Howard Sewell Email & Phone Number

Colchester, England, United Kingdom

Responsible for the development of PSOE (Plexus System of Operational Excellence) model and creating systems and documentation to support deployment globally and to assess the level of maturity of sites globally.Developed an industry standard APQP model supporting design engineering, manufacturing, quality, transition management etc to support automotive.

Oradea, Bihor, Romania

Responsible for transition of medical products from Abbot and Alere Toxicolgy to Plexus, Penang.Worked with the Penang Manufacturing Team to ensure Transition Plan is followed and conducted weekly customer reviews to ensure compliance with Engineering Sample Build requirements, Verification & Validation and IQ/OQ/PQ protocols.Focus on Customer Continuous.

Oradea

Responsible for managing the LSS (Lean Six Sigma) deployment in the EMEA Region covering three manufacturing sites in Scotland and Romania. Also provide support in Penang, Malaysia and Xiamen, China. Travel globally 90% of time.Developed and implemented Lean Index Assessment Maturity Model to standardize Lean Line Certification.Drive PSOE (Plexus System of.

Oradea, Romania

Responsible for managing the LSS (Lean Six Sigma) department at Site Level.Conduct Yellow and Green Belt Training and provide coaching and mentoring to Green Belt Candidates.Responsible for the deployment of Lean Six Sigma initiatives based on the Hoshin Plan.Set up Lean Six Sigma Steering Committee to review and agree deployment of LSS activities.

Tiszaujvaros, Hungary

Responsible for managing the LSS (Lean Six Sigma) department at Plant Level in a matrix management organization.Manage the LSS Team comprising of the Black Belt Project Leader, Green Belts and Administrator and indirectly manage Kaizen Technicians in the Moon Shine Area.Responsible for the deployment of Lean training based on Jabil Corporate practices.

Burnsville, Minnesota, USA

Multi functional responsibility with global responsibility for all environmental compliance initiatives and managing engineering and quality related projects. Successfully project managed the implementation of the Quality Management System (QMS) for ISO 9001:2000, ISO9001:2008 and AS 9100:2004 Rev B (Aerospace) certification for Corporate Headquarters in.

Hong Kong

Responsible for standardising quality assurance methodologies across all three divisions comprising of twelve individual manufacturing sites.Responsible for ISO 9001:2000, QS-9000, implementation of ISO/TS 16949:2002 and ISO 14001.Outline and implement strategies to achieve compliance with the Restriction of Hazardous Substances in Electrical and.

Kidderminster, England

Responsible for the evaluation and proposal of a new Surface Mount Assembly facility in the Kidderminster manufacturing site that meets the manufacturing process requirements in compliance with the legislation for the Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive (2002/95/EC) by 1st July 2006. Evaluate and.

Birmingham, England

Supervised component kitting and provided Process Engineering supportResponsible for standardising the nomenclature and parts data libraries for all component variants used in Fujitsu’s PCB assembly plant utilising PanaPro IPO to optimise programmes for Panasonic MSF. Line configurations based on DEK screen printers, Fuji CP4, CP642/643 and Panasonic.

Isle Of White, England

Identified production losses within the surface mount area and implemented corrective actions to optimise production throughput. Introduced metrics including total time lost, breakdown, number of placements, attrition and O.E.E. (Overall Equipment Effectiveness)Introduced SMED principles to allow quick changeover techniques using quick-change carts..

Birmingham, United Kingdom

Responsible for surface mount optimisation and standardising nomenclature and parts data libraries for all component variants used in Fujitsu’s PCB assembly plant utilising PanaPro IPO to optimise programmes for Panasonic MSF. Line configurations based on DEK screen printers, Fuji CP4, CP642/643 and Panasonic MSF.Responsible for running NPI’s, debugging.

Cavite, Philippines

Directed Quality Assurance in a multi-site operation based in Philippines, China and USA. Operationally responsible for Quality Engineering, In-Process Quality Control, NPI Quality Engineering and Quality Control, SPC Engineering, Quality Systems and Product Safety. Functionally responsible for the rest of manufacturing.Implemented culture change in Asia.

Abingdon, Oxford, England

• Directed engineering teams to effectively manage Technology Transfer, New Product Introduction, Automated Manufacturing, Sub-Contract and Systems Management.
• Full CAPEX responsibility including generation and control of $22 million budget. Part of team responsible for generating Business Continuity Plan.
• Responsible for generating Technology Transfer and Vendor Assessment methodologies.
• Developed proposals for clean room compliant, automated robotic chip prep line comprising of Hirata Cartesian/SCARA robots, die shuttles, resist strip and clean, Automatic Optical Inspection and anti-reflective coating.
• Facilitated bench marking exercises on wafer and die handling equipment in Japan and USA.
• Evaluated and procured batch and in-line VFM (Variable Frequency Microwave) systems reducing typical die attach cure times by factor of X10.

