, Ca, Us

GEIGEINA is a power company. I join the team of EMS Energy System and focus on the communication issues. We make an OPC and maintain communication among battery, solar panel, load, etc. through Modbus, TCP/IP, Socket, SCPI. After we fetch the data from each device, we develop an algorithm to calculate the best way to control all the devices. At last, we launch the control signal through OPC we develop.

May 2019 - Aug 2019

Senior Embedded Software Engineer

Galaxy Space

Galaxy Space is a company in Beijing focusing on business satellite, until now, it launched three satellite. In the future, it will sent more than 50 satellites to the space to produce a complete network to protect woods from fire and keep an eye on vessels in the ocean. In the company, I work as an embedded engineer, participating in the design and produce of the software system of the third satellite of the company called Yanqun NO.3, which will be launched in March 2018. During the working period, I help to draft the software architecture of a business satellite. The parts that I participated includes the mission that software should complete in the space, how to initial the driver of all hardware used in the satellite, what format should be used to save the date in the main memory, what will be the strategy of error repair etc. After that, I participated in the whole process of software writing, including drivers, hardware interface, system build. I used FreeRTOS and Linux in two board each used an ARM chip. I optimized the system starting mission to decrease the power consuming of Linux. At last, I help to test the connection between satellite and ground station and help to get the bug in the system and repair them.

Jun 2017 - Dec 2017
2 education records

Hongfei Tian education

Master'S Degree, Electronic Engineer

University Of Southern California

学士, Microelectronics

Harbin Institute Of Technology
FAQ

Frequently asked questions about Hongfei Tian

Quick answers generated from the profile data available on this page.

What company does Hongfei Tian work for?

Hongfei Tian works for Apple.

What is Hongfei Tian's role at Apple?

Hongfei Tian is listed as SEG Integration at Apple.

What is Hongfei Tian's email address?

AeroLeads has found 1 work email signal at @apple.com for Hongfei Tian at Apple.

Where is Hongfei Tian based?

Hongfei Tian is based in Los Angeles, California, United States while working with Apple.

What companies has Hongfei Tian worked for?

Hongfei Tian has worked for Apple, Geiri North America, and Galaxy Space.

How can I contact Hongfei Tian?

You can use AeroLeads to view verified contact signals for Hongfei Tian at Apple, including work email, phone, and LinkedIn data when available.

What schools did Hongfei Tian attend?

Hongfei Tian holds Master'S Degree, Electronic Engineer from University Of Southern California.

What skills is Hongfei Tian known for?

Hongfei Tian is listed with skills including 嵌入式 Linux, Arduino 平台, Stm32, Freertos, Android, Verilog, Vlsi, and Cadence.

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