Redditch, England

• Reported to the Technical Director and tasked with analysing surface mount efficiencies to ensure manufacturing forecast achievable.
• Reconfigured Panasonic surface mount line operating fixed feeder set up to quick changeover format operating in Prep Mode. Utilising PanaPRO IPO (Interactive Process Optimisation) and PanaPRO CVT (Component.
• Set up new feeder Kanban to facilitate quick changeover while the Panasert surface mount equipment was operated in Prep Mode.
• Project managed specification, negotiation, purchase, factory floor layout and installation for new Panasonic MVIIVb as part of line reconfiguration enabling implementation of a number of new products introductions.
• Utilising 8D problem solving methodology, introduced SPC, regular flux titrations, scatter charts and PM schedules resulting in reduction of wave soldering defect rates from 6,000 ppm to 500 ppm.

Kidsgrove, England

• Managed Operations of DELL Strategic Business Unit to achieve EBIT and Customer On Time Delivery with $180 million turnover and $15 million added value.
• Production of DELL workstations and server products based on four single sided and one double sided surface mount lines. Lines comprised of three Panasonic MVIIF/MVIIV chip shooters and one MPAVII i/c placement system.
• Responsible for manufacturing team of 250 with six direct reports operating within unionised work environment.
• Managed New Product Introduction of three new server boards with associated risers.
• Part of team evaluating odd form component insertion, primarily PMJ Odd Form Insertion System, based on a standard Cartesian set up, utilising the ADEPT controller and Universal Instruments Odd Form system based on the.

Aylesbury, England

• Responsible for all aspects of Production including Planning, Quality Control, Process Engineering and Test.
• Restructured personnel and re-engineered factory layout implementing 5S and Total Productive Maintenance.
• Achieved improved material handling utilising Kanban principles and working closely with suppliers resulting in improved deliveries and piece part quality.
• Rebalanced production cells and improved workstation ergonomics improving production output of Mast Head Amplifiers and Boosters for use within the telecommunications industry. Introduced enabling metrics.

Newtown, Wales

• Responsible for managing, mentoring and motivating engineering teams totalling 73 engineers including Process Engineering, Industrial Engineering, Production Engineering, Test, Facilities and Maintenance Engineering.
• Full responsibility for $9 million CAPEX and Repairs/Renewals budgets including control and reporting of budgets at monthly at Operations Review Meeting.
• Project managed erection of new manufacturing site incorporating PCB Assembly, Materials Sequencing Unit and re-engineered the existing Final Assembly Plant including elevated soaks, pre-soaks, new OMRON PLC based.
• Working in a Continuous Improvement, team orientated environment, introduced TPM, 5S, OEE, Poke Yoke and SMED Lean principles.
• Reconfigured all surface mount lines from fixed feeder set up to custom feeder set up in line with SMED principles including installation of PanaPRO IPO (Interactive Process Optimisation) and PanaPRO CVT (Component.
• Managed projects including the design and installation of a Finished Goods Automatic Search and Retrieve System including two Component Stores and Bulk Store, Pick To Light assisted kitting lines, electronic Kanban.

Ipswich, England

• Set up new UK based subsidiary company providing sales, marketing and technical support for Automatic Optical Inspection systems for populated PCBA’s.
• Lectured at seminars around the world and attended exhibitions such as NEPCON West, Productronica etc.
• Visited customers around the world to define and implement complex manufacturing solutions, provide system installation, training and programming utilising off-line CAD data.
• Conducted customer demonstrations in the UK or US demonstration centres or at customer sites.
• Provided consulting service for configuring and optimizing PCBA manufacturing processes at IBM Scotland; Ericsson, UK; Matra Ericsson Telecommunique, France; Nokia, Finland; DEC Ireland; Apple, Ireland and ICL England.
• Provided support in developing and installing the first semi-automated light guided repair cell utilizing a Logpoint light guided assembly cell networked to the AOI. Defect component coordinate data was downloaded to.

Felixstowe, England

• Responsible for managing the Industrial Engineering team.
• Set up dedicated Pre-Production facility including dedicated SMT (Surface Mount Technology) Line, an auto insertion line including DIP, Axial and Radial Insertion and Final Assembly and Test cells.
• Established effective methodologies for New Product Introduction programme within high volume manufacturer of solid-state meters.
• Project managed the design, development and installation of an auto-routed final assembly transfer system that included twelve Hirata Cartesian and SCARA robot cells. Included palletised server and auto programme.
• Introduced new SMD assembly line including in-line robotic DIP inserter, Universal Ultraplace chip shooter, Universal OmniB for placement of fine pitch QFP’s, PLCC’s and SOIC’s and Automatic Board Handler enabling.
• Conducted evaluations of Automatic Optical Inspection (AOI) systems and laser inspection systems for PCBA’s.

Colchester, England

• Responsible for production and prototype testing and debugging of high-speed SMD (Surface Mount Device) chip shooters and flexible pick and place systems for the PCB manufacturing industry.
• Responsible for performing Quality Assurance testing of surface mount assembly equipment, die-sort loaders, die-bonders, bond strength testers and Multicore Universal Solderabilty Testers (MUST).
• Performed customer demonstrations, customer programming and maintenance training
• Performed system installations and integration in the UK and USA.
• Provided equipment service and programming support.

Master Of Business Administration (M.B.A.)

Higher National Diploma, Systems Engineering